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Editing 10 nm lithography process
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| process 2 fin pitch = 36 nm | | process 2 fin pitch = 36 nm | ||
| process 2 fin pitch Δ = 0.75x | | process 2 fin pitch Δ = 0.75x | ||
− | | process 2 fin width = | + | | process 2 fin width = |
| process 2 fin width Δ = | | process 2 fin width Δ = | ||
− | | process 2 fin height = | + | | process 2 fin height = |
− | | process 2 fin height Δ = | + | | process 2 fin height Δ = |
| process 2 gate len = | | process 2 gate len = | ||
| process 2 gate len Δ = | | process 2 gate len Δ = | ||
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=== Samsung === | === Samsung === | ||
[[File:ss 14-10nm.png|right|500px]] | [[File:ss 14-10nm.png|right|500px]] | ||
− | Samsung demonstrated their 128 | + | Samsung demonstrated their 128 Mebibit [[SRAM]] wafer from their 10nm FinFET process. Samsung, which unlike Intel uses LELELE (litho-etch-litho-etch-litho-etch), ramped up mass production in May of 2017. ChipWorks/TechInsight measured the CPP/MMP which came a little short of the Common Platform Alliance Paper which was presented in 2016, at 68 nm contacted gate pitch, 51 nm metal pitch, dual-depth [[shallow trench isolation]] (STI), and had single dummy gate. |
{| class="collapsible collapsed wikitable" | {| class="collapsible collapsed wikitable" | ||
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=== TSMC === | === TSMC === | ||
− | TSMC reported a poly pitch of 64 nm with a metal pitch 42 nm. TechInsight measured them at 66 nm and 44 nm respectively. 10FF is the second process to use FinFET, and is the Industry's first use of Quad-Patterning. This allows for a full node shrink, enabling a 2X increase in logic density compared to their 16nm process. | + | TSMC reported a poly pitch of 64 nm with a metal pitch 42 nm. TechInsight measured them at 66 nm and 44 nm respectively. 10FF is the second process to use FinFET, and is the Industry's first use of Quad-Patterning. This allows for a full node shrink, enabling a 2X increase in logic density compared to their 16nm process. TSMC claims the 10FF process will have 15% higher performance while consuming 35% less power. |
{{clear}} | {{clear}} | ||
[[File:10nm tsmc.jpeg|200px]] | [[File:10nm tsmc.jpeg|200px]] | ||
== 10 nm Microprocessors== | == 10 nm Microprocessors== | ||
− | + | * Apple | |
− | {{ | + | ** {{apple|ax|A10X}} |
− | + | ** {{apple|A11 Bionic}} | |
− | + | * HiSilicon | |
− | + | ** {{hisil|Kirin}} | |
− | + | * MediaTek | |
− | + | ** {{mediatek|Helio}} | |
− | + | * Qualcomm | |
− | + | ** {{qualcomm|Snapdragon 800}} | |
− | + | ** {{qualcomm|Centriq}} | |
− | + | * Xiaomi | |
− | + | ** {{xiaomi|Surge}} | |
− | }} | + | * Samsung |
+ | ** {{samsung|Exynos 9}} | ||
{{expand list}} | {{expand list}} | ||
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*** {{intel|Ice Lake (client)|l=arch}} | *** {{intel|Ice Lake (client)|l=arch}} | ||
*** {{intel|Tiger Lake|l=arch}} | *** {{intel|Tiger Lake|l=arch}} | ||
− | + | ** {{intel|Alder Lake|l=arch}} | |
*** {{intel|Ice Lake (server)|l=arch}} | *** {{intel|Ice Lake (server)|l=arch}} | ||
*** {{intel|Sapphire Rapids|l=arch}} | *** {{intel|Sapphire Rapids|l=arch}} | ||
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*** <s>{{intel|Knights Hill|l=arch}}</s> | *** <s>{{intel|Knights Hill|l=arch}}</s> | ||
** GPU | ** GPU | ||
− | *** {{intel| | + | *** {{intel|Artic Sound|l=arch}} |
*** {{intel|Jupiter Sound|l=arch}} | *** {{intel|Jupiter Sound|l=arch}} | ||
* Qualcomm | * Qualcomm |