From WikiChip
Difference between revisions of "Flip Chip Ball Grid Array"

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'''Flip Chip Ball Grid Array''' ('''fcBGA''' or simply ''Flip-chip BGA'') is a mid-cost, high-performance, [[Semiconductor package|semiconductor packaging]] solution that utilizes the [[controlled collapse chip connection]] technology, also known as [[flip chip]], for its [[die]] to [[substrate]] interconnection. fcBGA provides the design flexibility for much higher signal density and functionality into a smaller die and packaging footprint. fcBGA packaging is attractive where performance is more important than cost. Flip-chip BGA packages can be mounted using standard [[printed circuit board]]s and can be replaced using existing standard repair practices.
+
[[File:TI 288GTS - FCBGA package footprint.png|thumb|right|TI's 288GTS package footprint - a 288-ball FCBGA package]]
 +
 
 +
'''Flip Chip Ball Grid Array''' ('''FCBGA''' or simply ''Flip-chip BGA'') is a mid-cost, high-performance, [[Semiconductor package|semiconductor packaging]] solution that utilizes the [[controlled collapse chip connection]] technology, also known as [[flip chip]], for its [[die]] to [[substrate]] interconnection. FCBGA provides the design flexibility for much higher signal density and functionality into a smaller die and packaging footprint. FCBGA packaging is attractive where performance is more important than cost. Flip-chip BGA packages can be mounted using standard [[printed circuit board]]s and can be replaced using existing standard repair practices.
  
 
[[File:Typical Flip Chip BGA Package (Cross-Sectional View).png|thumb|350px|right|Typical Flip Chip BGA Package (Cross-Sectional View)]]
 
[[File:Typical Flip Chip BGA Package (Cross-Sectional View).png|thumb|350px|right|Typical Flip Chip BGA Package (Cross-Sectional View)]]
−
Today most flip-chip BGA packages are assembled on two-metal layer or multi-layered, high density ceramic substrates or organic laminate. Additionally fcBGA packages are often offered in bare die, flat lid, and full lid configuration. They are used extensively [[Application-specific integrated circuit|ASIC]], [[Digital signal processor|DSP]], and various other high performance applications.
 
  
−
fcBGA packages is used in all main semiconductor manufacturers such as in the latest [[Intel]]'s [[Core i7]], [[Texas Instruments]] custom [[ASIC]]s, and [[Freescale]] processors.
+
Today most flip-chip BGA packages are assembled on two-metal layer or multi-layered, high density ceramic substrates or organic laminate. Additionally FCBGA packages are often offered in bare die, flat lid, and full lid configuration. They are used extensively [[Application-specific integrated circuit|ASIC]], [[Digital signal processor|DSP]], and various other high performance applications.
 +
 
 +
FCBGA packages is used in all main semiconductor manufacturers such as in the latest [[Intel]]'s [[Core i7]], [[Texas Instruments]] custom [[ASIC]]s, and [[Freescale]] processors.
  
−
[[File:TI 288GTS - FCBGA package footprint.png|thumb|right|TI's 288GTS package footprint - a 288-ball FCBGA package]]
 
  
 
== μFCBGA ==
 
== μFCBGA ==
Line 26: Line 28:
  
 
== BGA CPU Packages ==
 
== BGA CPU Packages ==
−
* [[packages/bga-1288|BGA-1288]] ([[Intel]])
+
===[[AMD]] BGA Packages===
 +
:; [[amd/List of AMD CPU sockets|List of AMD CPU sockets]]
  
 
<table class="wikitable sortable">
 
<table class="wikitable sortable">
Line 35: Line 38:
 
<!-- [[Category:~*]] -->
 
<!-- [[Category:~*]] -->
 
  [[instance of::package]]
 
  [[instance of::package]]
−
  [[designer::~*]]
+
  [[designer::~*AMD*]]
 
  [[package::~*BGA*]]
 
