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| {{lithography processes}} | | {{lithography processes}} |
− | The '''180 nanometer (180 nm) lithography process''' is a [[technology node|full node]] semiconductor manufacturing process following the [[220 nm lithography process|220 nm process]] stopgap. Commercial [[integrated circuit]] manufacturing using 180 nm process began in late 1998. This technology was replaced by with [[150 nm lithography process|150 nm process]] (HN) in 2000 and [[130 nm lithography process|130 nm process]] (FN) in 2001. | + | The '''180 nm lithography process''' is a [[technology node|full node]] semiconductor manufacturing process following the [[220 nm lithography process|220 nm process]] stopgap. Commercial [[integrated circuit]] manufacturing using 180 nm process began in late 1998. This technology was replaced by with [[150 nm lithography process|150 nm process]] (HN) in 2000 and [[130 nm lithography process|130 nm process]] (FN) in 2001. |
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| == Industry == | | == Industry == |
| The 180 nm process was first to use Cu metalization as a replacement for Al for interconnects. | | The 180 nm process was first to use Cu metalization as a replacement for Al for interconnects. |
− | {{scrolling table/top|style=text-align: right; | first=Fab
| + | === Intel === |
− | |Process Name
| + | * 200mm (8-inch) wafers |
− | |1st Production
| + | {| class="wikitable" |
− | |Wafer
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− | |Metal Layers
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− | |
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− | |Contacted Gate Pitch
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− | |Interconnect Pitch (M1P)
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− | |SRAM bit cell
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− | }}
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− | {{scrolling table/mid}}
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| |- | | |- |
− | ! colspan="2" | [[Intel]] !! colspan="2" | [[Fujitsu]] !! colspan="2" | [[TSMC]] !! colspan="2" | [[Motorola]] !! colspan="2" | [[IBM]] !! colspan="2" | [[NEC]] !! colspan="2" | [[Samsung]] !! colspan="2" | [[TI]] !! colspan="2" | [[TI]] !! colspan="2" | [[AMD]]
| + | | || Measurement || Scaling from [[250 nm]] |
− | |- style="text-align: center;"
| |
− | | colspan="2" | P858 || colspan="2" | CS-80 || colspan="2" | || colspan="2" | HiPerMOS 6 || colspan="2" | CMOS-8S3 || colspan="2" | || colspan="2" | || colspan="2" | C07a || colspan="2" | GS30 || colspan="2" |
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− | |- style="text-align: center;"
| |
− | | colspan="2" | 1999 || colspan="2" | 2000 || colspan="2" | 2000 || colspan="2" | 2000 || colspan="2" | 1998 || colspan="2" | 2000 || colspan="2" | 2001 || colspan="2" | || colspan="2" | 2000 || colspan="2" | 1999
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− | |- style="text-align: center;"
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− | | colspan="22" | 200 mm
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− | |- style="text-align: center;"
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− | | colspan="2" | 7 || colspan="2" | 6 || colspan="2" | 6 || colspan="2" | 7 || colspan="2" | 7 || colspan="2" | || colspan="2" | || colspan="2" | 6 || colspan="2" | 5 || colspan="2" |
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| |- | | |- |
− | ! Value !! [[250 nm]] Δ !! Value !! [[250 nm]] Δ !! Value !! [[250 nm]] Δ !! Value !! [[220 nm]] Δ !! Value !! [[250 nm]] Δ !! Value !! [[250 nm]] Δ !! Value !! [[250 nm]] Δ !! Value !! [[250 nm]] Δ !! Value !! [[250 nm]] Δ !! Value !! [[250 nm]] Δ
| + | | Contacted Gate Pitch || 480 nm || |
| |- | | |- |
− | | 480 nm || 0.96x || ? nm || ?x || 430 nm || 0.67x || ? nm || ?x || 420 nm || ?x || ? nm || ?x || ? nm || ?x || ? nm || ?x || ? nm || ?x || ? nm || ?x | + | | Interconnect Pitch (M1P) || 500 nm || |
| |- | | |- |
− | | 500 nm || 0.82x || ? nm || ?x || 460 nm || 0.72x || ? nm || ?x || 440 nm || ?x || ? nm || ?x || ? nm || ?x || ? nm || ?x || ? nm || ?x || ? nm || ?x | + | | [[SRAM]] bit cell || 5.59 µm<sup>2</sup> || .56x |
− | |-
| + | |} |
− | | 5.59 µm<sup>2</sup> || 0.54x || 4.18 µm<sup>2</sup> || ?x || 4.65 µm<sup>2</sup> || 0.62x || ? µm<sup>2</sup> || ?x || ? µm<sup>2</sup> || ?x || ? µm<sup>2</sup> || ?x || ? µm<sup>2</sup> || ?x || ? µm<sup>2</sup> || ?x || ? µm<sup>2</sup> || ?x || ? µm<sup>2</sup> || ?x | |
− | {{scrolling table/end}}
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| | | |
| == 180 nm Microprocessors== | | == 180 nm Microprocessors== |
− | * AMD
| + | {{expand list}} |
− | {{collist | + | |
− | | count = 4
| + | == 180 nm System on Chips== |
− | |
| |
− | * {{amd|K6-III}}
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− | * {{amd|K6-2+}}
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− | * {{amd|K6-III+}}
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− | * {{amd|Athlon}}
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− | * {{amd|Athlon 4}}
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− | * {{amd|Athlon MP}}
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− | * {{amd|Athlon XP}}
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− | * {{amd|Duron}}
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− | }}
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− | * Cyrix
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− | ** {{cyrix|Cyrix III}}
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− | * DEC
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− | ** {{decc|Alpha 21264C}}
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− | ** {{decc|Alpha 21364}}
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− | ** {{decc|Alpha 21264B}}
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− | * HAL (Fujitsu)
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− | ** {{hal|SPARC64 GP}}
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− | * HiSilicon
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− | ** {{hisil|K3}}
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− | * HP
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− | ** {{hp|PA-8700}}
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− | ** {{hp|PA-8700+}}
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− | * IBM
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− | ** {{ibm|RS64 IV}}
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− | ** {{ibm|z900}}
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− | * Intel
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− | ** {{intel|Itanium}}
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− | ** {{intel|Itanium 2}}
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− | ** {{intel|Mobile Pentium III}}
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− | ** {{intel|Pentium 4}}
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− | * Loongson
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− | ** {{loongson|Godson 2}}
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− | * Motorola
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− | ** {{motorola|PowerPC}}
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− | * Qualcomm
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− | ** {{qualcomm|MSM6xxx}}
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− | * Rapport
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− | ** {{rapport|Kilocore}} ({{cmu|PipeRench}})
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− | * Sun
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− | ** {{sun|UltraSPARC IIi}}
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− | ** {{sun|UltraSPARC IIe}}
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− | * STMicroelectronics
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− | ** STM32 F0
| |
| {{expand list}} | | {{expand list}} |
| | | |
| == 180 nm Microarchitectures == | | == 180 nm Microarchitectures == |
− | * AMD
| |
− | ** {{amd|K6-III|l=arch}}
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− | ** {{amd|K7|l=arch}}
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− | * ARM
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− | ** {{armh|ARM7|l=arch}}
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− | * IBM
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− | ** {{ibm|z900|l=arch}}
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− | * Intel
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− | ** {{intel|NetBurst|l=arch}}
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| {{expand list}} | | {{expand list}} |
− |
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− | [[category:lithography]]
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