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'''Xeon E3-1275 v6''' is a {{arch|64}} [[quad-core]] [[x86]] workstation/entry server microprocessor set to be introduced by [[Intel]] in early [[2017]]. This chip, which is based on the {{intel|Kaby Lake|l=arch}} microarchitecture, is fabricated on Intel's [[14 nm process|14nm+ process]]. The E3-1245 v6 operates at 3.8 GHz with a TDP of 78 W supporting a {{intel|Turbo Boost}} frequency of ? GHz. The processor supports up to 64 GiB of dual-channel non-ECC DDR4-2400 memory and incorporates Intel's {{intel|HD Graphics P630}} [[IGP]] operating at 400 MHz with a burst frequency of ? GHz.
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'''Xeon E3-1275 v6''' is a {{arch|64}} [[quad-core]] [[x86]] workstation/entry server microprocessor set to be introduced by [[Intel]] in early [[2017]]. This chip, which is based on the {{intel|Kaby Lake|l=arch}} microarchitecture, is fabricated on Intel's [[14 nm process|14nm+ process]]. The E3-1245 v6 operates at 3.8 GHz with a TDP of 78 W supporting a {{intel|Turbo Boost}} frequency of ? GHz. The processor supports up to 64 GiB of dual-channel DDR4-2400 ECC memory and incorporates Intel's {{intel|HD Graphics P630}} [[IGP]] operating at 400 MHz with a burst frequency of ? GHz.
  
  

Revision as of 02:49, 18 January 2017

Template:mpu Xeon E3-1275 v6 is a 64-bit quad-core x86 workstation/entry server microprocessor set to be introduced by Intel in early 2017. This chip, which is based on the Kaby Lake microarchitecture, is fabricated on Intel's 14nm+ process. The E3-1245 v6 operates at 3.8 GHz with a TDP of 78 W supporting a Turbo Boost frequency of ? GHz. The processor supports up to 64 GiB of dual-channel DDR4-2400 ECC memory and incorporates Intel's HD Graphics P630 IGP operating at 400 MHz with a burst frequency of ? GHz.


DIL16 Blank.svg Preliminary Data! Information presented in this article deal with a microprocessor or chip that was recently announced or leaked, thus missing information regarding its features and exact specification. Information may be incomplete and can change by final release.

Cache

Main article: Kaby Lake § Cache

[Edit/Modify Cache Info]

hierarchy icon.svg
Cache Organization
Cache is a hardware component containing a relatively small and extremely fast memory designed to speed up the performance of a CPU by preparing ahead of time the data it needs to read from a relatively slower medium such as main memory.

The organization and amount of cache can have a large impact on the performance, power consumption, die size, and consequently cost of the IC.

Cache is specified by its size, number of sets, associativity, block size, sub-block size, and fetch and write-back policies.

Note: All units are in kibibytes and mebibytes.
L1$256 KiB
262,144 B
0.25 MiB
L1I$128 KiB
131,072 B
0.125 MiB
4x32 KiB8-way set associative 
L1D$128 KiB
131,072 B
0.125 MiB
4x32 KiB8-way set associativewrite-back
L2$1 MiB
1,024 KiB
1,048,576 B
9.765625e-4 GiB
  4x256 KiB4-way set associativewrite-back
L3$8 MiB
8,192 KiB
8,388,608 B
0.00781 GiB
  4x2 MiB16-way set associativewrite-back

Memory controller

[Edit/Modify Memory Info]

ram icons.svg
Integrated Memory Controller
Max TypeDDR3L-1600, LPDDR3-2133, DDR4-2400
Supports ECCYes
Max Mem64 GiB
Controllers1
Channels2
Max Bandwidth35.76 GiB/s
36,618.24 MiB/s
38.397 GB/s
38,397.008 MB/s
0.0349 TiB/s
0.0384 TB/s
Bandwidth
Single 17.88 GiB/s
Double 35.76 GiB/s

Expansions

[Edit/Modify Expansions Info]

ide icon.svg
Expansion Options
PCIe
Revision3.0
Max Lanes16
Configs1x16, 2x8, 1x8+2x4