  [[package::~*BGA*]]
 
  |?name
 
  |?name
Line 51: Line 54:
 
  |template=proc table 2
 
  |template=proc table 2
 
  |userparam=9
 
  |userparam=9
 +
|limit=100
 +
|valuesep=,
 +
|mainlabel=-
 +
}}
 +
</table>
 +
 +
===[[Intel]] BGA Packages===
 +
* [[packages/bga-1288|BGA-1288]] ([[Intel]])
 +
 +
* FCBGA-1377 • Ice Lake Y
 +
* FCBGA-1392 • Cannon Lake Y
 +
* FCBGA-1440 (42 x 28 mm) • Coffee Lake H, HR
 +
* FCBGA-1510 • Cannon Lake U
 +
* FCBGA-1515 (20 x 16.5 mm) • Amber Lake Y
 +
* FCBGA-1526 (50 x 25 mm) • Ice Lake U
 +
* FCBGA-1528 • Whiskey Lake U
 +
* FCBGA-1667 (37.5 x 37.5 mm) • Broadwell DE, Hewitt Lake
 +
* FCBGA-2579 • Ice Lake D
 +
* FCBGA-3325 (60 x 60 mm) • Intel Nervana
 +
* FCBGA-5903 • Cascade Lake AP
 +
 +
===LGA===
 +
 +
* FCLGA-1151 • FCLGA14C (37.5 x 37.5 mm) • Coffee Lake S, E
 +
:• LGA-1151 • Socket H4
 +
 +
* FCLGA-1700 (45.0 x 37.5 mm) • Alder Lake S
 +
:• LGA-1700 • Socket V
 +
 +
* FCLGA-2601 (50 x 50 mm) • IBM Power9 Sforza
 +
:• PLGA-2601
 +
 +
 +
=== [[Intel]] CPU Packages ===
 +
 +
* FCBGA-437 • BGA-437 • [[Bonnell]]
 +
* FCBGA-441 • BGA-441 • [[Bonnell]]
 +
* FCBGA-518 • BGA-518 • [[Bonnell]]
 +
* rPGA-988A (BGA-1288) • [[Westmere]]
 +
* rPGA-988B (FCBGA-1023/FCBGA-1224) • [[Socket G2]] • [[Sandy Bridge]]
 +
* FCBGA-1023 • [[Sandy Bridge]]
 +
* FCBGA-1090 • [[Goldmont Plus]]
 +
* FCLGA-1151 • LGA-1151 • [[Skylake]] • [[Kaby Lake]]
 +
* FCLGA-1151 (FCLGA14C) • [[Socket H4]] • [[Coffee Lake]]
 +
* FCBGA-1288 • [[packages/bga-1288|BGA-1288]] • [[Westmere]]
 +
* FCBGA-1310 • [[Goldmont]]
 +
* FCBGA-1356 • BGA-1356 • [[Skylake]] • [[Kaby Lake]]
 +
* FCBGA-1440 • [[Coffee Lake]]
 +
* FCBGA-1510 • [[Cannon Lake]]
 +
* FCBGA-1528 • [[Coffee Lake]] • [[Whiskey Lake]]
 +
* FCLGA-2011-v3 • LGA-2011-v3 • [[Westmere]], [[Ivy Bridge]], [[Haswell]], [[Broadwell]]
 +
* FCLGA-2066 • [[Socket R]] • [[Skylake]] • [[Kaby Lake]]
 +
* FCLGA-2066 • [[Socket R4]] • [[Skylake (server)]] • [[Cascade Lake]]
 +
* FCBGA-2518 • [[Skylake (server)]]
 +
* FCBGA-2579 • [[Ice Lake|Ice Lake (server)]]
 +
* FCBGA-3325 • Spring Crest
 +
* FCLGA-3647 • [[Socket P]] • [[Cascade Lake]] • [[Skylake (server)]]
 +
* FCLGA-4189 • LGA-4189 • [[Socket P+]] (W) • [[Ice Lake|Ice Lake (server)]]
 +
* FCBGA-5903 • [[Cascade Lake]]
 +
 +
<table class="wikitable sortable">
 +
<tr><th colspan="8" style="background:#D6D6FF;">Intel CPU Packages</th></tr>
 +
<tr><th colspan="4">General</th><th colspan="4">Details</th></tr>
 +
<tr><th>Package</th><th>Name</th><th>Contacts</th><th>[[TDP]]</th><th>Socket</th><th>[[µarch]]</th><th>Market</th><th>Release</th></tr>
 +
{{#ask:
 +
<!-- [[Category:~*]]
 +
[[instance of::package]] -->
 +
[[package::~*FCBGA-4*]]
 +
[[designer::Intel]]
 +
|?package
 +
|?package
 +
|?name
 +
|?package contacts
 +
|?tdp
 +
|?socket
 +
|?microarchitecture
 +
|?market segment
 +
|?first_launched
 +
|sort=name
 +
|order=ascending
 +
|format=template
 +
|template=proc table 2
 +
|userparam=9
 +
|limit=100
 
