Packaging

Technologies

Wire bonding TCI TSV TGV F2F FC

Concepts

COB CSP PiP SiP PoP

Single-Row

SiP

Dual-Row

DIP DFN SOIC TSOP ZIP

Quad-Row

QFN

Grid Array

BGA LGA PGA

2.5D IC

2.5D IC Interposer Embedded Interposer Embedded Bridge CoWoS EMIB

3D IC

3D IC Foveros WoW SoIC

Chip-on-Wafer-on-Substrate (CoWoS) is a two-point-five dimensional integrated circuit (2.5D IC) through-silicon via (TSV) interposer-based packaging technology designed by TSMC.

Overview

CoWoS is a wafer-level multi-chip packaging technology that incorporates multiple chips side-by-side on a silicon interposer in order to achieve better interconnect density and performance. The chiplets are bonded through micro-bumps on a silicon interposer forming a chip-on-wafer (CoW). The CoW is then subsequently thinned such that the TSV perforations are exposed. This is followed C4 bumps formation and singulation. A CoWoS package is completed thrugh bonding to a package substrate.