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Difference between revisions of "intel/xeon e3/e3-1545m v5"
< intel

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|f16c=Yes
 
|f16c=Yes
 
|tbt1=No
 
|tbt1=No
−
|tbt2=No
+
|tbt2=Yes
 
|tbmt3=No
 
|tbmt3=No
 
|bpt=No
 
|bpt=No
 
|eist=Yes
 
|eist=Yes
 
|sst=No
 
|sst=No
−
|flex=No
+
|flex=Yes
 
|fastmem=No
 
|fastmem=No
−
|isrt=No
+
|isrt=Yes
 
|sba=No
 
|sba=No
 
|mwt=No
 
|mwt=No
−
|sipp=No
+
|sipp=Yes
 
|att=No
 
|att=No
−
|ipt=No
+
|ipt=Yes
−
|tsx=No
+
|tsx=Yes
−
|txt=No
+
|txt=Yes
−
|ht=No
+
|ht=Yes
−
|vpro=No
+
|vpro=Yes
 
|vtx=Yes
 
|vtx=Yes
 
|vtd=Yes
 
|vtd=Yes
 
|ept=Yes
 
|ept=Yes
−
|mpx=No
+
|mpx=Yes
−
|sgx=No
+
|sgx=Yes
−
|securekey=No
+
|securekey=Yes
 
|osguard=Yes
 
|osguard=Yes
 
|3dnow=No
 
|3dnow=No

Revision as of 02:27, 8 July 2017

Template:mpu The Xeon E3-1545M V5 is 64-bit x86 mobile quad-core microprocessor for introduced by Intel in October 2015. This entry-level Skylake-based workstations processor operates at 2.9 GHz with turbo boost of 3.8 GHz. This chip has a TDP of 45 Watts with a configurable TDP down of 35 W. The MPU supports up to 64 GiB of dual-channel DDR3/4 and has the Iris Pro Graphics P580 IGP.

Cache

Main article: Skylake § Cache

[Edit/Modify Cache Info]

hierarchy icon.svg
Cache Organization
Cache is a hardware component containing a relatively small and extremely fast memory designed to speed up the performance of a CPU by preparing ahead of time the data it needs to read from a relatively slower medium such as main memory.

The organization and amount of cache can have a large impact on the performance, power consumption, die size, and consequently cost of the IC.

Cache is specified by its size, number of sets, associativity, block size, sub-block size, and fetch and write-back policies.

Note: All units are in kibibytes and mebibytes.
L1$256 KiB
262,144 B
0.25 MiB
L1I$128 KiB
131,072 B
0.125 MiB
4x32 KiB8-way set associative 
L1D$128 KiB
131,072 B
0.125 MiB
4x32 KiB8-way set associativewrite-back
L2$1 MiB
1,024 KiB
1,048,576 B
9.765625e-4 GiB
  4x256 KiB4-way set associativewrite-back
L3$8 MiB
8,192 KiB
8,388,608 B
0.00781 GiB
  4x2 MiB write-back

Memory controller

[Edit/Modify Memory Info]

ram icons.svg
Integrated Memory Controller
Max TypeLPDDR3-1866, DDR3L-1600, DDR4-2133
Supports ECCYes
Max Mem64 GiB
Controllers1
Channels2
Max Bandwidth31.79 GiB/s
32,552.96 MiB/s
34.134 GB/s
34,134.253 MB/s
0.031 TiB/s
0.0341 TB/s
Bandwidth
Single 15.89 GiB/s
Double 31.79 GiB/s

Expansions

[Edit/Modify Expansions Info]

ide icon.svg
Expansion Options
PCIe
Revision3.0
Max Lanes16
Configs1x16, 2x8, 1x8+2x4


Graphics

This integrated graphics includes an additional 128 MiB of eDRAM on-chip.

