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Difference between revisions of "zettascaler"

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{{title|ZettaScaler}}
 
{{title|ZettaScaler}}
 
'''ZettaScaler''' is a series of [[Japanese]] supercomputers using [[processors]] designed by [[PEZY]] and liquid cooling systems designed by ExaScaler.
 
'''ZettaScaler''' is a series of [[Japanese]] supercomputers using [[processors]] designed by [[PEZY]] and liquid cooling systems designed by ExaScaler.
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== Overview ==
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ZettaScaler supercomputers are constructed using dense server aggregates called 'Bricks'. The system is cooled using enclosures containing a number of bricks. The cooling system is designed by ExaScaler and makes use of 3M's Fluorinert Electronic liquid which is an electrically insulating fluorocarbon-based inert liquid.
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=== ZettaScaler-1.x ===
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=== ZettaScaler-2.x ===
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With the introduction of the '''ZettaScaler-2.x''', [[PEZY]] has redesigned the Brick. PEZY moved to an advanced 3D packaging technology using [[ThruChip Interface]] (TCI) to interconnect the DRAM to the processor which uses wireless near-field inductive coupling instead of the traditional [[TSV]].
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== References ==
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* Some information was obtained directly from PEZY
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* [http://news.3m.com/press-release/company/3m-fluorinert-helps-pezyexascaler-rise-top-green500-list 3M Fluorinert Helps PEZY/ExaScaler Rise to the Top of the Green500 List]

Revision as of 21:56, 1 November 2017

ZettaScaler is a series of Japanese supercomputers using processors designed by PEZY and liquid cooling systems designed by ExaScaler.

Overview

ZettaScaler supercomputers are constructed using dense server aggregates called 'Bricks'. The system is cooled using enclosures containing a number of bricks. The cooling system is designed by ExaScaler and makes use of 3M's Fluorinert Electronic liquid which is an electrically insulating fluorocarbon-based inert liquid.

ZettaScaler-1.x

ZettaScaler-2.x

With the introduction of the ZettaScaler-2.x, PEZY has redesigned the Brick. PEZY moved to an advanced 3D packaging technology using ThruChip Interface (TCI) to interconnect the DRAM to the processor which uses wireless near-field inductive coupling instead of the traditional TSV.

References

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