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K3V1 - HiSilicon
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Template:mpu K3V1 is a 32-bit performance ARM microprocessor introduced by HiSilicon in 2008. This chip incorporates a single ARM9 core with Jazelle support operating at 460 MHz (although later models might have supported higher frequency). This chip supports 32-bit or 16-bit DDR memory.

Cache

Main article: ARM9 § Cache

[Edit/Modify Cache Info]

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Cache Organization
Cache is a hardware component containing a relatively small and extremely fast memory designed to speed up the performance of a CPU by preparing ahead of time the data it needs to read from a relatively slower medium such as main memory.

The organization and amount of cache can have a large impact on the performance, power consumption, die size, and consequently cost of the IC.

Cache is specified by its size, number of sets, associativity, block size, sub-block size, and fetch and write-back policies.

Note: All units are in kibibytes and mebibytes.
L1$32 KiB
32,768 B
0.0313 MiB
L1I$16 KiB
16,384 B
0.0156 MiB
1x16 KiB4-way set associative 
L1D$16 KiB
16,384 B
0.0156 MiB
1x16 KiB4-way set associative 

Memory controller

[Edit/Modify Memory Info]

ram icons.svg
Integrated Memory Controller
Max TypeDDR
Controllers1
Channels1
Width16 bit, 32 bit


Documents

Facts about "K3V1 - HiSilicon"
Has subobject
"Has subobject" is a predefined property representing a container construct and is provided by Semantic MediaWiki.
K3V1 - HiSilicon#package +
base frequency460 MHz (0.46 GHz, 460,000 kHz) +
core count1 +
core nameARM926EJ-S +
designerHiSilicon + and ARM Holdings +
familyK3 +
first announcedJune 2008 +
first launchedJune 2008 +
full page namehisilicon/k3/k3v1 +
has ecc memory supportfalse +
instance ofmicroprocessor +
io voltage1.8 V (18 dV, 180 cV, 1,800 mV) + and 2.5 V (25 dV, 250 cV, 2,500 mV) +
isaARMv5 +
isa familyARM +
l1$ size32 KiB (32,768 B, 0.0313 MiB) +
l1d$ description4-way set associative +
l1d$ size16 KiB (16,384 B, 0.0156 MiB) +
l1i$ description4-way set associative +
l1i$ size16 KiB (16,384 B, 0.0156 MiB) +
ldateJune 2008 +
manufacturerTSMC +
market segmentMobile +
max cpu count1 +
max memory channels1 +
microarchitectureARM9 +
model numberK3V1 +
nameK3V1 +
packageTFBGA-460 +
part numberHi3611 +
process180 nm (0.18 μm, 1.8e-4 mm) +
smp max ways1 +
supported memory typeDDR +
technologyCMOS +
thread count1 +
transistor count200,000,000 +
word size32 bit (4 octets, 8 nibbles) +