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Revision as of 15:18, 13 December 2017

Edit Values
Core i3-7101TE
General Info
DesignerIntel
ManufacturerIntel
Model Numberi3-7101TE
Part NumberCM8067702867061
S-SpecSR374
MarketDesktop, Embedded
IntroductionJanuary 3, 2017 (announced)
January 3, 2017 (launched)
Release Price$117.00
ShopAmazon
General Specs
FamilyCore i3
Seriesi3-7100
LockedYes
Frequency3,400 MHz
Bus typeDMI 3.0
Bus rate8 GT/s
Clock multiplier34
Microarchitecture
ISAx86-64 (x86)
MicroarchitectureKaby Lake
PlatformKaby Lake
ChipsetSunrise Point, Union Point
Core NameKaby Lake S
Core Family6
Core Model158
Core SteppingB0
Process14 nm
TechnologyCMOS
Word Size64 bit
Cores2
Threads4
Max Memory64 GiB
Multiprocessing
Max SMP1-Way (Uniprocessor)
Electrical
Vcore0.55 V-1.52 V
TDP35 W
Tjunction0 °C – 88 °C
Tstorage-25 °C – 125 °C
Packaging
PackageFCLGA-1151 (LGA)
FC-LGA14C		FCLGA-1151.svg
Dimension37.5 mm x 37.5 mm x 4.4 mm
Pitch0.914 mm
Contacts1151
SocketLGA-1151

Core i3-7101TE is a 64-bit dual-core low-end performance x86 microprocessor introduced by Intel in early 2017 for the desktop and embedded market. This chip, which is based on the Kaby Lake microarchitecture, is fabricated on Intel's improved 14 nm+ process. This processor, which has a base frequency of 3.4 GHz with a TDP of 35 Watts, supports up to 64 GiB of dual-channel DDR4-2133. The i3-7101TE incorporates Intel's HD Graphics 630 IGP operating at 350 MHz with burst frequency of 1.1 GHz.

Cache

Main article: Kaby Lake § Cache

[Edit/Modify Cache Info]

hierarchy icon.svg
Cache Organization
Cache is a hardware component containing a relatively small and extremely fast memory designed to speed up the performance of a CPU by preparing ahead of time the data it needs to read from a relatively slower medium such as main memory.

The organization and amount of cache can have a large impact on the performance, power consumption, die size, and consequently cost of the IC.

Cache is specified by its size, number of sets, associativity, block size, sub-block size, and fetch and write-back policies.

Note: All units are in kibibytes and mebibytes.
L1$128 KiB
131,072 B
0.125 MiB
L1I$64 KiB
65,536 B
0.0625 MiB
2x32 KiB8-way set associative 
L1D$64 KiB
65,536 B
0.0625 MiB
2x32 KiB8-way set associativewrite-back
L2$512 KiB
0.5 MiB
524,288 B
4.882812e-4 GiB
  2x256 KiB4-way set associativewrite-back
L3$3 MiB
3,072 KiB
3,145,728 B
0.00293 GiB
  2x1.5 MiB16-way set associativewrite-back

Memory controller

[Edit/Modify Memory Info]

ram icons.svg
Integrated Memory Controller
Max TypeDDR3L-1600, DDR4-2133
Supports ECCYes
Max Mem64 GiB
Controllers1
Channels2
Max Bandwidth31.79 GiB/s
32,552.96 MiB/s
34.134 GB/s
34,134.253 MB/s
0.031 TiB/s
0.0341 TB/s
Bandwidth
Single 15.89 GiB/s
Double 31.79 GiB/s

Expansions

[Edit/Modify Expansions Info]

ide icon.svg
Expansion Options
PCIe
Revision3.0
Max Lanes16
Configs1x16, 2x8, 1x8+2x4


Graphics

[Edit/Modify IGP Info]

screen icon.svg
Integrated Graphics Information
GPUHD Graphics 610
DesignerIntelDevice ID0x5902
Execution Units12Max Displays3
Max Memory64 GiB
65,536 MiB
67,108,864 KiB
68,719,476,736 B
Frequency350 MHz
0.35 GHz
350,000 KHz
Burst Frequency1,100 MHz
1.1 GHz
1,100,000 KHz
OutputDP, eDP, HDMI, DVI
Max Resolution
HDMI4096x2304 @30 Hz
DP4096x2304 @60 Hz
eDP4096x2304 @60 Hz
Standards
DirectX12
OpenGL4.4
OpenCL2.0
DP1.2
eDP1.4
HDMI1.4a
Additional Features
Intel Quick Sync Video
Intel InTru 3D
Intel WiDi (Wireless Display)
Intel Clear Video HD

Features

[Edit/Modify Supported Features]

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Supported x86 Extensions & Processor Features
MMXMMX Extension
EMMXExtended MMX Extension
SSEStreaming SIMD Extensions
SSE2Streaming SIMD Extensions 2
SSE3Streaming SIMD Extensions 3
SSSE3Supplemental SSE3
SSE4.1Streaming SIMD Extensions 4.1
SSE4.2Streaming SIMD Extensions 4.2
AVXAdvanced Vector Extensions
AVX2Advanced Vector Extensions 2
ABMAdvanced Bit Manipulation
BMI1Bit Manipulation Instruction Set 1
BMI2Bit Manipulation Instruction Set 2
FMA33-Operand Fused-Multiply-Add
AESAES Encryption Instructions
RdRandHardware RNG
ADXMulti-Precision Add-Carry
CLMULCarry-less Multiplication Extension
F16C16-bit Floating Point Conversion
x86-1616-bit x86
x86-3232-bit x86
x86-6464-bit x86
RealReal Mode
ProtectedProtected Mode
SMMSystem Management Mode
FPUIntegrated x87 FPU
NXNo-eXecute
HTHyper-Threading
EISTEnhanced SpeedStep Technology
VT-xVT-x (Virtualization)
VT-dVT-d (I/O MMU virtualization)
EPTExtended Page Tables (SLAT)
MPXMemory Protection Extensions
SGXSoftware Guard Extensions
SMEPOS Guard Technology
IPTIdentity Protection Technology

Note: Intel's ARK incorrectly shows no support for AVX2.