  |valuesep=,
 
  |valuesep=,
 
  |mainlabel=-
 
  |mainlabel=-
 
}}
 
}}
 
</table>
 
</table>
 +
 +
===See also===
 +
*[[AMD]]
 +
*[[Intel]]
 +
*[[BGA]]
 +
*[[LGA]]
 +
<!--
 +
<pre>
 +
local data =
 +
{
 +
packages =
 +
{
 +
 +
amd = {},
 +
 +
ibm =
 +
{
 +
-- Power9 Sforza
 +
fclga_2601 =
 +
{
 +
p_name = { 'FCLGA-2601' },
 +
p_type = 'PLGA',
 +
p_size = { '50 mm', '50 mm' },
 +
p_pitch = { '1.016 mm'},
 +
p_contacts = 2601
 +
}
 +
},
 +
 +
 +
intel =
 +
{
 +
-- Alder Lake S
 +
fclga_1700 =
 +
{
 +
p_name = { 'FCLGA-1700' },
 +
p_type = 'LGA',
 +
p_size = { '45.0 mm', '37.5 mm' },
 +
p_contacts = 1700,
 +
p_socket = { 'Socket V' }
 +
},
 +
-- Ice Lake D
 +
fcbga_2579 =
 +
{
 +
p_name = { 'FCBGA-2579' },
 +
p_type = 'BGA',
 +
p_contacts = 2579
 +
},
 +
-- Ice Lake SP
 +
fclga_4189 =
 +
{
 +
p_name = { 'FCLGA-4189' },
 +
p_type = 'LGA',
 +
p_contacts = 4189,
 +
p_socket = { 'Socket W', 'LGA-4189' }
 +
},
 +
-- Ice Lake Y
 +
fcbga_1377 =
 +
{
 +
p_name = { 'FCBGA-1377' },
 +
p_type = 'BGA',
 +
p_size = { '26.5 mm', '18.5 mm', '1.0 mm' },
 +
p_pitch = { '0.43 mm'},
 +
p_contacts = 1377,
 +
p_socket = { 'Type 3' }
 +
},
 +
-- Ice Lake U
 +
fcbga_1526 =
 +
{
 +
p_name = { 'FCBGA-1526' },
 +
p_type = 'BGA',
 +
p_size = { '50 mm', '25 mm', '1.3 mm' },
 +
p_pitch = { '0.65 mm'},
 +
p_contacts = 1526,
 +
p_socket = { 'Type 4' }
 +
},
 +
-- Cannon Lake Y
 +
fcbga_1392 =
 +
{
 +
p_name = { 'FCBGA-1392' },
 +
p_type = 'BGA',
 +
p_contacts = 1392
 +
},
 +
-- Cannon Lake U
 +
fcbga_1510 =
 +
{
 +
p_name = { 'FCBGA-1510' },
 +
p_type = 'BGA',
 +
p_contacts = 1510
 +
},
 +
-- Cascade Lake AP
 +
fcbga_5903 =
 +
{
 +
p_name = { 'FCBGA-5903' },
 +
p_type = 'BGA',
 +
p_pitch = { '0.99 mm'},
 +
p_contacts = 5903
 +
},
 +
-- Skylake SP, Cascade Lake SP
 +
fclga_3647 =
 +
{
 +
p_name = { 'FCLGA-3647' },
 +
p_type    = 'FCLGA',
 +
p_size = { '76.16 mm', '56.6 mm' },
 +
p_pitch = { '0.8585 mm', '0.9906 mm'},
 +
p_contacts = 3647,
 +
p_socket = { 'Socket P', 'LGA-3647' }
 +
},
 +
-- Skylake X, Skylake X Refresh
 +
fclga_2066 =
 +
{
 +
p_name = { 'FCLGA-2066' },
 +
p_type = 'LGA',
 +
p_size = { '52.5 mm', '45 mm' },
 +
p_pitch = { '1.016 mm'},
 +
p_contacts = 2066,
 +
p_socket = { 'Socket R4' }
 +
},
 +
-- Whiskey Lake U
 +
fcbga_1528 =
 +
{
 +
