Semiconductor & Computer Engineering
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Difference between revisions of "intel/core i3/i3-7102e"
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| − | '''Core i3-7102E''' is a {{arch|64}} [[dual-core]] [[x86]] mobile microprocessor introduced by [[Intel]] in early [[2017]]. This chip, which is based on the {{intel|Kaby Lake|l=arch}} microarchitecture, is fabricated on Intel's improved [[14 nm|14 nm+ process]]. This processor, which has a base frequency of 2.1 GHz with a TDP of 25 Watts, supports up to 64 GiB of dual-channel DDR4-2133. The i3-7102E incorporates Intel's {{intel|HD Graphics 630}} [[IGP]] operating at 350 MHz with burst frequency of 950 MHz. | + | '''Core i3-7102E''' is a {{arch|64}} [[dual-core]] low-end performance [[x86]] mobile microprocessor introduced by [[Intel]] in early [[2017]]. This chip, which is based on the {{intel|Kaby Lake|l=arch}} microarchitecture, is fabricated on Intel's improved [[14 nm|14 nm+ process]]. This processor, which has a base frequency of 2.1 GHz with a TDP of 25 Watts, supports up to 64 GiB of dual-channel DDR4-2133. The i3-7102E incorporates Intel's {{intel|HD Graphics 630}} [[IGP]] operating at 350 MHz with burst frequency of 950 MHz. |
Revision as of 18:19, 4 January 2017
Template:mpu Core i3-7102E is a 64-bit dual-core low-end performance x86 mobile microprocessor introduced by Intel in early 2017. This chip, which is based on the Kaby Lake microarchitecture, is fabricated on Intel's improved 14 nm+ process. This processor, which has a base frequency of 2.1 GHz with a TDP of 25 Watts, supports up to 64 GiB of dual-channel DDR4-2133. The i3-7102E incorporates Intel's HD Graphics 630 IGP operating at 350 MHz with burst frequency of 950 MHz.