From WikiChip
Difference between revisions of "thruchip interface"

(tci)
 
Line 1: Line 1:
 
{{title|ThruChip Interface (TCI)}}{{3d integration}}
 
{{title|ThruChip Interface (TCI)}}{{3d integration}}
−
'''ThruChip Interface''' ('''TCI''') is a high-performance [[wireless communication|wireless]] [[vertical signaling|vertical]] [[interconnect]] technology used to transmit signals across multiple [[stacked dies]]. TCI is an alternative technology to [[through-silicon via]].
+
'''ThruChip Interface''' ('''TCI''') is a high-performance [[wireless communication|wireless]] [[vertical signaling|vertical]] [[interconnect]] technology used to transmit signals between multiple [[stacked dies]]. TCI is an alternative technology to [[through-silicon via]].

Revision as of 14:24, 21 April 2018

Template:3d integration ThruChip Interface (TCI) is a high-performance wireless vertical interconnect technology used to transmit signals between multiple stacked dies. TCI is an alternative technology to through-silicon via.

Retrieved from "https://en.wikichip.org/w/index.php?title=thruchip_interface&oldid=77459"