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Difference between revisions of "arm holdings/microarchitectures/arm8"
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|name=ARM8 | |name=ARM8 | ||
|designer=ARM Holdings | |designer=ARM Holdings | ||
| − | |manufacturer | + | |manufacturer=TSMC |
| − | |||
|introduction=July 8, 1996 | |introduction=July 8, 1996 | ||
|predecessor=ARM7 | |predecessor=ARM7 | ||
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|successor link=arm_holdings/microarchitectures/arm9 | |successor link=arm_holdings/microarchitectures/arm9 | ||
}} | }} | ||
| + | [[File:arm8 roadmap.gif|thumb|right|400px|Historical roadmap leading to the ARM8.]] | ||
'''ARM8''' is the successor to the {{armh|ARM7|l=arch}}, a low-power performance [[ARM]] [[microarchitecture]] designed by [[ARM Holdings]] for the mobile market. This microarchitecture is designed as an [[IP core]] and is sold to other semiconductor companies to be implemented in their own chips. | '''ARM8''' is the successor to the {{armh|ARM7|l=arch}}, a low-power performance [[ARM]] [[microarchitecture]] designed by [[ARM Holdings]] for the mobile market. This microarchitecture is designed as an [[IP core]] and is sold to other semiconductor companies to be implemented in their own chips. | ||
| + | |||
| + | == Architecture == | ||
| + | === Key changes from {{\\|ARM7}} === | ||
| + | * 2x performance (ARM810 vs ARM710 on the same [[process node]]) | ||
| + | ** 26% lower [[cycles per instruction|CPI]] (1.4, down from 1.9) | ||
| + | * [[0.6 µm process]] (down from [[0.8 µm]]) | ||
| + | * 1.66x longer pipeline (5 stages, up from 3) | ||
| + | |||
| + | == Die == | ||
| + | === ARM810 === | ||
| + | * [[0.6 µm process]] | ||
| + | * 3.3 V | ||
| + | ** 0.5 W | ||
| + | * 3-Layer Metal CMOS | ||
| + | * 53.5 mm² (not including pad ring) | ||
| + | * 144 TQFP | ||
| + | |||
| + | == Bibliography == | ||
| + | * {{hcbib|8}} | ||
Revision as of 21:30, 29 December 2018
| Edit Values | |
| ARM8 µarch | |
| General Info | |
| Arch Type | CPU |
| Designer | ARM Holdings |
| Manufacturer | TSMC |
| Introduction | July 8, 1996 |
| Succession | |
ARM8 is the successor to the ARM7, a low-power performance ARM microarchitecture designed by ARM Holdings for the mobile market. This microarchitecture is designed as an IP core and is sold to other semiconductor companies to be implemented in their own chips.
Architecture
Key changes from ARM7
- 2x performance (ARM810 vs ARM710 on the same process node)
- 26% lower CPI (1.4, down from 1.9)
- 0.6 µm process (down from 0.8 µm)
- 1.66x longer pipeline (5 stages, up from 3)
Die
ARM810
- 0.6 µm process
- 3.3 V
- 0.5 W
- 3-Layer Metal CMOS
- 53.5 mm² (not including pad ring)
- 144 TQFP
Bibliography
Facts about "ARM8 - Microarchitectures - ARM"
| codename | ARM8 + |
| designer | ARM Holdings + |
| first launched | July 8, 1996 + |
| full page name | arm holdings/microarchitectures/arm8 + |
| instance of | microarchitecture + |
| manufacturer | TSMC + |
| microarchitecture type | CPU + |
| name | ARM8 + |