Semiconductor & Computer Engineering
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Difference between revisions of "hisilicon/kirin/970"
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'''Kirin 970''' is a {{arch|64}} [[octa-core]] high-performance mobile [[ARM]] [[LTE]] SoC introduced by [[HiSilicon]] in mid-2017 at the [[2017 IFA]]. This chip, which is fabricated on a [[10 nm process]], features four {{armh|Cortex-A73|l=arch}} [[big cores]] operating at up to 2.4 GHz along with four {{armh|Cortex-A53}} [[little cores]] operating at up to 1.8 GHz. The 970 incorporates [[ARM Holdings|ARM]]'s {{armh|Mali G72}} (12 core) IGP operating at ? MHz and supports up to 6 GiB of dual-channel LPDDR4-1866 memory. | '''Kirin 970''' is a {{arch|64}} [[octa-core]] high-performance mobile [[ARM]] [[LTE]] SoC introduced by [[HiSilicon]] in mid-2017 at the [[2017 IFA]]. This chip, which is fabricated on a [[10 nm process]], features four {{armh|Cortex-A73|l=arch}} [[big cores]] operating at up to 2.4 GHz along with four {{armh|Cortex-A53}} [[little cores]] operating at up to 1.8 GHz. The 970 incorporates [[ARM Holdings|ARM]]'s {{armh|Mali G72}} (12 core) IGP operating at ? MHz and supports up to 6 GiB of dual-channel LPDDR4-1866 memory. | ||
| − | Introduced at the 2017 IFA, the overall core organization is identical to the {{\\|960|Kirin 960}} which was introduced the previous year, but features 20% power efficiency and 40% smaller [[die area]] due to the [[process shrink]]. The 970 adds many enhancements, including a more powerful {{armh|Mali G72}} GPU and incorporates a new Neural Network Processing Unit (NPU) designed for [[AI]] acceleration. The 970 has two improved [[image signal processor|ISP]]s and a more powerful LTE modem supporting up to [[User Equipment]] (UE) category 18 capable of reaching a maximum downlink of 1.2 Gbps (4x4 MIMO, 256 QAM, 3CC CA). | + | Introduced at the 2017 IFA, the overall core organization is identical to the {{\\|960|Kirin 960}} which was introduced the previous year, but features 20% power efficiency and 40% smaller [[die area]] due to the [[process shrink]]. The 970 ballooned to over 37.5% more transistors from 4 billion in the {{\\|960}} to 5.5 billion. The 970 adds many enhancements, including a more powerful {{armh|Mali G72}} GPU and incorporates a new Neural Network Processing Unit (NPU) designed for [[AI]] acceleration. The 970 has two improved [[image signal processor|ISP]]s and a more powerful LTE modem supporting up to [[User Equipment]] (UE) category 18 capable of reaching a maximum downlink of 1.2 Gbps (4x4 MIMO, 256 QAM, 3CC CA). |
== Cache == | == Cache == | ||
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|bandwidth schan=13.91 GiB/s | |bandwidth schan=13.91 GiB/s | ||
|bandwidth dchan=27.82 GiB/s | |bandwidth dchan=27.82 GiB/s | ||
| + | }} | ||
| + | |||
| + | == Graphics == | ||
| + | {{integrated graphics | ||
| + | | gpu = Mali-G72 | ||
| + | | designer = ARM Holdings | ||
| + | | execution units = 12 | ||
| + | | max displays = 2 | ||
| + | | max memory = | ||
| + | | frequency = 850 MHz | ||
| + | | max frequency = | ||
| + | |||
| + | | output crt = | ||
| + | | output sdvo = | ||
| + | | output dsi = Yes | ||
| + | | output edp = | ||
| + | | output dp = | ||
| + | | output hdmi = | ||
| + | | output vga = | ||
| + | | output dvi = | ||
| + | |||
| + | | directx ver = 12 | ||
| + | | opengl es ver = 3.2 | ||
| + | | openvg ver = 1.1 | ||
| + | | opencl ver = 2.0 | ||
| + | | vulkan ver = 1.0 | ||
}} | }} | ||
Revision as of 11:45, 7 September 2017
Template:mpu Kirin 970 is a 64-bit octa-core high-performance mobile ARM LTE SoC introduced by HiSilicon in mid-2017 at the 2017 IFA. This chip, which is fabricated on a 10 nm process, features four Cortex-A73 big cores operating at up to 2.4 GHz along with four Cortex-A53 little cores operating at up to 1.8 GHz. The 970 incorporates ARM's Mali G72 (12 core) IGP operating at ? MHz and supports up to 6 GiB of dual-channel LPDDR4-1866 memory.
Introduced at the 2017 IFA, the overall core organization is identical to the Kirin 960 which was introduced the previous year, but features 20% power efficiency and 40% smaller die area due to the process shrink. The 970 ballooned to over 37.5% more transistors from 4 billion in the 960 to 5.5 billion. The 970 adds many enhancements, including a more powerful Mali G72 GPU and incorporates a new Neural Network Processing Unit (NPU) designed for AI acceleration. The 970 has two improved ISPs and a more powerful LTE modem supporting up to User Equipment (UE) category 18 capable of reaching a maximum downlink of 1.2 Gbps (4x4 MIMO, 256 QAM, 3CC CA).
Cache
- Main articles: Cortex-A53 § Cache and Cortex-A73 § Cache
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Cache Organization
Cache is a hardware component containing a relatively small and extremely fast memory designed to speed up the performance of a CPU by preparing ahead of time the data it needs to read from a relatively slower medium such as main memory. The organization and amount of cache can have a large impact on the performance, power consumption, die size, and consequently cost of the IC. Cache is specified by its size, number of sets, associativity, block size, sub-block size, and fetch and write-back policies. Note: All units are in kibibytes and mebibytes. |
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Memory controller
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Integrated Memory Controller
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Graphics
Facts about "Kirin 970 - HiSilicon"
| has ecc memory support | false + |
| integrated gpu | Mali-G72 + |
| integrated gpu base frequency | 850 MHz (0.85 GHz, 850,000 KHz) + |
| integrated gpu designer | ARM Holdings + |
| integrated gpu execution units | 12 + |
| max memory bandwidth | 27.82 GiB/s (28,487.68 MiB/s, 29.871 GB/s, 29,871.498 MB/s, 0.0272 TiB/s, 0.0299 TB/s) + |
| max memory channels | 2 + |
| supported memory type | LPDDR4-1866 + |