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Helio P10 (MT6755) - MediaTek
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Revision as of 04:05, 10 April 2018 by 31.175.197.136 (talk) (Neffos X1 - correction)

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Helio P10
General Info
DesignerMediaTek,
ARM Holdings
ManufacturerTSMC
Model NumberP10
Part NumberMT6755,
MTK6755
MarketMobile, Embedded
IntroductionJune 1, 2015 (announced)
January, 2016 (launched)
General Specs
FamilyHelio
SeriesHelio P
Frequency2,000 MHz, 1,200 MHz
Bus typeAMBA 4 AXI
Microarchitecture
ISAARMv8 (ARM)
MicroarchitectureCortex-A53
Core NameCortex-A53
Process28 nm
TechnologyCMOS
Word Size64 bit
Cores8
Threads8
Max Memory4 GiB
Multiprocessing
Max SMP1-Way (Uniprocessor)
Electrical
Vcore1 V
VI/O1.8 V, 2.8 V, 3.3 V
OP Temperature-20 °C – 80 °C
Tjunction – 125 °C
Tstorage0 °C – 125 °C

Helio P10 (MT6755) is a 64-bit octa-core ARM LTE system on a chip designed by MediaTek and introduced in early-2016. This SoC, which incorporates eight Cortex-A53 cores and is manufactured on TSMC's 28 nm process, operates at up to 2 GHz and supports up to 4 GiB of single-channel LPDDR3-1866 memory. This chip incorporates the Mali-T880 IGP operating at 700 MHz. This SoC has a modem supporting LTE User Equipment (UE) category 6.

This processor is made of two independent clusters of Cortex-A53 with four cores each linked together via a CCI-400. The two clusters have a maximum operating frequency of 2 GHz and 1.2 GHz respectively.

Cache

Main article: Cortex-A53 § Cache

[Edit/Modify Cache Info]

hierarchy icon.svg
Cache Organization
Cache is a hardware component containing a relatively small and extremely fast memory designed to speed up the performance of a CPU by preparing ahead of time the data it needs to read from a relatively slower medium such as main memory.

The organization and amount of cache can have a large impact on the performance, power consumption, die size, and consequently cost of the IC.

Cache is specified by its size, number of sets, associativity, block size, sub-block size, and fetch and write-back policies.

Note: All units are in kibibytes and mebibytes.
L1$512 KiB
524,288 B
0.5 MiB
L1I$256 KiB
262,144 B
0.25 MiB
8x32 KiB2-way set associative 
L1D$256 KiB
262,144 B
0.25 MiB
8x32 KiB4-way set associative 
L2$2 MiB
2,048 KiB
2,097,152 B
0.00195 GiB
  2x1 MiB16-way set associative 

Memory controller

[Edit/Modify Memory Info]

ram icons.svg
Integrated Memory Controller
Max TypeLPDDR3-1866
Supports ECCNo
Max Mem4 GiB
Controllers1
Channels1
Width32 bit
Max Bandwidth6.95 GiB/s
7,116.8 MiB/s
7.463 GB/s
7,462.506 MB/s
0.00679 TiB/s
0.00746 TB/s
Bandwidth
Single 6.95 GiB/s

Expansions

[Edit/Modify Expansions Info]

ide icon.svg
Expansion Options
USB
Revision2.0, 3.0
Ports8
UART
GP I/OYes


Graphics

[Edit/Modify IGP Info]

screen icon.svg
Integrated Graphics Information
GPUMali-T860
DesignerARM Holdings
Execution Units2
Frequency700 MHz
0.7 GHz
700,000 KHz
OutputDSI
Max Resolution
DSI1920x1080
Standards
Direct3D11.2
OpenGL3.2
OpenCL1.2
OpenGL ES3.2
OpenVG1.1
Vulkan1.0

Wireless

Antu network-wireless-connected-100.svgWireless Communications
Cellular
2G
CSD Yes
GSM Yes
GPRS Yes
EDGE Yes
3G
UMTS
TD-SCDMAYes
DC-HSDPAYes
HSUPAYes
4G
LTE Advanced
E-UTRANYes
UE Cat6

Image

  • Integrated image signal processor supports 21 MP
  • Supports image stabilization
  • Supports video stabilization
  • Supports noise reduction
  • Supports lens shading correction
  • Supports AE/AWB/AF
  • Supports edge enhancement
  • Supports face detection and visual tracking
  • Hardware JPEG encoder

Video

  • HEVC decoder 4k2k @ 30fps
  • H.264 decoder (30fps/40Mbps)
  • Sorenson H.263/H.263 decoder (1080p @ 60fps/40Mbps)
  • MPEG-4 SP/ASP decoder (1080p @ 60fps/40Mbps)
  • DIVX4/DIVX5/DIVX6/DIVX HD/XVID decoder (1080p @ 60fps/40Mbps)
  • VP8 / VC-1 decoders
  • MPEG-4 / H.263 / H.264 / HEVC encoders

Audio

  • Audio content sampling rates 8kHz to 192kHz
  • Audio content sampling format 8-bit/16-bit/24-bit Mono/Stereo
  • I2S, PCM
  • Encode: AMR-NB, AMR-WB, AAC, OGG, ADPCM
  • Decode: WAV, MP3, MP2, AAC, AMR-NB, AMR-WB, MIDI, Vorbis, APE, AAC-plus v1, AAC-plus v2, FLAC, WMA, ADPCM
  • 7.1 channel MHL output

