Revision as of 21:05, 2 July 2022

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Packaging

Technologies

Wire bonding TCI TSV TGV F2F FC

Concepts

COB CSP PiP SiP PoP

Single-Row

SiP

Dual-Row

DIP DFN SOIC TSOP ZIP

Quad-Row

QFN

Grid Array

BGA LGA PGA

2.5D IC

2.5D IC Interposer Embedded Interposer Embedded Bridge CoWoS EMIB

3D IC

3D IC Foveros WoW SoIC

Hybrid Bonding Interconnect (HBI) or Direct Bond Interconnect (DBI) is a high-performance high-density vertical die-to-die interconnect technology used to transmit signal and power between multiple stacked dies through the direct attachment of two homogeneous surfaces forming strong covalent bonds.