p_name = { 'FCBGA-1528' },
 +
p_type = 'BGA',
 +
p_contacts = 1528
 +
},
 +
-- Coffee Lake S, E
 +
fclga_1151 =
 +
{
 +
p_name = { 'FCLGA-1151', 'FCLGA14C' },
 +
p_type = 'LGA',
 +
p_size = { '37.5 mm', '37.5 mm', '4.4 mm' },
 +
p_pitch = { '0.914 mm'},
 +
p_contacts = 1151,
 +
p_socket = { 'Socket H4', 'LGA-1151' }
 +
},
 +
-- Coffee Lake H, HR
 +
fcbga_1440 =
 +
{
 +
p_name = { 'FCBGA-1440' },
 +
p_type = 'BGA',
 +
p_size = { '42 mm', '28 mm', '1.46 mm' },
 +
p_contacts = 1440
 +
},
 +
-- Amber Lake Y
 +
fcbga_1515 =
 +
{
 +
p_name = { 'FCBGA-1515' },
 +
p_type = 'BGA',
 +
p_size = { '20 mm', '16.5 mm', '0.5 mm' },
 +
p_pitch = { '0.4 mm' },
 +
p_contacts = 1515,
 +
},
 +
-- Broadwell DE, Hewitt Lake
 +
fcbga_1667 =
 +
{
 +
p_name = { 'FCBGA-1667' },
 +
p_type    = 'FCBGA',
 +
p_size = { '37.5 mm', '37.5 mm', '3.557 mm' },
 +
p_pitch = { '0.7 mm'},
 +
p_contacts = 1667
 +
},
 +
 +
 +
 +
 +
-- Intel Nervana
 +
fcbga_3325 =
 +
{
 +
p_name = { 'FCBGA-3325' },
 +
p_type    = 'FCBGA',
 +
p_size = { '60 mm', '60 mm' },
 +
p_contacts = 3325
 +
},
 +
},
 +
 +
cavium =
 +
{
 +
-- Vulcan
 +
fclga_4077 =
 +
{
 +
p_name = { 'FCLGA-4077' },
 +
p_type = 'LGA',
 +
p_contacts = 4077
 +
}
 +
},
 +
 +
phytium =
 +
{
 +
-- Earth
 +
fcbga_1150 =
 +
{
 +
p_name = { 'FCBGA-1150' },
 +
p_type = 'BGA',
 +
p_size = { '37.5 mm', '37.5 mm' },
 +
p_pitch = { '0.914 mm'},
 +
p_contacts = 1150
 +
},
 +
fcbga_1944 =
 +
{
 +
p_name = { 'FCBGA-1944' },
 +
p_type = 'BGA',
 +
p_size = { '42.5 mm', '60 mm' },
 +
p_pitch = { '1.0 mm'},
 +
p_contacts = 1944
 +
},
 +
 +
-- Mars II
 +
fcbga_3576 =
 +
{
 +
p_name = { 'FCBGA-3576' },
 +
p_type = 'BGA',
 +
p_size = { '61 mm', '61 mm' },
 +
p_contacts = 3576
 +
}
 +
},
 +
 +
 +
tesla_car =
 +
{
 +
-- FSD chip
 +
fcbga_2116 =
 +
{
 +
p_name = { 'FCBGA-2116' },
 +
p_type = 'BGA',
 +
p_size = { '37.5 mm', '37.5 mm' },
 +
p_contacts = 2116
 +
}
 +
},
 +
 +
 +
mobileye =
 +
{
 +
-- EyeQ1
 +
hsbga_292 =
 +
{
 +
p_name = { 'HSBGA-292' },
 +
p_type = 'BGA',
 +
p_size = { '27 mm', '27 mm' },
 +
p_pitch = { '1.27 mm'},
 +
p_contacts = 292
 +
}
 +
},
 +
 +
 +
eta_compute =
 +
{
 +
-- ECM3532
 +
bga81 =
 +
{
 +
p_name = { 'BGA-81' },
 +
p_type = 'BGA',
 +
p_size = { '5 mm', '5 mm' },
 +
p_contacts = 81
 +
}
 +
},
 +
 +
}
 +
}
 +
</pre>
 +
-->
  