Utilizing devices

  • Alcatel Flash Plus 2
  • Archos Diamond 2 Plus
  • Blackview BV6000
  • Blackview R7
  • BLU Pure XR
  • BLU Vivo 6
  • Elephone M3
  • Elephone P9000
  • Gionee M6 Plus
  • Gionee S8
  • HTC Desire 10 Pro
  • HTC U Play
  • HTC One A9s
  • iMan Victor
  • Lenovo K5 Note
  • Meizu M3E
  • Meizu M3 Max
  • Meizu M3 Note
  • Meizu U20
  • Nomu S30
  • Oppo F1 Plus
  • Oppo R9
  • Sony Xperia XA
  • Sony Xperia XA Ultra
  • TCL Flash Plus 2
  • TP-Link Neffos X1
  • TP-Link Neffos X1 Max
  • Ulefone Future
  • UMI Max
  • UMI Plus
  • UMI Super
  • Wolder WIAM #65
  • ZTE Nubia N1

This list is incomplete; you can help by expanding it.

Retrieved from "https://en.wikichip.org/w/index.php?title=mediatek/helio/mt6755&oldid=77174"
Facts about "Helio P10 (MT6755) - MediaTek"
RDF feed
base frequency2,000 MHz (2 GHz, 2,000,000 kHz) + and 1,200 MHz (1.2 GHz, 1,200,000 kHz) +
bus typeAMBA 4 AXI +
core count8 +
core nameCortex-A53 +
core voltage1 V (10 dV, 100 cV, 1,000 mV) +
designerMediaTek + and ARM Holdings +
familyHelio +
first announcedJune 1, 2015 +
first launchedJanuary 2016 +
full page namemediatek/helio/mt6755 +
has 2g supporttrue +
has 3g supporttrue +
has 4g supporttrue +
has csd supporttrue +
has dc-hsdpa supporttrue +
has e-utran supporttrue +
has ecc memory supportfalse +
has edge supporttrue +
has gprs supporttrue +
has gsm supporttrue +
has hsupa supporttrue +
has lte advanced supporttrue +
has td-scdma supporttrue +
has umts supporttrue +
instance ofmicroprocessor +
integrated gpuMali-T860 +
integrated gpu base frequency700 MHz (0.7 GHz, 700,000 KHz) +
integrated gpu designerARM Holdings +
integrated gpu execution units2 +
io voltage1.8 V (18 dV, 180 cV, 1,800 mV) +, 2.8 V (28 dV, 280 cV, 2,800 mV) + and 3.3 V (33 dV, 330 cV, 3,300 mV) +
isaARMv8 +
isa familyARM +
l1$ size512 KiB (524,288 B, 0.5 MiB) +
l1d$ description4-way set associative +
l1d$ size256 KiB (262,144 B, 0.25 MiB) +
l1i$ description2-way set associative +
l1i$ size256 KiB (262,144 B, 0.25 MiB) +
l2$ description16-way set associative +
l2$ size2 MiB (2,048 KiB, 2,097,152 B, 0.00195 GiB) +
ldateJanuary 2016 +
manufacturerTSMC +
market segmentMobile + and Embedded +
max cpu count1 +
max junction temperature398.15 K (125 °C, 257 °F, 716.67 °R) +
max memory4,096 MiB (4,194,304 KiB, 4,294,967,296 B, 4 GiB, 0.00391 TiB) +
max memory bandwidth6.95 GiB/s (7,116.8 MiB/s, 7.463 GB/s, 7,462.506 MB/s, 0.00679 TiB/s, 0.00746 TB/s) +
max memory channels1 +
max operating temperature80 °C +
max storage temperature398.15 K (125 °C, 257 °F, 716.67 °R) +
microarchitectureCortex-A53 +
min operating temperature-20 °C +
min storage temperature273.15 K (0 °C, 32 °F, 491.67 °R) +
model numberP10 +
nameHelio P10 +
part numberMT6755 + and MTK6755 +
process28 nm (0.028 μm, 2.8e-5 mm) +
seriesHelio P +
smp max ways1 +
supported memory typeLPDDR3-1866 +
technologyCMOS +
thread count8 +
used byAlcatel Flash Plus 2 +, Archos Diamond 2 Plus +, Blackview BV6000 +, Blackview R7 +, BLU Pure XR +, BLU Vivo 6 +, Elephone M3 +, Elephone P9000 +, Gionee M6 Plus +, Gionee S8 +, HTC Desire 10 Pro +, HTC U Play +, HTC One A9s +, iMan Victor +, Lenovo K5 Note +, Meizu M3E +, Meizu M3 Max +, Meizu M3 Note +, Meizu U20 +, Nomu S30 +, Oppo F1 Plus +, Oppo R9 +, Sony Xperia XA +, Sony Xperia XA Ultra +, TCL Flash Plus 2 +, TP-Link Neffos X1 +, TP-Link Neffos X1 Max +, Ulefone Future +, UMI Max +, UMI Plus +, UMI Super +, Wolder WIAM #65 + and ZTE Nubia N1 +
user equipment category6 +
word size64 bit (8 octets, 16 nibbles) +