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Difference between revisions of "1958"
(1958) |
(No difference)
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Latest revision as of 18:40, 27 December 2022
1958 | |
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Unix Time | -378691200 - -347155201 |
Years | |
In 1958:
- October 23: William Shockley files a patent application for the through-silicon via (TSV), then called "deep pits" (U.S. Patent 3,044,909).
Retrieved from "https://en.wikichip.org/w/index.php?title=1958&oldid=101052"