Graphics

[Edit/Modify IGP Info]

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Integrated Graphics Information
GPUHD Graphics P630
DesignerIntelDevice ID0x591D
Execution Units24Max Displays3
Max Memory64 GiB
65,536 MiB
67,108,864 KiB
68,719,476,736 B
Frequency400 MHz
0.4 GHz
400,000 KHz
Burst Frequency? MHz
"? MHz" is not a number.
OutputDP, eDP, HDMI, DVI
Max Resolution
HDMI4096x2304 @30 Hz
DP4096x2304 @60 Hz
eDP4096x2304 @60 Hz
Standards
DirectX12
OpenGL4.4
OpenCL2.0
DP1.2
eDP1.4
HDMI1.4a
Additional Features
Intel Quick Sync Video
Intel InTru 3D
Intel Clear Video
Intel Clear Video HD

Features

[Edit/Modify Supported Features]

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Supported x86 Extensions & Processor Features
MMXMMX Extension
EMMXExtended MMX Extension
SSEStreaming SIMD Extensions
SSE2Streaming SIMD Extensions 2
SSE3Streaming SIMD Extensions 3
SSSE3Supplemental SSE3
SSE4.1Streaming SIMD Extensions 4.1
SSE4.2Streaming SIMD Extensions 4.2
AVXAdvanced Vector Extensions
AVX2Advanced Vector Extensions 2
ABMAdvanced Bit Manipulation
BMI1Bit Manipulation Instruction Set 1
BMI2Bit Manipulation Instruction Set 2
FMA33-Operand Fused-Multiply-Add
AESAES Encryption Instructions
RdRandHardware RNG
ADXMulti-Precision Add-Carry
CLMULCarry-less Multiplication Extension
F16C16-bit Floating Point Conversion
x86-1616-bit x86
x86-3232-bit x86
x86-6464-bit x86
RealReal Mode
ProtectedProtected Mode
SMMSystem Management Mode
FPUIntegrated x87 FPU
NXNo-eXecute
HTHyper-Threading
TBT 2.0Turbo Boost Technology 2.0
EISTEnhanced SpeedStep Technology
SSTSpeed Shift Technology
TXTTrusted Execution Technology (SMX)
vProIntel vPro
VT-xVT-x (Virtualization)
VT-dVT-d (I/O MMU virtualization)
EPTExtended Page Tables (SLAT)
TSXTransactional Synchronization Extensions
MPXMemory Protection Extensions
SGXSoftware Guard Extensions
Secure KeySecure Key Technology
SMEPOS Guard Technology
Flex MemoryFlex Memory Access
ISRTSmart Response Technology
MWTMy WiFi Technology
SIPPStable Image Platform Program
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Facts about "Xeon E3-1275 v6 - Intel"
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Has subobject
"Has subobject" is a predefined property representing a container construct and is provided by Semantic MediaWiki.
Xeon E3-1275 v6 - Intel#package + and Xeon E3-1275 v6 - Intel#io +
base frequency3,800 MHz (3.8 GHz, 3,800,000 kHz) +
bus rate8,000 MT/s (8 GT/s, 8,000,000 kT/s) +
bus typeDMI 3.0 +
chipsetSunrise Point + and Union Point +
clock multiplier38 +
core count4 +
core family6 +
core model158 +
core nameKaby Lake DT +
core steppingB0 +
core voltage (max)1.52 V (15.2 dV, 152 cV, 1,520 mV) +
core voltage (min)0.55 V (5.5 dV, 55 cV, 550 mV) +
designerIntel +
device id0x591D +
familyXeon E3 +
first announcedMarch 28, 2017 +
first launchedMarch 28, 2017 +
full page nameintel/xeon e3/e3-1275 v6 +
has advanced vector extensionstrue +
has advanced vector extensions 2true +
has ecc memory supporttrue +
has extended page tables supporttrue +
