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Ryzen 3 PRO 4350G
General Info
Designer	AMD
Manufacturer	TSMC
Model Number	PRO 4350G
Part Number	100-000000148, 100-100000148MPK
Market	Desktop
Introduction	July 21, 2020 (launched)
Shop	Amazon
General Specs
Family	Ryzen 3
Series	4000
Locked	Yes
Frequency	3,800 MHz
Turbo Frequency	4,000 MHz
Clock multiplier	38
Microarchitecture
ISA	x86-64 (x86)
Microarchitecture	Zen 2
Core Name	Renoir
Core Family	23
Core Model	96
Core Stepping	A1
Process	7 nm
Transistors	9,800,000,000
Technology	CMOS
Die	156 mm²
Word Size	64 bit
Cores	4
Threads	8
Max Memory	128 GiB
Multiprocessing
Max SMP	1-Way (Uniprocessor)
Electrical
TDP	65 W
cTDP down	45 W
Tcase	0 °C – 95 °C
Packaging
Package	OPGA-1331
Package Type	Organic Micro Pin Grid Array
Dimension	40 mm × 40 mm
Pitch	1 mm
Contacts	1331
Socket	Socket AM4

Ryzen 3 PRO 4350G is a 64-bit quad-core entry-level performance x86 desktop microprocessor introduced by AMD in mid-2020. Fabricated on a TSMC 7-nanometer process and based on AMD's Zen 2 microarchitecture, the PRO 4350G operates at a base frequency of 3.8 GHz with a TDP of 65 W and a boost frequency of up to 4.0 GHz. This APU supports a configurable TDP-down of 45 W, up to 128 GiB of dual-channel DDR4-3200 memory, and integrates a Radeon Vega 6 GPU operating at up to 1.7 GHz.

Compared to its mainstream counterparts, the PRO 4350G includes a set of enterprise-oriented features such as Memory Guard, image stability, software stability, and manageability support.

The multipack SKU of this model includes a Wraith Stealth cooler.

Cache

Main article: Zen 2 § Cache

[Edit/Modify Cache Info]

Cache Organization Cache is a hardware component containing a relatively small and extremely fast memory designed to speed up the performance of a CPU by preparing ahead of time the data it needs to read from a relatively slower medium such as main memory. The organization and amount of cache can have a large impact on the performance, power consumption, die size, and consequently cost of the IC. Cache is specified by its size, number of sets, associativity, block size, sub-block size, and fetch and write-back policies. Note: All units are in kibibytes and mebibytes.

L1$ 256 KiB 262,144 B 0.25 MiB L1I$ 128 KiB 131,072 B 0.125 MiB 4x32 KiB 8-way set associative   L1D$ 128 KiB 131,072 B 0.125 MiB 4x32 KiB 8-way set associative write-back L2$ 2 MiB 2,048 KiB 2,097,152 B 0.00195 GiB     4x512 KiB 8-way set associative write-back L3$ 4 MiB 4,096 KiB 4,194,304 B 0.00391 GiB     1x4 MiB 16-way set associative write-back

Memory controller

[Edit/Modify Memory Info]

	Integrated Memory Controller
	Max Type DDR4-3200 Max Mem 128 GiB Controllers 2 Channels 2 Max Bandwidth 47.68 GiB/s 48,824.32 MiB/s 51.196 GB/s 51,196.01 MB/s 0.0466 TiB/s 0.0512 TB/s Bandwidth Single 23.84 GiB/s Double 47.68 GiB/s

Expansions

In addition to the x4 lanes that are reserved for the chipset, the Ryzen 3 PRO 4350G has x16 for a discrete graphics processor and x4 for storage (NVMe or 2 ports SATA Express).

[Edit/Modify Expansions Info]

	Expansion Options
PCIe Revision: 3.0 Max Lanes: 20 Configuration: 1x16+x4, 2x8+x4

Graphics

[Edit/Modify IGP Info]

	Integrated Graphics Information
	GPU Radeon Vega 6 Designer AMD Execution Units 6 Max Displays 4 Unified Shaders 384 Burst Frequency 1,700 MHz 1.7 GHz 1,700,000 KHz Output DP, HDMI Max Resolution DP 4K @60 Hz Standards DirectX 12 DP 1.4 HDMI 2.1

[Edit] Zen 2 with Radeon Vega Hardware Accelerated Video Capabilities
Codec	Encode	Decode
VP9 8bpc/10bpc		1080p240 4K 60 FPS
MPEG-2 (H.262) 8b	1080p240 4K 60 FPS	1080p480 4K 120 FPS
HEVC (H.265) 8bpc/10bpc	1080p240 4K 60 FPS	1080p240 4K 60 FPS

Features

[Edit/Modify Supported Features]

Supported x86 Extensions & Processor Features

MMX MMX Extension EMMX Extended MMX Extension SSE Streaming SIMD Extensions SSE2 Streaming SIMD Extensions 2 SSE3 Streaming SIMD Extensions 3 SSSE3 Supplemental SSE3 SSE4.1 Streaming SIMD Extensions 4.1 SSE4.2 Streaming SIMD Extensions 4.2 SSE4a Streaming SIMD Extensions 4a AVX Advanced Vector Extensions AVX2 Advanced Vector Extensions 2 ABM Advanced Bit Manipulation BMI1 Bit Manipulation Instruction Set 1 BMI2 Bit Manipulation Instruction Set 2 FMA3 3-Operand Fused-Multiply-Add AES AES Encryption Instructions RdRand Hardware RNG SHA SHA Extensions ADX Multi-Precision Add-Carry CLMUL Carry-less Multiplication Extension F16C 16-bit Floating Point Conversion x86-16 16-bit x86 x86-32 32-bit x86 x86-64 64-bit x86 Real Real Mode Protected Protected Mode SMM System Management Mode FPU Integrated x87 FPU NX No-eXecute SMT Simultaneous Multithreading AMD-Vi AMD-Vi (I/O MMU virtualization) AMD-V AMD Virtualization TSME Transparent SME SenseMI SenseMI Technology

Die

Main article: Zen 2 § Die

Renoir microprocessors are fabricated on TSMC's 7-nanometer process. This SoC integrates 9.8 billion transistors on a single 156 mm² monolithic die which includes both the Zen 2 CPU cores along with the Vega GPU and various other additional components.

• 7-nanometer process (N7)
• 9,800,000,000 transistors
• 156 mm² die size

References

• "AMD Ryzen™ 3 PRO 4350G". AMD.com. Retrieved May 2021.