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Editing 10 nm lithography process
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At the advanced 10nm process, there are only 3 semiconductor foundries with such manufacturing capabilities: [[Intel]], [[Samsung]], and [[TSMC]]. | At the advanced 10nm process, there are only 3 semiconductor foundries with such manufacturing capabilities: [[Intel]], [[Samsung]], and [[TSMC]]. | ||
− | Due to marketing names, geometries vary greatly between leading | + | Due to marketing names, geometries vary greatly between leading manufactures. Although both TSMC and Samsung's 10nm processes are slightly denser than Intel's 14nm in raw logic density, they are far closer to Intel's 14nm than they are to Intel's 10nm (e.g., Samsung's metal pitch just 1 nanometer shorter than Intel's 14nm). |
{{10 nm comp | {{10 nm comp | ||
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Intel will leverage their initial 10nm process for their {{intel|Cannon Lake|l=arch}}-based microprocessors which are used exclusively for mobile. They will then utilize their second generation, "10nm+" process, for {{intel|Ice Lake|l=arch}}-based processors which will be used for the mainstream and server platform. | Intel will leverage their initial 10nm process for their {{intel|Cannon Lake|l=arch}}-based microprocessors which are used exclusively for mobile. They will then utilize their second generation, "10nm+" process, for {{intel|Ice Lake|l=arch}}-based processors which will be used for the mainstream and server platform. | ||
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* [https://fuse.wikichip.org/news/525/iedm-2017-isscc-2018-intels-10nm-switching-to-cobalt-interconnects/ In-depth analysis for Intel's 10nm process.] | * [https://fuse.wikichip.org/news/525/iedm-2017-isscc-2018-intels-10nm-switching-to-cobalt-interconnects/ In-depth analysis for Intel's 10nm process.] | ||
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*** <s>{{intel|Knights Hill|l=arch}}</s> | *** <s>{{intel|Knights Hill|l=arch}}</s> | ||
** GPU | ** GPU | ||
− | *** {{intel| | + | *** {{intel|Artic Sound|l=arch}} |
*** {{intel|Jupiter Sound|l=arch}} | *** {{intel|Jupiter Sound|l=arch}} | ||
* Qualcomm | * Qualcomm |