Semiconductor & Computer Engineering
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Difference between revisions of "through-silicon via"
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'''Through-Silicon Via''' ('''TSV''') is a high-performance [[vertical signaling|vertical]] [[interconnect]] technology used to transmit signals between multiple [[stacked dies]] through piercings in the individual dies. TSV is an alternative technology to [[thruchip interface|TCI]]. | '''Through-Silicon Via''' ('''TSV''') is a high-performance [[vertical signaling|vertical]] [[interconnect]] technology used to transmit signals between multiple [[stacked dies]] through piercings in the individual dies. TSV is an alternative technology to [[thruchip interface|TCI]]. | ||
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Revision as of 00:20, 25 December 2018
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Through-Silicon Via (TSV) is a high-performance vertical interconnect technology used to transmit signals between multiple stacked dies through piercings in the individual dies. TSV is an alternative technology to TCI.
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