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File:45nm wafer photo 2.JPG
Revision as of 09:13, 9 February 2017 by ChipIt (talk | contribs) (Intel engineer holding 300 mm wafer with 45 nm shuttle test chips)
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Summary

Intel engineer holding 300 mm wafer with 45 nm shuttle test chips

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Metadata

This file contains additional information, probably added from the digital camera or scanner used to create or digitize it. If the file has been modified from its original state, some details may not fully reflect the modified file.
Camera manufacturer NIKON CORPORATION
Camera model NIKON D1X
Exposure time 1/180 sec (0.0055555555555556)
F Number f/6.7
Date and time of data generation 17:59, 11 January 2006
Lens focal length 35 mm
Orientation Normal
Horizontal resolution 300 dpi
Vertical resolution 300 dpi
Software used Adobe Photoshop CS2 Windows
File change date and time 17:16, 11 January 2006
Y and C positioning Co-sited
Exposure Program Normal program
Exif version 2.1
Date and time of digitizing 17:59, 11 January 2006
Meaning of each component
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Image compression mode 4
APEX exposure bias 0
Maximum land aperture 4.3 APEX (f/4.44)
Metering mode Pattern
DateTime subseconds 49
DateTimeOriginal subseconds 49
DateTimeDigitized subseconds 49
Supported Flashpix version 0,100
Color space sRGB
Sensing method One-chip color area sensor
File source Digital still camera
Scene type A directly photographed image
GPS tag version 0.0.0.2
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