Heterogeneous Integration (HI) refers to the assembly and packaging of multiple dice onto a single package. Heterogeneous integration allows for the packaging of dice from different functionalities or different process technologies. The combined dice can vary in functionality (e.g., processors, signal processors, cache, sensors, photonics, RF) and technologies (e.g., one optimized for die size with another one optimized for low power) .

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• Multi-Chip Package (MCP) is a package that incorporates multiple dice together with die-to-die interconnects going through the package substrate.
• Silicon Interposer is an added layer of silicon die that acts as an interpose between the dice and the package substrate underneath it.
• Wafer Level Fan-Out (WLFO)
• No TSV interposer/interconnect (NTI)
• Silicon-Less Integrated Module (SLIM)
• Embedded Multi-die Interconnect bridge (EMIB) involves inserting small silicon bridges inside the package substrate which interconnect the dice above using tighter pitched bumps while using normal bumps for the regular substrate.

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