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− | The ''' | + | The '''22 nm lithography process''' is a [[technology node|full node]] semiconductor manufacturing process following the [[28 nm lithography process|28 nm process]] stopgap. The term "22 nm" is simply a commercial name for a generation of a certain size and its technology, as opposed to gate length or half pitch. Commercial [[integrated circuit]] manufacturing using 22 nm process began in 2008 for memory and 2012 for [[MPU]]s. This technology was replaced by with [[20 nm lithography process|20 nm process]] (HN) in 2014 and [[16 nm lithography process|16 nm process]] (FN) in late 2015. |
== Industry == | == Industry == |