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− | '''EPYC 75F3''' is a {{arch|64}} [[32-core]] [[x86]] server microprocessor designed and introduced by [[AMD]] in March [[2021]]. This [[multi-chip package|multi-chip processor]], which is based on the {{amd|Zen 3|Zen 3 microarchitecture|l=arch}}, incorporates eight Core Complex Dies fabricated on a [[TSMC]] advanced [[7 nm process]] and a large I/O die manufactured by [[GlobalFoundries]]. The 75F3 has a TDP of 280 W with a base frequency of 2.95 | + | '''EPYC 75F3''' is a {{arch|64}} [[32-core]] [[x86]] server microprocessor designed and introduced by [[AMD]] in March [[2021]]. This [[multi-chip package|multi-chip processor]], which is based on the {{amd|Zen 3|Zen 3 microarchitecture|l=arch}}, incorporates eight Core Complex Dies fabricated on a [[TSMC]] advanced [[7 nm process]] and a large I/O die manufactured by [[GlobalFoundries]]. The 75F3 has a TDP of 280 W with a base frequency of 2.95 GHz and a {{amd|precision boost|boost}} frequency of up to 4 GHz. This processor supports up to two-way [[symmetric multiprocessing|SMP]] and up to 4 TiB of eight channel DDR4-3200 memory per socket. |
This is a frequency optimized SKU with high cache/core ratio, binned for high performance per core. | This is a frequency optimized SKU with high cache/core ratio, binned for high performance per core. | ||
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|l3 break=8 × 32 MiB | |l3 break=8 × 32 MiB | ||
+ | |l3 desc=16-way set associative | ||
+ | |l3 policy=write-back | ||
}} | }} | ||
Latest revision as of 21:28, 18 May 2021
Edit Values | |
EPYC 75F3 | |
General Info | |
Designer | AMD |
Manufacturer | TSMC, GlobalFoundries |
Model Number | 75F3 |
Part Number | 100-000000313, 100-100000313WOF |
Market | Server |
Introduction | January 12, 2021 (announced) March 15, 2021 (launched) |
Release Price | $4,860 |
Shop | Amazon |
General Specs | |
Family | EPYC |
Series | 7003 |
Locked | Yes |
Frequency | 2,950 MHz |
Turbo Frequency | 4,000 MHz |
Clock multiplier | 29.5 |
Microarchitecture | |
ISA | x86-64 (x86) |
Microarchitecture | Zen 3 |
Core Name | Milan |
Core Family | 25 |
Core Model | 1 |
Core Stepping | B1 |
Process | 7 nm+ |
Technology | CMOS |
MCP | Yes (9 dies) |
Word Size | 64 bit |
Cores | 32 |
Threads | 64 |
Max Memory | 4 TiB |
Multiprocessing | |
Max SMP | 2-Way (Multiprocessor) |
Electrical | |
TDP | 280 W |
cTDP down | 225 W |
Packaging | |
Package | SP3, FCLGA-4094 (FC-OLGA) |
Dimension | 75.4 mm × 58.5 mm × 6.26 mm |
Pitch | 0.87 mm × 1 mm |
Contacts | 4094 |
Socket | SP3, LGA-4094 |
EPYC 75F3 is a 64-bit 32-core x86 server microprocessor designed and introduced by AMD in March 2021. This multi-chip processor, which is based on the Zen 3 microarchitecture, incorporates eight Core Complex Dies fabricated on a TSMC advanced 7 nm process and a large I/O die manufactured by GlobalFoundries. The 75F3 has a TDP of 280 W with a base frequency of 2.95 GHz and a boost frequency of up to 4 GHz. This processor supports up to two-way SMP and up to 4 TiB of eight channel DDR4-3200 memory per socket.
This is a frequency optimized SKU with high cache/core ratio, binned for high performance per core.
Cache[edit]
- Main article: Zen 3 § Cache
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Cache Organization
Cache is a hardware component containing a relatively small and extremely fast memory designed to speed up the performance of a CPU by preparing ahead of time the data it needs to read from a relatively slower medium such as main memory. The organization and amount of cache can have a large impact on the performance, power consumption, die size, and consequently cost of the IC. Cache is specified by its size, number of sets, associativity, block size, sub-block size, and fetch and write-back policies. Note: All units are in kibibytes and mebibytes. |
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Memory controller[edit]
- Main article: Milan § Memory Interface
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Integrated Memory Controller
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Expansions[edit]
- Main article: Milan § I/O Interfaces
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Expansion Options |
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Features[edit]
[Edit/Modify Supported Features]
References[edit]
- "AMD EPYC™ 7003 Series CPUs Set New Standard as Highest Performance Server Processor" (Press release). AMD.com. March 15, 2021. Retrieved May 2021.