[Edit/Modify IGP Info]

screen icon.svg
Integrated Graphics Information
GPUIris Pro Graphics P580
DesignerIntelDevice ID0x193D
Execution Units72Max Displays3
Max Memory64 GiB
65,536 MiB
67,108,864 KiB
68,719,476,736 B
Frequency350 MHz
0.35 GHz
350,000 KHz
Burst Frequency1,050 MHz
1.05 GHz
1,050,000 KHz
OutputDP, eDP, HDMI, DVI
Max Resolution
HDMI4096x2304 @24 Hz
DP4096x2304 @60 Hz
eDP4096x2304 @60 Hz
Standards
DirectX12
OpenGL4.4
OpenCL2.0
DP1.2
eDP1.3
HDMI1.4a
Additional Features
Intel Quick Sync Video
Intel Clear Video HD

Features

[Edit/Modify Supported Features]

Cog-icon-grey.svg
Supported x86 Extensions & Processor Features
MMXMMX Extension
EMMXExtended MMX Extension
SSEStreaming SIMD Extensions
SSE2Streaming SIMD Extensions 2
SSE3Streaming SIMD Extensions 3
SSSE3Supplemental SSE3
SSE4.1Streaming SIMD Extensions 4.1
SSE4.2Streaming SIMD Extensions 4.2
AVXAdvanced Vector Extensions
AVX2Advanced Vector Extensions 2
ABMAdvanced Bit Manipulation
BMI1Bit Manipulation Instruction Set 1
BMI2Bit Manipulation Instruction Set 2
FMA33-Operand Fused-Multiply-Add
AESAES Encryption Instructions
RdRandHardware RNG
ADXMulti-Precision Add-Carry
CLMULCarry-less Multiplication Extension
F16C16-bit Floating Point Conversion
x86-1616-bit x86
x86-3232-bit x86
x86-6464-bit x86
RealReal Mode
ProtectedProtected Mode
SMMSystem Management Mode
FPUIntegrated x87 FPU
NXNo-eXecute
HTHyper-Threading
TBT 2.0Turbo Boost Technology 2.0
EISTEnhanced SpeedStep Technology
TXTTrusted Execution Technology (SMX)
vProIntel vPro
VT-xVT-x (Virtualization)
VT-dVT-d (I/O MMU virtualization)
EPTExtended Page Tables (SLAT)
TSXTransactional Synchronization Extensions
MPXMemory Protection Extensions
SGXSoftware Guard Extensions
Secure KeySecure Key Technology
SMEPOS Guard Technology
Flex MemoryFlex Memory Access
ISRTSmart Response Technology
SIPPStable Image Platform Program
IPTIdentity Protection Technology
Retrieved from "https://en.wikichip.org/w/index.php?title=intel/xeon_e3/e3-1545m_v5&oldid=53115"
Facts about "Xeon E3-1545M v5 - Intel"
RDF feed
Has subobject
"Has subobject" is a predefined property representing a container construct and is provided by Semantic MediaWiki.
Xeon E3-1545M v5 - Intel#package + and Xeon E3-1545M v5 - Intel#io +
base frequency2,900 MHz (2.9 GHz, 2,900,000 kHz) +
bus links4 +
bus rate8,000 MT/s (8 GT/s, 8,000,000 kT/s) +
bus typeDMI 3.0 +
clock multiplier29 +
core count4 +
core family6 +
core model94 +
core nameSkylake H +
core steppingN0 +
core voltage (max)1.52 V (15.2 dV, 152 cV, 1,520 mV) +
core voltage (min)0.55 V (5.5 dV, 55 cV, 550 mV) +
designerIntel +
device id0x193D +
die count2 +
familyXeon E3 +
first announcedJanuary 2, 2016 +
first launchedJanuary 2, 2016 +
full page nameintel/xeon e3/e3-1545m v5 +
has advanced vector extensionstrue +
has advanced vector extensions 2true +
has ecc memory supporttrue +
has extended page tables supporttrue +