has featureAdvanced Vector Extensions +, Advanced Vector Extensions 2 +, Advanced Encryption Standard Instruction Set Extension +, Hyper-Threading Technology +, Turbo Boost Technology 2.0 +, Speed Shift Technology +, Trusted Execution Technology +, Intel vPro Technology +, Intel VT-x +, Intel VT-d +, Transactional Synchronization Extensions +, Secure Key Technology +, Enhanced SpeedStep Technology +, OS Guard +, Extended Page Tables +, Memory Protection Extensions + and Software Guard Extensions +
has intel enhanced speedstep technologytrue +
has intel secure key technologytrue +
has intel speed shift technologytrue +
has intel supervisor mode execution protectiontrue +
has intel trusted execution technologytrue +
has intel turbo boost technology 2 0true +
has intel vpro technologytrue +
has intel vt-d technologytrue +
has intel vt-x technologytrue +
has locked clock multipliertrue +
has second level address translation supporttrue +
has simultaneous multithreadingtrue +
has transactional synchronization extensionstrue +
has x86 advanced encryption standard instruction set extensiontrue +
instance ofmicroprocessor +
integrated gpuHD Graphics P630 +
integrated gpu base frequency350 MHz (0.35 GHz, 350,000 KHz) +
integrated gpu designerIntel +
integrated gpu execution units24 +
integrated gpu max frequency1,150 MHz (1.15 GHz, 1,150,000 KHz) +
integrated gpu max memory1,740.8 MiB (1,782,579.2 KiB, 1,825,361,100.8 B, 1.7 GiB) +
isax86-64 +
isa familyx86 +
l1$ size256 KiB (262,144 B, 0.25 MiB) +
l1d$ description8-way set associative +
l1d$ size128 KiB (131,072 B, 0.125 MiB) +
l1i$ description8-way set associative +
l1i$ size128 KiB (131,072 B, 0.125 MiB) +
l2$ description4-way set associative +
l2$ size1 MiB (1,024 KiB, 1,048,576 B, 9.765625e-4 GiB) +
l3$ description16-way set associative +
l3$ size8 MiB (8,192 KiB, 8,388,608 B, 0.00781 GiB) +
ldateMarch 28, 2017 +
manufacturerIntel +
market segmentWorkstation + and Server +
max cpu count1 +
max memory65,536 MiB (67,108,864 KiB, 68,719,476,736 B, 64 GiB, 0.0625 TiB) +
max memory bandwidth35.76 GiB/s (36,618.24 MiB/s, 38.397 GB/s, 38,397.008 MB/s, 0.0349 TiB/s, 0.0384 TB/s) +
max memory channels2 +
max pcie lanes16 +
max storage temperature398.15 K (125 °C, 257 °F, 716.67 °R) +
microarchitectureKaby Lake +
min storage temperature248.15 K (-25 °C, -13 °F, 446.67 °R) +
model numberE3-1275 v6 +
nameXeon E3-1275 v6 +
packageFCLGA-1151 +
part numberCM8067702870931 + and BX80677E31275V6 +
platformGreenlow +
process14 nm (0.014 μm, 1.4e-5 mm) +
release price$ 339.00 (€ 305.10, £ 274.59, ¥ 35,028.87) +
s-specSR32A +
seriesE3-1200 v6 +
smp max ways1 +
socketLGA-1151 +
supported memory typeDDR4-2400 + and DDR3L-1866 +
tdp73 W (73,000 mW, 0.0979 hp, 0.073 kW) +
technologyCMOS +
thread count8 +
turbo frequency (1 core)4,200 MHz (4.2 GHz, 4,200,000 kHz) +
turbo frequency (2 cores)4,100 MHz (4.1 GHz, 4,100,000 kHz) +
turbo frequency (3 cores)4,100 MHz (4.1 GHz, 4,100,000 kHz) +
turbo frequency (4 cores)4,000 MHz (4 GHz, 4,000,000 kHz) +
word size64 bit (8 octets, 16 nibbles) +
x86/has memory protection extensionstrue +
x86/has software guard extensionstrue +