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Difference between revisions of "dec/microarchitectures/alpha 21264"
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== Process Technology == | == Process Technology == | ||
{{see also|0.35 µm process}} | {{see also|0.35 µm process}} | ||
| − | Alpha 21264 was manufactured on a [[0.35 µm process]] at DEC's own Hudson foundry. The process had a 0.35 µm drawn gate length and 0.25 µm effective channel length. The CMOS process had 3 metal layers | + | Alpha 21264 was manufactured on a [[0.35 µm process]] at DEC's own Hudson foundry. The process had a 0.35 µm drawn gate length and 0.25 µm effective channel length. The CMOS process had 3 metal layers. The chip allowed for a supply voltage of up to 2 V in order to limit the chips to a power limit of 72 W, although it was actually designed to reliably operate at up to 2.5 V. |
== Architecture == | == Architecture == | ||
Latest revision as of 05:59, 13 June 2017
| Edit Values | |
| Alpha 21264 µarch | |
| General Info | |
| Arch Type | CPU |
| Designer | DEC |
| Manufacturer | DEC, Intel, Samsung |
| Introduction | February, 1998 |
| Process | 0.35 µm |
| Core Configs | 1 |
| Pipeline | |
| Type | Superscalar |
| OoOE | Yes |
| Speculative | Yes |
| Reg Renaming | Yes |
| Stages | 6 |
| Decode | 4-way |
| Instructions | |
| ISA | Alpha |
| Cache | |
| L1I Cache | 64 KiB/core 2-way set associative |
| L1D Cache | 64 KiB/core 2-way set associative |
| Succession | |
Alpha 21264 was an Alpha microarchitecture designed by DEC and introduced in 1998 by Compaq as a successor to the Alpha 21164 architecture.
History[edit]
 |
This section is empty; you can help add the missing info by editing this page. |
Process Technology[edit]
- See also: 0.35 µm process
Alpha 21264 was manufactured on a 0.35 µm process at DEC's own Hudson foundry. The process had a 0.35 µm drawn gate length and 0.25 µm effective channel length. The CMOS process had 3 metal layers. The chip allowed for a supply voltage of up to 2 V in order to limit the chips to a power limit of 72 W, although it was actually designed to reliably operate at up to 2.5 V.
Architecture[edit]
| |
This section is empty; you can help add the missing info by editing this page. |
- Integrated PLL (designed by CSEM)
Die[edit]
- 15,200,000 transistors
- 9,200,000 cache
- 6,000,000 logic
- 0.35 µm 4 metal layers
- 16.7 mm x 18.8 mm
- 313.96 mm² die size
- PGA-587 package
- 389 signal pins
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All Alpha 21264 chips[edit]
| |
This section is empty; you can help add the missing info by editing this page. |
References[edit]
- Dobberpuhl, Daniel W. "Circuits and technology for Digital's StrongARM and ALPHA microprocessors [CMOS technology]." Advanced Research in VLSI, 1997. Proceedings., Seventeenth Conference on. IEEE, 1997.
Facts about "Alpha 21264 - Microarchitectures - DEC"
| codename | Alpha 21264 + |
| core count | 1 + |
| designer | DEC + |
| first launched | February 1998 + |
| full page name | dec/microarchitectures/alpha 21264 + |
| instance of | microarchitecture + |
| instruction set architecture | Alpha + |
| manufacturer | DEC +, Intel + and Samsung + |
| microarchitecture type | CPU + |
| name | Alpha 21264 + |
| pipeline stages | 6 + |
| process | 350 nm (0.35 μm, 3.5e-4 mm) + |