- "AMD EPYC™ 7003 Series Processors: The New Standard for the Modern Datacenter", AMD Publ. #LE-77202, Rev. 00, February 2021
- "AMD Processor Specifications". AMD.com. Retrieved May 2021.
- "AMD EPYC™ 75F3". AMD.com. Retrieved May 2021.
Facts about "EPYC 75F3 - AMD"
Has subobject "Has subobject" is a predefined property representing a container construct and is provided by Semantic MediaWiki. | EPYC 75F3 - AMD#pcie + |
base frequency | 2,950 MHz (2.95 GHz, 2,950,000 kHz) + |
clock multiplier | 29.5 + |
core count | 32 + |
core family | 25 + |
core model | 1 + |
core name | Milan + |
core stepping | B1 + |
designer | AMD + |
die count | 9 + |
family | EPYC + |
first announced | January 12, 2021 + |
first launched | March 15, 2021 + |
full page name | amd/epyc/75f3 + |
has advanced vector extensions | true + |
has advanced vector extensions 2 | true + |
has amd amd-v technology | true + |
has amd amd-vi technology | true + |
has amd secure encrypted virtualization technology | true + |
has amd secure memory encryption technology | true + |
has amd sensemi technology | true + |
has amd transparent secure memory encryption technology | true + |
has ecc memory support | true + |
has feature | Advanced Vector Extensions +, Advanced Vector Extensions 2 +, Advanced Encryption Standard Instruction Set Extension + and SenseMI Technology + |
has locked clock multiplier | true + |
has simultaneous multithreading | true + |
has x86 advanced encryption standard instruction set extension | true + |
instance of | microprocessor + |
is multi-chip package | true + |
isa | x86-64 + |
isa family | x86 + |
l1$ size | 2,048 KiB (2,097,152 B, 2 MiB) + |
l1d$ description | 8-way set associative + |
l1d$ size | 1,024 KiB (1,048,576 B, 1 MiB) + |
l1i$ description | 8-way set associative + |
l1i$ size | 1,024 KiB (1,048,576 B, 1 MiB) + |
l2$ description | 8-way set associative + |
l2$ size | 16 MiB (16,384 KiB, 16,777,216 B, 0.0156 GiB) + |
l3$ description | 16-way set associative + |
l3$ size | 256 MiB (262,144 KiB, 268,435,456 B, 0.25 GiB) + |
ldate | March 15, 2021 + |
manufacturer | TSMC + and GlobalFoundries + |
market segment | Server + |
max cpu count | 2 + |
max memory | 4,194,304 MiB (4,294,967,296 KiB, 4,398,046,511,104 B, 4,096 GiB, 4 TiB) + |
max memory bandwidth | 190.73 GiB/s (195,307.52 MiB/s, 204.795 GB/s, 204,794.778 MB/s, 0.186 TiB/s, 0.205 TB/s) + |
max memory channels | 8 + |
max sata ports | 32 + |
max usb ports | 4 + |
microarchitecture | Zen 3 + |
model number | 75F3 + |
name | EPYC 75F3 + |
package | SP3 + and FCLGA-4094 + |
part number | 100-000000313 + and 100-100000313WOF + |
part of | Frequency-optimized SKUs + |
release price | $ 4,860.00 (€ 4,374.00, £ 3,936.60, ¥ 502,183.80) + |
series | 7003 + |
smp max ways | 2 + |
socket | SP3 + and LGA-4094 + |
supported memory type | DDR4-3200 + |
tdp | 280 W (280,000 mW, 0.375 hp, 0.28 kW) + |
tdp down | 225 W (225,000 mW, 0.302 hp, 0.225 kW) + |
technology | CMOS + |
thread count | 64 + |
turbo frequency | 4,000 MHz (4 GHz, 4,000,000 kHz) + |
word size | 64 bit (8 octets, 16 nibbles) + |