From WikiChip
Difference between revisions of "renesas/r-car/h3 (sip)"
Line 1: | Line 1: | ||
{{renesas title|R-Car H3 (SiP)}} | {{renesas title|R-Car H3 (SiP)}} | ||
− | {{mpu}} | + | {{mpu |
+ | |name=R-Car H3 (SiP) | ||
+ | |image=r-car h3 (sip).png | ||
+ | |image size=125px | ||
+ | |designer=Renesas | ||
+ | |designer 2=ARM Holdings | ||
+ | |manufacturer=TSMC | ||
+ | |model number=H3 (SiP) | ||
+ | |part number=R8J77950 | ||
+ | |market=Embedded | ||
+ | |first announced=December 2, 2015 | ||
+ | |first launched=March, 2018 | ||
+ | |family=R-Car | ||
+ | |series=3rd Gen | ||
+ | |isa=ARMv8 | ||
+ | |isa family=ARM | ||
+ | |microarch=Cortex-A53 | ||
+ | |microarch 2=Cortex-A57 | ||
+ | |microarch 3=Cortex-R7 | ||
+ | |core name=Cortex-A53 | ||
+ | |core name 2=Cortex-A57 | ||
+ | |core name 3=Cortex-R7 | ||
+ | |process=16 nm | ||
+ | |technology=CMOS | ||
+ | |word size=64 bit | ||
+ | |core count=9 | ||
+ | |thread count=9 | ||
+ | |max cpus=1 | ||
+ | |v core=0.8 V | ||
+ | |v io=3.3 V | ||
+ | |package module 1={{packages/renesas/fcbga-1255}} | ||
+ | }} | ||
'''R-Car H3''' is a {{arch|64}} [[nona-core]] [[ARM]] SoC designed by [[Renesas]] for the automotive industry and introduced in 2016. The H3 incorporates four {{armh|Cortex-A57}} cores, four {{armh|Cortex-A53}} cores, and a single {{armh|Cortex-R7}} core for real-time processing. This chip supports up to quad-channel LPDDR4-3200 memory. | '''R-Car H3''' is a {{arch|64}} [[nona-core]] [[ARM]] SoC designed by [[Renesas]] for the automotive industry and introduced in 2016. The H3 incorporates four {{armh|Cortex-A57}} cores, four {{armh|Cortex-A53}} cores, and a single {{armh|Cortex-R7}} core for real-time processing. This chip supports up to quad-channel LPDDR4-3200 memory. | ||
This model is an [[SiP]] variant of the {{\\|H3}} which include the DDR memory on-package. | This model is an [[SiP]] variant of the {{\\|H3}} which include the DDR memory on-package. |
Revision as of 03:13, 23 July 2017
Template:mpu R-Car H3 is a 64-bit nona-core ARM SoC designed by Renesas for the automotive industry and introduced in 2016. The H3 incorporates four Cortex-A57 cores, four Cortex-A53 cores, and a single Cortex-R7 core for real-time processing. This chip supports up to quad-channel LPDDR4-3200 memory.
This model is an SiP variant of the H3 which include the DDR memory on-package.