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Difference between revisions of "intel/foveros"
< intel
(Foveros) |
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Revision as of 21:53, 12 May 2019
v · d · e | |
Packaging | |
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Technologies | |
Concepts | |
Single-Row | |
Dual-Row | |
Quad-Row | |
Grid Array | |
2.5D IC | |
3D IC | |
Foveros is a proprietary high-performance three-dimensional integrated circuit (3D IC) packaging technology designed by Intel.
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