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== Overview ==
 
== Overview ==
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[[File:8th gen core i7 with radeon logo (2018).png|250px|right]]
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[[File:8th gen core i5 with radeon logo (2018).png|250px|right]]
 
Kaby Lake G based processors are a 2-chip solution - the [[microprocessor]] and the [[chipset]]. Those parts are [[BGA]] and are soldered onto the motherboard. The microprocessor is connected to the chipset via 4 of the chip's 20 PCIe lanes using Intel's proprietary {{intel|Direct Media Interface}} 3.0 (DMI 3.0), allowing for 8 GT/s transfer rate per lane.
 
Kaby Lake G based processors are a 2-chip solution - the [[microprocessor]] and the [[chipset]]. Those parts are [[BGA]] and are soldered onto the motherboard. The microprocessor is connected to the chipset via 4 of the chip's 20 PCIe lanes using Intel's proprietary {{intel|Direct Media Interface}} 3.0 (DMI 3.0), allowing for 8 GT/s transfer rate per lane.
  

Revision as of 18:54, 6 January 2018

Edit Values
Kaby Lake G
kaby lake g (front).png
Package front
General Info
DesignerIntel, AMD
ManufacturerIntel, GlobalFoundries
IntroductionNovember 6, 2017 (announced)
January 7, 2018 (launched)
Microarchitecture
ISAx86-64 (x86)
MicroarchitectureKaby Lake
Word Size
8 octets
16 nibbles
64 bit
Process14 nm
0.014 μm
1.4e-5 mm
TechnologyCMOS

Kaby Lake G (KBL-G) is the name of the core for Intel's high-performance line of mobile processors based on the Kaby Lake microarchitecture and incorporate a discrete AMD Vega graphics processor. These chips are targeted towards ultimate mobile gaming experience. Kaby Lake G processors are fabricated on Intel's enhanced 14nm+ process and for graphics, GlobalFoundries 14 nm process.


Symbol version future.svg Preliminary Data! Information presented in this article deal with future products, data, features, and specifications that have yet to be finalized, announced, or released. Information may be incomplete and can change by final release.


Overview

8th gen core i7 with radeon logo (2018).png
8th gen core i5 with radeon logo (2018).png

Kaby Lake G based processors are a 2-chip solution - the microprocessor and the chipset. Those parts are BGA and are soldered onto the motherboard. The microprocessor is connected to the chipset via 4 of the chip's 20 PCIe lanes using Intel's proprietary Direct Media Interface 3.0 (DMI 3.0), allowing for 8 GT/s transfer rate per lane.

Graphics

Those processors are unique in the fact that this is the first time Intel has integrated a discrete graphics processor into the same package as the microprocessor. This is also the first time they are using a competitor graphics processor. Those parts incorporate an AMD GPU based on the Vega microarchitecture and incorporate their own 4 GiB of high-bandwidth memory 2 (HBM2). The HBM solution is connected to the graphics processor using Intel's EMIB, a high-speed in-package interconnect solution.

The CPU itself is connected to the GPU using 8 of the other PCIe lanes, leaving the 8 remaining lanes for other peripherals to communicate with the CPU directly.


kaby lake g with amd radeon package.png


Common Features

All Kaby Lake G processors have the following:

  • Dual-channel Memory
    • Up to DDR3L-1600, DDR4-2400
    • Up to 64 GiB
  • 8x PCIe
    • 20x in total, 4 of the 20 are used by the bus and 8 for the GPU as described above
  • quad-core with Hyper-Threading (8 threads)
  • Everything up to AVX2 (SMM, FPU, NX, MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, AES, AVX, and AVX2)
  • Graphics
  • BGA package

Kaby Lake G Processors

 List of Kaby Lake G-based Processors
 Main processorGraphics Processors
ModelPriceLaunchedFamilyCTL3$TDPFrequencyTurboGPUBaseiGPU Burst
i5-8305G7 January 2018Core i5486 MiB
6,144 KiB
6,291,456 B
0.00586 GiB
65 W
65,000 mW
0.0872 hp
0.065 kW
2.8 GHz
2,800 MHz
2,800,000 kHz
3.8 GHz
3,800 MHz
3,800,000 kHz
HD Graphics 630, Radeon RX Vega M GL350 MHz
0.35 GHz
350,000 KHz
, 931 MHz
0.931 GHz
931,000 KHz
1,100 MHz
1.1 GHz
1,100,000 KHz
, 1,011 MHz
1.011 GHz
1,011,000 KHz
i7-8705G7 January 2018Core i7488 MiB
8,192 KiB
8,388,608 B
0.00781 GiB
65 W
65,000 mW
0.0872 hp
0.065 kW
3.1 GHz
3,100 MHz
3,100,000 kHz
4.1 GHz
4,100 MHz
4,100,000 kHz
HD Graphics 630, Radeon RX Vega M GL350 MHz
0.35 GHz
350,000 KHz
, 931 MHz
0.931 GHz
931,000 KHz
1,100 MHz
1.1 GHz
1,100,000 KHz
, 1,011 MHz
1.011 GHz
1,011,000 KHz
i7-8706G7 January 2018Core i7488 MiB
8,192 KiB
8,388,608 B
0.00781 GiB
65 W
65,000 mW
0.0872 hp
0.065 kW
3.1 GHz
3,100 MHz
3,100,000 kHz
4.1 GHz
4,100 MHz
4,100,000 kHz
HD Graphics 630, Radeon RX Vega M GL350 MHz
0.35 GHz
350,000 KHz
, 931 MHz
0.931 GHz
931,000 KHz
1,100 MHz
1.1 GHz
1,100,000 KHz
, 1,011 MHz
1.011 GHz
1,011,000 KHz
i7-8809G7 January 2018Core i7488 MiB
8,192 KiB
8,388,608 B
0.00781 GiB
100 W
100,000 mW
0.134 hp
0.1 kW
3.1 GHz
3,100 MHz
3,100,000 kHz
4.2 GHz
4,200 MHz
4,200,000 kHz
HD Graphics 630, Radeon RX Vega M GH350 MHz
0.35 GHz
350,000 KHz
, 1,063 MHz
1.063 GHz
1,063,000 KHz
1,100 MHz
1.1 GHz
1,100,000 KHz
, 1,190 MHz
1.19 GHz
1,190,000 KHz
Count: 4

See also

arrow up 1.svgPower/Performance

designerIntel + and AMD +
first announcedNovember 6, 2017 +
first launchedJanuary 7, 2018 +
instance ofcore +
isax86-64 +
isa familyx86 +
main imageFile:kaby lake g (front).png +
main image captionPackage front +
manufacturerIntel + and GlobalFoundries +
microarchitectureKaby Lake +
nameKaby Lake G +
process14 nm (0.014 μm, 1.4e-5 mm) +
technologyCMOS +
word size64 bit (8 octets, 16 nibbles) +