Difference between revisions of "1958" - WikiChip

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Difference between revisions of "1958"

Latest revision as of 19:40, 27 December 2022

1958
Unix Time	-378691200 - -347155201
Years
1950 1951 1952 1953 1954 1955 1956 1957 1958 1959
1957 1959

In 1958:

October 23: William Shockley files a patent application for the through-silicon via (TSV), then called "deep pits" (U.S. Patent 3,044,909).

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