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Difference between revisions of "hisilicon/kirin/970"
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{{hisil title|Kirin 970}} | {{hisil title|Kirin 970}} | ||
| − | {{mpu}} | + | {{mpu |
| + | |name=Kirin 970 | ||
| + | |image=kirin 970.png | ||
| + | |designer=HiSilicon | ||
| + | |designer 2=ARM Holdings | ||
| + | |manufacturer=TSMC | ||
| + | |model number=970 | ||
| + | |market=Mobile | ||
| + | |first announced=September 1, 2017 | ||
| + | |first launched=September 1, 2017 | ||
| + | |family=Kirin | ||
| + | |series=900 | ||
| + | |frequency=1,800 MHz | ||
| + | |frequency 2=2,400 MHz | ||
| + | |isa=ARMv8 | ||
| + | |isa family=ARM | ||
| + | |microarch=Cortex-A53 | ||
| + | |microarch 2=Cortex-A73 | ||
| + | |core name=Cortex-A53 | ||
| + | |core name 2=Cortex-A73 | ||
| + | |process=10 nm | ||
| + | |transistors=5,500,000,000 | ||
| + | |technology=CMOS | ||
| + | |word size=64 bit | ||
| + | |core count=8 | ||
| + | |thread count=8 | ||
| + | |max cpus=1 | ||
| + | |max memory=6 GiB | ||
| + | }} | ||
'''Kirin 970''' is a {{arch|64}} [[octa-core]] high-performance mobile [[ARM]] SoC introduced by [[HiSilicon]] in mid-2017 at the [[2017 IFA]]. This chip, which is fabricated on a [[10 nm process]], features four {{armh|Cortex-A73|l=arch}} [[big cores]] operating at up to 2.4 GHz along with four {{armh|Cortex-A53}} [[little cores]] operating at up to 1.8 GHz. The overall core organization is identical to the {{\\|960|Kirin 960}} which was introduced the previous year, but features 20% power efficiency and 40% smaller die area due to the [[process shrink]]. The 970 incorporates [[ARM Holdings|ARM]]'s {{armh|Mali G72}} (12 core) IGP operating at ? MHz and supports up to 6 GiB of dual-channel LPDDR4-1866 memory. | '''Kirin 970''' is a {{arch|64}} [[octa-core]] high-performance mobile [[ARM]] SoC introduced by [[HiSilicon]] in mid-2017 at the [[2017 IFA]]. This chip, which is fabricated on a [[10 nm process]], features four {{armh|Cortex-A73|l=arch}} [[big cores]] operating at up to 2.4 GHz along with four {{armh|Cortex-A53}} [[little cores]] operating at up to 1.8 GHz. The overall core organization is identical to the {{\\|960|Kirin 960}} which was introduced the previous year, but features 20% power efficiency and 40% smaller die area due to the [[process shrink]]. The 970 incorporates [[ARM Holdings|ARM]]'s {{armh|Mali G72}} (12 core) IGP operating at ? MHz and supports up to 6 GiB of dual-channel LPDDR4-1866 memory. | ||
Revision as of 00:03, 7 September 2017
Template:mpu Kirin 970 is a 64-bit octa-core high-performance mobile ARM SoC introduced by HiSilicon in mid-2017 at the 2017 IFA. This chip, which is fabricated on a 10 nm process, features four Cortex-A73 big cores operating at up to 2.4 GHz along with four Cortex-A53 little cores operating at up to 1.8 GHz. The overall core organization is identical to the Kirin 960 which was introduced the previous year, but features 20% power efficiency and 40% smaller die area due to the process shrink. The 970 incorporates ARM's Mali G72 (12 core) IGP operating at ? MHz and supports up to 6 GiB of dual-channel LPDDR4-1866 memory.