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Difference between revisions of "intel/foveros"
< intel
(Foveros) |
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Revision as of 20:53, 12 May 2019
| v · d · e | |
| Packaging | |
 | |
| Technologies | |
| Concepts | |
| Single-Row | |
| Dual-Row | |
| Quad-Row | |
| Grid Array | |
| 2.5D IC | |
| 3D IC | |
Foveros is a proprietary high-performance three-dimensional integrated circuit (3D IC) packaging technology designed by Intel.
Retrieved from "https://en.wikichip.org/w/index.php?title=intel/foveros&oldid=90736"