 
[[Category:Semiconductor packages]]
 
[[Category:Semiconductor packages]]
 +
[[Category:Intel]]
 +
[[Category:AMD]]

Revision as of 22:02, 5 October 2025

TI's 288GTS package footprint - a 288-ball FCBGA package

Flip Chip Ball Grid Array (FCBGA or simply Flip-chip BGA) is a mid-cost, high-performance, semiconductor packaging solution that utilizes the controlled collapse chip connection technology, also known as flip chip, for its die to substrate interconnection. FCBGA provides the design flexibility for much higher signal density and functionality into a smaller die and packaging footprint. FCBGA packaging is attractive where performance is more important than cost. Flip-chip BGA packages can be mounted using standard printed circuit boards and can be replaced using existing standard repair practices.

Typical Flip Chip BGA Package (Cross-Sectional View)

Today most flip-chip BGA packages are assembled on two-metal layer or multi-layered, high density ceramic substrates or organic laminate. Additionally FCBGA packages are often offered in bare die, flat lid, and full lid configuration. They are used extensively ASIC, DSP, and various other high performance applications.

FCBGA packages is used in all main semiconductor manufacturers such as in the latest Intel's Core i7, Texas Instruments custom ASICs, and Freescale processors.


μFCBGA

μFCBGA or micro-FCBGA is a line of fcBGA packages that ships with Intel's line of processors.

BGA CPU Packages

AMD BGA Packages

List of AMD CPU sockets
BGA CPU Packages
GeneralDetails
NamePackageContactsTDPSocketµarchMarketRelease
Package ASB1ASB1, BGA-81281218 W
18,000 mW
0.0241 hp
0.018 kW
K8Mobile8 January 2009
Package ASB2ASB2, BGA-81281215 W
15,000 mW
0.0201 hp
0.015 kW
K10Mobile12 May 2010
Package CBGA-360CBGA-36036011 W
11,000 mW
0.0148 hp
0.011 kW
K6Mobile5 March 1998
Package FP2BGA-827, FP282725 W
25,000 mW
0.0335 hp
0.025 kW
PiledriverMobile, Embedded15 May 2012
Package FP3BGA-854, FP385435 W
35,000 mW
0.0469 hp
0.035 kW
SteamrollerMobile, EmbeddedJune 2014
Package FP4BGA-968, FP496845 W
45,000 mW
0.0603 hp
0.045 kW
ExcavatorMobile, EmbeddedJune 2015
Package FP5BGA-11401,14045 W
45,000 mW
0.0603 hp
0.045 kW
Zen, Zen+Mobile, Embedded8 January 2018
Package FP6BGA-11401,14055 W
55,000 mW
0.0738 hp
0.055 kW
Zen 2, Zen 3Mobile, Embedded16 March 2020
Package FT1BGA-413, UOB-41341318 W
18,000 mW
0.0241 hp
0.018 kW
BobcatMobile, Embedded4 January 2011
Package FT3BGA-76976925 W
25,000 mW
0.0335 hp
0.025 kW
JaguarMobile, EmbeddedMay 2013
Package FT3bBGA-76976925 W
25,000 mW
0.0335 hp
0.025 kW
PumaMobile, Embedded4 June 2014
Package FT4BGA-76976915 W
15,000 mW
0.0201 hp
0.015 kW
ExcavatorMobileJune 2016
Package OBGA-349OBGA-34934918 W
18,000 mW
0.0241 hp
0.018 kW
K6Embedded25 September 2000
Package SP1BGA-10211,02132 W
32,000 mW
0.0429 hp
0.032 kW
Cortex-A57Embedded, ServerJanuary 2016
Package SP4BGA-20282,028100 W
100,000 mW
0.134 hp
0.1 kW
ZenEmbedded21 February 2018
Package SP4r2BGA-20282,02855 W
55,000 mW
0.0738 hp
0.055 kW
ZenEmbedded21 February 2018

