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Difference between revisions of "intel/xeon e3/e3-1275 v6"
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Revision as of 23:24, 5 November 2016

Template:mpu The Xeon E3-1275 v6 is a 64-bit quad-core x86 microprocessor set to be introduced by Intel in late 2016 or early 2017. Operating at 3.8 GHz, this MPU has a TDP of 78 W. This processor is a Kaby Lake-based chip and is manufactured on a Intel's 14 nm process.


DIL16 Blank.svg Preliminary Data! Information presented in this article deal with a microprocessor or chip that was recently announced or leaked, thus missing information regarding its features and exact specification. Information may be incomplete and can change by final release.

Cache

Main article: Kaby Lake § Cache
Cache Info [Edit Values]
L1I$ 128 KiB
131,072 B
0.125 MiB
4x32 KiB 8-way set associative (per core, write-back)
L1D$ 128 KiB
131,072 B
0.125 MiB
4x32 KiB 8-way set associative (per core, write-back)
L2$ 1 MiB
1,024 KiB
1,048,576 B
9.765625e-4 GiB
4x256 KiB 4-way set associative (per core, write-back)
L3$ 8 MiB
8,192 KiB
8,388,608 B
0.00781 GiB
shared
Has subobject
"Has subobject" is a predefined property representing a container construct and is provided by Semantic MediaWiki.
Xeon E3-1275 v6 - Intel#package + and Xeon E3-1275 v6 - Intel#io +
base frequency3,800 MHz (3.8 GHz, 3,800,000 kHz) +
bus rate8,000 MT/s (8 GT/s, 8,000,000 kT/s) +
bus typeDMI 3.0 +
chipsetSunrise Point + and Union Point +
clock multiplier38 +
core count4 +
core family6 +
core model158 +
core nameKaby Lake DT +
core steppingB0 +
core voltage (max)1.52 V (15.2 dV, 152 cV, 1,520 mV) +
core voltage (min)0.55 V (5.5 dV, 55 cV, 550 mV) +
designerIntel +
device id0x591D +
familyXeon E3 +
first announcedMarch 28, 2017 +
first launchedMarch 28, 2017 +
full page nameintel/xeon e3/e3-1275 v6 +
has advanced vector extensionstrue +
has advanced vector extensions 2true +
has ecc memory supporttrue +
has extended page tables supporttrue +
has featureAdvanced Vector Extensions +, Advanced Vector Extensions 2 +, Advanced Encryption Standard Instruction Set Extension +, Hyper-Threading Technology +, Turbo Boost Technology 2.0 +, Enhanced SpeedStep Technology +, Speed Shift Technology +, Trusted Execution Technology +, Intel vPro Technology +, Intel VT-x +, Intel VT-d +, Extended Page Tables +, Transactional Synchronization Extensions +, Memory Protection Extensions +, Software Guard Extensions +, Secure Key Technology + and OS Guard +
has intel enhanced speedstep technologytrue +
has intel secure key technologytrue +
has intel speed shift technologytrue +
has intel supervisor mode execution protectiontrue +
has intel trusted execution technologytrue +
has intel turbo boost technology 2 0true +
has intel vpro technologytrue +
has intel vt-d technologytrue +
has intel vt-x technologytrue +
has locked clock multipliertrue +
has second level address translation supporttrue +
has simultaneous multithreadingtrue +
has transactional synchronization extensionstrue +
has x86 advanced encryption standard instruction set extensiontrue +
instance ofmicroprocessor +
integrated gpuHD Graphics P630 +
integrated gpu base frequency350 MHz (0.35 GHz, 350,000 KHz) +
integrated gpu designerIntel +
integrated gpu execution units24 +
integrated gpu max frequency1,150 MHz (1.15 GHz, 1,150,000 KHz) +
integrated gpu max memory1,740.8 MiB (1,782,579.2 KiB, 1,825,361,100.8 B, 1.7 GiB) +
isax86-64 +
isa familyx86 +
l1$ size256 KiB (262,144 B, 0.25 MiB) +
l1d$ description8-way set associative +
l1d$ size128 KiB (131,072 B, 0.125 MiB) +
l1i$ description8-way set associative +
l1i$ size128 KiB (131,072 B, 0.125 MiB) +
l2$ description4-way set associative +
l2$ size1 MiB (1,024 KiB, 1,048,576 B, 9.765625e-4 GiB) +
l3$ description16-way set associative +
l3$ size8 MiB (8,192 KiB, 8,388,608 B, 0.00781 GiB) +
ldateMarch 28, 2017 +
manufacturerIntel +
market segmentWorkstation + and Server +
max cpu count1 +
max memory65,536 MiB (67,108,864 KiB, 68,719,476,736 B, 64 GiB, 0.0625 TiB) +
max memory bandwidth35.76 GiB/s (36,618.24 MiB/s, 38.397 GB/s, 38,397.008 MB/s, 0.0349 TiB/s, 0.0384 TB/s) +
max memory channels2 +
max pcie lanes16 +
max storage temperature398.15 K (125 °C, 257 °F, 716.67 °R) +
microarchitectureKaby Lake +
min storage temperature248.15 K (-25 °C, -13 °F, 446.67 °R) +
model numberE3-1275 v6 +
nameXeon E3-1275 v6 +
packageFCLGA-1151 +
part numberCM8067702870931 + and BX80677E31275V6 +
platformGreenlow +
process14 nm (0.014 μm, 1.4e-5 mm) +
release price$ 339.00 (€ 305.10, £ 274.59, ¥ 35,028.87) +
s-specSR32A +
seriesE3-1200 v6 +
smp max ways1 +
socketLGA-1151 +
supported memory typeDDR3L-1866 + and DDR4-2400 +
tdp73 W (73,000 mW, 0.0979 hp, 0.073 kW) +
technologyCMOS +
thread count8 +
turbo frequency (1 core)4,200 MHz (4.2 GHz, 4,200,000 kHz) +
turbo frequency (2 cores)4,100 MHz (4.1 GHz, 4,100,000 kHz) +
turbo frequency (3 cores)4,100 MHz (4.1 GHz, 4,100,000 kHz) +
turbo frequency (4 cores)4,000 MHz (4 GHz, 4,000,000 kHz) +
word size64 bit (8 octets, 16 nibbles) +
x86/has memory protection extensionstrue +
x86/has software guard extensionstrue +