has featureAdvanced Vector Extensions +, Advanced Vector Extensions 2 +, Advanced Encryption Standard Instruction Set Extension +, Enhanced SpeedStep Technology +, Intel VT-x +, Intel VT-d +, OS Guard +, Hyper-Threading Technology +, Turbo Boost Technology 2.0 +, Trusted Execution Technology +, Intel vPro Technology +, Transactional Synchronization Extensions +, Secure Key Technology +, Flex Memory Access +, Smart Response Technology +, Stable Image Platform Program +, Identity Protection Technology +, Extended Page Tables +, Memory Protection Extensions + and Software Guard Extensions +
has intel enhanced speedstep technologytrue +
has intel flex memory access supporttrue +
has intel identity protection technology supporttrue +
has intel secure key technologytrue +
has intel smart response technology supporttrue +
has intel stable image platform program supporttrue +
has intel supervisor mode execution protectiontrue +
has intel trusted execution technologytrue +
has intel turbo boost technology 2 0true +
has intel vpro technologytrue +
has intel vt-d technologytrue +
has intel vt-x technologytrue +
has locked clock multipliertrue +
has second level address translation supporttrue +
has simultaneous multithreadingtrue +
has transactional synchronization extensionstrue +
has x86 advanced encryption standard instruction set extensiontrue +
instance ofmicroprocessor +
integrated gpuIris Pro Graphics P580 +
integrated gpu base frequency350 MHz (0.35 GHz, 350,000 KHz) +
integrated gpu designerIntel +
integrated gpu execution units72 +
integrated gpu max frequency1,050 MHz (1.05 GHz, 1,050,000 KHz) +
integrated gpu max memory65,536 MiB (67,108,864 KiB, 68,719,476,736 B, 64 GiB) +
is multi-chip packagetrue +
isax86-64 +
isa familyx86 +
l1$ size256 KiB (262,144 B, 0.25 MiB) +
l1d$ description8-way set associative +
l1d$ size128 KiB (131,072 B, 0.125 MiB) +
l1i$ description8-way set associative +
l1i$ size128 KiB (131,072 B, 0.125 MiB) +
l2$ description4-way set associative +
l2$ size1 MiB (1,024 KiB, 1,048,576 B, 9.765625e-4 GiB) +
l3$ size8 MiB (8,192 KiB, 8,388,608 B, 0.00781 GiB) +
l4$ size128 MiB (131,072 KiB, 134,217,728 B, 0.125 GiB) +
ldateJanuary 2, 2016 +
manufacturerIntel +
market segmentMobile +
max cpu count1 +
max junction temperature373.15 K (100 °C, 212 °F, 671.67 °R) +
max memory65,536 MiB (67,108,864 KiB, 68,719,476,736 B, 64 GiB, 0.0625 TiB) +
max memory bandwidth31.79 GiB/s (32,552.96 MiB/s, 34.134 GB/s, 34,134.253 MB/s, 0.031 TiB/s, 0.0341 TB/s) +
max memory channels2 +
max operating temperature100 °C +
max pcie lanes16 +
max storage temperature398.15 K (125 °C, 257 °F, 716.67 °R) +
microarchitectureSkylake +
min junction temperature273.15 K (0 °C, 32 °F, 491.67 °R) +
min operating temperature0 °C +
min storage temperature248.15 K (-25 °C, -13 °F, 446.67 °R) +
model numberE3-1545M v5 +
nameXeon E3-1545M v5 +
packageFCBGA-1440 +
part numberJQ8066202193209 +
platformGreenlow +
process14 nm (0.014 μm, 1.4e-5 mm) +
release price$ 679.00 (€ 611.10, £ 549.99, ¥ 70,161.07) +
s-specSR2QU +
seriesE3-1500 v5 +
smp max ways1 +
supported memory typeLPDDR3-1866 +, DDR3L-1600 + and DDR4-2133 +
tdp45 W (45,000 mW, 0.0603 hp, 0.045 kW) +
tdp down35 W (35,000 mW, 0.0469 hp, 0.035 kW) +
technologyCMOS +
thread count8 +
turbo frequency (1 core)3,800 MHz (3.8 GHz, 3,800,000 kHz) +
word size64 bit (8 octets, 16 nibbles) +
x86/has memory protection extensionstrue +
x86/has software guard extensionstrue +