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Difference between revisions of "cea-leti/microarchitectures/tsarlet"
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− | ''' | + | '''TSARLET''' is a large-scale high-performance 3D stacked [[chiplets]]-based SoC technology demonstration by [[CEA-Leti]]. The project comprised 96 [[MIPS]] cores built using 6 [[chiplets]] [[3D stack]] on an active interposer in order to demonstarte in-package silicon [[scale-out]] capabilities with superior inter-chip capabilities while reducing the overall power and production cost. |
Revision as of 01:09, 29 February 2020
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TSARLET is a large-scale high-performance 3D stacked chiplets-based SoC technology demonstration by CEA-Leti. The project comprised 96 MIPS cores built using 6 chiplets 3D stack on an active interposer in order to demonstarte in-package silicon scale-out capabilities with superior inter-chip capabilities while reducing the overall power and production cost.