Semiconductor & Computer Engineering
From WikiChip
Difference between revisions of "Template:wafer tech"
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** [[wafer etching|Wafer etching]] | ** [[wafer etching|Wafer etching]] | ||
** [[wafer polishing|Wafer polishing]] | ** [[wafer polishing|Wafer polishing]] | ||
| − | ** [[epitaxial wafer|Epitaxial wafer]] | + | * Additional layers |
| + | ** [[epitaxial deposition|Epitaxial deposition]] | ||
| + | *** [[epitaxial wafer|Epitaxial wafer]] | ||
| + | ** [[layer transfer|Layer transfer]] (LT) | ||
| + | *** [[soi wafer|SOI wafer]] | ||
* Preparation | * Preparation | ||
** [[wafer inspection|Wafer inspection]] | ** [[wafer inspection|Wafer inspection]] | ||
Latest revision as of 11:09, 5 March 2018
Ingot Production
- Silicon
- Metallurgical-grade silicon (MGS)
- Upgraded MGS (UMGS)
- Electronic-grade silicon (EGS)
- Crystal Growth
- Czochralski growth (CZ)
- Float-zone growth (FZ)
- Preparation
Wafer Processing
- Slicing
- Profile control
- Additional layers
- Preparation