...Socket Actuation Mechanism. The heatsink, the CPU in a carrier frame, the SAM, housing, and backplate are separately orderable parts. The latter three ar ...required to deflect thousands of springs at once. According to AMD the SP3 SAM must exert a minimum force of 95 kg-f (932 N) to ensure proper ma

...tuation Mechanism for toolless installation of the CPU. The heatsink, CPU, SAM, housing, and backplate are separately orderable parts, the latter three mo ...ke electrical contact with flat pads on the bottom of the CPU package. The SAM creates the Z-axis compression load between the CPU package and the housing