Intel BGA Packages

  • FCBGA-1377 • Ice Lake Y
  • FCBGA-1392 • Cannon Lake Y
  • FCBGA-1440 (42 x 28 mm) • Coffee Lake H, HR
  • FCBGA-1510 • Cannon Lake U
  • FCBGA-1515 (20 x 16.5 mm) • Amber Lake Y
  • FCBGA-1526 (50 x 25 mm) • Ice Lake U
  • FCBGA-1528 • Whiskey Lake U
  • FCBGA-1667 (37.5 x 37.5 mm) • Broadwell DE, Hewitt Lake
  • FCBGA-2579 • Ice Lake D
  • FCBGA-3325 (60 x 60 mm) • Intel Nervana
  • FCBGA-5903 • Cascade Lake AP

LGA

  • FCLGA-1151 • FCLGA14C (37.5 x 37.5 mm) • Coffee Lake S, E
• LGA-1151 • Socket H4
  • FCLGA-1700 (45.0 x 37.5 mm) • Alder Lake S
• LGA-1700 • Socket V
  • FCLGA-2601 (50 x 50 mm) • IBM Power9 Sforza
• PLGA-2601


Intel CPU Packages

Intel CPU Packages
GeneralDetails
PackageNameContactsTDPSocketµarchMarketRelease
FCBGA-437Atom 2304 W
4,000 mW
0.00536 hp
0.004 kW
BGA-437BonnellMobile3 June 2008
FCBGA-437Atom 3308 W
8,000 mW
0.0107 hp
0.008 kW
BGA-437BonnellMobile21 September 2008
FCBGA-437Atom N2702.5 W
2,500 mW
0.00335 hp
0.0025 kW
BGA-437BonnellMobile3 June 2008
FCBGA-437Atom N2802.5 W
2,500 mW
0.00335 hp
0.0025 kW
BGA-437BonnellMobile7 February 2009
FCBGA-441Atom Z5000.65 W
650 mW
8.7165e-4 hp
6.5e-4 kW
BGA-441BonnellMobile2 April 2008
FCBGA-441Atom Z5102 W
2,000 mW
0.00268 hp
0.002 kW
BGA-441BonnellMobile2 April 2008
FCBGA-437Atom Z510P2 W
2,000 mW
0.00268 hp
0.002 kW
BGA-437BonnellMobile2 March 2009
FCBGA-437Atom Z510PT2 W
2,000 mW
0.00268 hp
0.002 kW
BGA-437BonnellMobile2 March 2009
FCBGA-441Atom Z5150.65 W
650 mW
8.7165e-4 hp
6.5e-4 kW
BGA-441BonnellMobile8 April 2009
FCBGA-441Atom Z5202 W
2,000 mW
0.00268 hp
0.002 kW
BGA-441BonnellMobile2 April 2008
FCBGA-437Atom Z520PT2 W
2,000 mW
0.00268 hp
0.002 kW
BGA-437BonnellMobile2 March 2009
FCBGA-441Atom Z5302.2 W
2,200 mW
0.00295 hp
0.0022 kW
BGA-441BonnellMobile2 April 2008
FCBGA-437Atom Z530P2 W
2,000 mW
0.00268 hp
0.002 kW
BGA-437BonnellMobile2 March 2009
FCBGA-441Atom Z5402.4 W
2,400 mW
0.00322 hp
0.0024 kW
BGA-441BonnellMobile2 April 2008
FCBGA-441Atom Z5502.4 W
2,400 mW
0.00322 hp
0.0024 kW
BGA-441BonnellMobile8 April 2009
FCBGA-441Atom Z5602.5 W
2,500 mW
0.00335 hp
0.0025 kW
BGA-441BonnellMobileJune 2010
FCBGA-437, PBGA-441Intel AtomBGABonnell2 April 2008

See also

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