Die Shot

See also: Kaby Lake § Die Shot

A die shot of Intel's Kaby Lake dual-core desktop processors:

kaby lake (dual core).png


kaby lake (dual core) (annotated).png
Retrieved from "https://en.wikichip.org/w/index.php?title=intel/core_i3/i3-7101te&oldid=70557"
Facts about "Core i3-7101TE - Intel"
RDF feed
Has subobject
"Has subobject" is a predefined property representing a container construct and is provided by Semantic MediaWiki.
Core i3-7101TE - Intel#package + and Core i3-7101TE - Intel#io +
base frequency3,400 MHz (3.4 GHz, 3,400,000 kHz) +
bus rate8,000 MT/s (8 GT/s, 8,000,000 kT/s) +
bus typeDMI 3.0 +
chipsetSunrise Point + and Union Point +
clock multiplier34 +
core count2 +
core family6 +
core model158 +
core nameKaby Lake S +
core steppingB0 +
core voltage (max)1.52 V (15.2 dV, 152 cV, 1,520 mV) +
core voltage (min)0.55 V (5.5 dV, 55 cV, 550 mV) +
designerIntel +
device id0x5902 +
familyCore i3 +
first announcedJanuary 3, 2017 +
first launchedJanuary 3, 2017 +
full page nameintel/core i3/i3-7101te +
has advanced vector extensionstrue +
has advanced vector extensions 2true +
has ecc memory supporttrue +
has extended page tables supporttrue +
has featureAdvanced Vector Extensions +, Advanced Vector Extensions 2 +, Advanced Encryption Standard Instruction Set Extension +, Hyper-Threading Technology +, Enhanced SpeedStep Technology +, Intel VT-x +, Intel VT-d +, Extended Page Tables +, Memory Protection Extensions +, Software Guard Extensions +, OS Guard + and Identity Protection Technology +
has intel enhanced speedstep technologytrue +
has intel identity protection technology supporttrue +
has intel supervisor mode execution protectiontrue +
has intel vt-d technologytrue +
has intel vt-x technologytrue +
has locked clock multipliertrue +
has second level address translation supporttrue +
has simultaneous multithreadingtrue +
has x86 advanced encryption standard instruction set extensiontrue +
instance ofmicroprocessor +
integrated gpuHD Graphics 610 +
integrated gpu base frequency350 MHz (0.35 GHz, 350,000 KHz) +
integrated gpu designerIntel +
integrated gpu execution units12 +
integrated gpu max frequency1,100 MHz (1.1 GHz, 1,100,000 KHz) +
integrated gpu max memory65,536 MiB (67,108,864 KiB, 68,719,476,736 B, 64 GiB) +
isax86-64 +
isa familyx86 +
l1$ size128 KiB (131,072 B, 0.125 MiB) +
l1d$ description8-way set associative +
l1d$ size64 KiB (65,536 B, 0.0625 MiB) +
l1i$ description8-way set associative +
l1i$ size64 KiB (65,536 B, 0.0625 MiB) +
l2$ description4-way set associative +
l2$ size0.5 MiB (512 KiB, 524,288 B, 4.882812e-4 GiB) +
l3$ description16-way set associative +
l3$ size3 MiB (3,072 KiB, 3,145,728 B, 0.00293 GiB) +
ldateJanuary 3, 2017 +
manufacturerIntel +
market segmentDesktop + and Embedded +
max cpu count1 +
max junction temperature361.15 K (88 °C, 190.4 °F, 650.07 °R) +
max memory65,536 MiB (67,108,864 KiB, 68,719,476,736 B, 64 GiB, 0.0625 TiB) +
max memory bandwidth31.79 GiB/s (32,552.96 MiB/s, 34.134 GB/s, 34,134.253 MB/s, 0.031 TiB/s, 0.0341 TB/s) +
max memory channels2 +
max pcie lanes16 +
max storage temperature398.15 K (125 °C, 257 °F, 716.67 °R) +
microarchitectureKaby Lake +
min junction temperature273.15 K (0 °C, 32 °F, 491.67 °R) +
min storage temperature248.15 K (-25 °C, -13 °F, 446.67 °R) +
model numberi3-7101TE +
nameCore i3-7101TE +
packageFCLGA-1151 +
part numberCM8067702867061 +
platformKaby Lake +
process14 nm (0.014 μm, 1.4e-5 mm) +
release price$ 117.00 (€ 105.30, £ 94.77, ¥ 12,089.61) +
s-specSR374 +
seriesi3-7100 +
smp max ways1 +
socketLGA-1151 +
supported memory typeDDR3L-1600 + and DDR4-2133 +
tdp35 W (35,000 mW, 0.0469 hp, 0.035 kW) +
technologyCMOS +
thread count4 +
word size64 bit (8 octets, 16 nibbles) +
x86/has memory protection extensionstrue +
x86/has software guard extensionstrue +