Packaging

Technologies

Wire bonding TCI TSV TGV F2F FC

Concepts

COB CSP PiP SiP PoP

Single-Row

SiP

Dual-Row

DIP DFN SOIC TSOP ZIP

Quad-Row

QFN

Grid Array

BGA LGA PGA

2.5D IC

2.5D IC Interposer Embedded Interposer Embedded Bridge CoWoS EMIB

3D IC

3D IC Foveros WoW SoIC

Through-Silicon Via (TSV) is a high-performance vertical interconnect technology used to transmit signals between multiple stacked dies through piercings in the individual dies. TSV is an alternative technology to TCI.

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