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Difference between revisions of "Template:wafer tech"

(more steps)
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** [[czochralski growth|Czochralski growth]] (CZ)
 
** [[czochralski growth|Czochralski growth]] (CZ)
 
**  [[float-zone growth|Float-zone growth]] (FZ)
 
**  [[float-zone growth|Float-zone growth]] (FZ)
 +
* Preparation
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** [[ingot cropping|Ingot cropping]]
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** [[ingot squaring|Ingot squaring]]
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** [[rod grinding|Rod grinding]]
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<div class="header">Wafer Processing</div>
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* Slicing
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** [[wire sawing|Wire sawing]]
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** [[internal diameter sawing|Internal diameter sawing]] (IDs)
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* Profile control
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** [[wafer edge profiling|Wafer edge profiling]]
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** [[wafer lapping|Wafer lapping]]
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** [[wafer etching|Wafer etching]]
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** [[wafer polishing|Wafer polishing]]
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** [[epitaxial wafer|Epitaxial wafer]]
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* Preparation
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** [[wafer inspection|Wafer inspection]]
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** [[wafer packaging|Wafer packaging]]
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** [[wafer shipping|Wafer shipping]]
 
</div>{{Navbar|Template:wafer tech|text=|mini=1|style=float:right;}}
 
</div>{{Navbar|Template:wafer tech|text=|mini=1|style=float:right;}}
 
</div>
 
</div>

Revision as of 11:34, 5 March 2018

Ingot Production
Wafer Processing
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