Semiconductor & Computer Engineering
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| − | '''Kirin 970''' is a {{arch|64}} [[octa-core]] high-performance mobile [[ARM]] SoC introduced by [[HiSilicon]] in mid-2017 at the [[2017 IFA]]. This chip, which is fabricated on a [[10 nm process]], features four {{armh|Cortex-A73|l=arch}} [[big cores]] operating at up to 2.4 GHz along with four {{armh|Cortex-A53}} [[little cores]] operating at up to 1.8 GHz. The overall core organization is identical to the {{\\|960|Kirin 960}} which was introduced the previous year, but features 20% power efficiency and 40% smaller die area due to the [[process shrink]]. The 970 | + | '''Kirin 970''' is a {{arch|64}} [[octa-core]] high-performance mobile [[ARM]] [[LTE]] SoC introduced by [[HiSilicon]] in mid-2017 at the [[2017 IFA]]. This chip, which is fabricated on a [[10 nm process]], features four {{armh|Cortex-A73|l=arch}} [[big cores]] operating at up to 2.4 GHz along with four {{armh|Cortex-A53}} [[little cores]] operating at up to 1.8 GHz. The 970 incorporates [[ARM Holdings|ARM]]'s {{armh|Mali G72}} (12 core) IGP operating at ? MHz and supports up to 6 GiB of dual-channel LPDDR4-1866 memory. |
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| + | Introduced at the 2017 IFA, the overall core organization is identical to the {{\\|960|Kirin 960}} which was introduced the previous year, but features 20% power efficiency and 40% smaller [[die area]] due to the [[process shrink]]. The 970 adds many enhancements, including a more powerful {{armh|Mali G72}} GPU and incorporates a new Neural Network Processing Unit (NPU) designed for [[AI]] acceleration. The 970 has two improved [[image signal processor|ISP]]s and a more powerful LTE modem supporting up to User Equipment (UE) category 18 capable of reaching a maximum downlink of 1.2 Gbps (4x4 MIMO, 256 QAM, 3CC CA). | ||
Revision as of 00:45, 7 September 2017
Template:mpu Kirin 970 is a 64-bit octa-core high-performance mobile ARM LTE SoC introduced by HiSilicon in mid-2017 at the 2017 IFA. This chip, which is fabricated on a 10 nm process, features four Cortex-A73 big cores operating at up to 2.4 GHz along with four Cortex-A53 little cores operating at up to 1.8 GHz. The 970 incorporates ARM's Mali G72 (12 core) IGP operating at ? MHz and supports up to 6 GiB of dual-channel LPDDR4-1866 memory.
Introduced at the 2017 IFA, the overall core organization is identical to the Kirin 960 which was introduced the previous year, but features 20% power efficiency and 40% smaller die area due to the process shrink. The 970 adds many enhancements, including a more powerful Mali G72 GPU and incorporates a new Neural Network Processing Unit (NPU) designed for AI acceleration. The 970 has two improved ISPs and a more powerful LTE modem supporting up to User Equipment (UE) category 18 capable of reaching a maximum downlink of 1.2 Gbps (4x4 MIMO, 256 QAM, 3CC CA).
| base frequency | 1,800 MHz (1.8 GHz, 1,800,000 kHz) + and 2,360 MHz (2.36 GHz, 2,360,000 kHz) + |
| core count | 8 + |
| core name | Cortex-A53 + and Cortex-A73 + |
| designer | HiSilicon + and ARM Holdings + |
| die area | 96.72 mm² (0.15 in², 0.967 cm², 96,720,000 µm²) + |
| die length | 9.75 mm (0.975 cm, 0.384 in, 9,750 µm) + |
| die width | 9.92 mm (0.992 cm, 0.391 in, 9,920 µm) + |
| family | Kirin + |
| first announced | September 1, 2017 + |
| first launched | September 1, 2017 + |
| full page name | hisilicon/kirin/970 + |
| has ecc memory support | false + |
| instance of | microprocessor + |
| integrated gpu | Mali-G72 + |
| integrated gpu base frequency | 746 MHz (0.746 GHz, 746,000 KHz) + |
| integrated gpu designer | ARM Holdings + |
| integrated gpu execution units | 12 + |
| isa | ARMv8 + |
| isa family | ARM + |
| l1$ size | 256 KiB (262,144 B, 0.25 MiB) + and 512 KiB (524,288 B, 0.5 MiB) + |
| l1d$ size | 128 KiB (131,072 B, 0.125 MiB) + and 256 KiB (262,144 B, 0.25 MiB) + |
| l1i$ size | 128 KiB (131,072 B, 0.125 MiB) + and 256 KiB (262,144 B, 0.25 MiB) + |
| l2$ size | 1 MiB (1,024 KiB, 1,048,576 B, 9.765625e-4 GiB) + and 2 MiB (2,048 KiB, 2,097,152 B, 0.00195 GiB) + |
| ldate | September 1, 2017 + |
| main image |  + |
| manufacturer | TSMC + |
| market segment | Mobile + |
| max cpu count | 1 + |
| max memory | 8,192 MiB (8,388,608 KiB, 8,589,934,592 B, 8 GiB, 0.00781 TiB) + |
| max memory bandwidth | 27.82 GiB/s (28,487.68 MiB/s, 29.871 GB/s, 29,871.498 MB/s, 0.0272 TiB/s, 0.0299 TB/s) + |
| max memory channels | 4 + |
| microarchitecture | Cortex-A53 + and Cortex-A73 + |
| model number | 970 + |
| name | Kirin 970 + |
| part number | Hi3670 + |
| process | 10 nm (0.01 μm, 1.0e-5 mm) + |
| series | 900 + |
| smp max ways | 1 + |
| supported memory type | LPDDR4X-3732 + |
| technology | CMOS + |
| thread count | 8 + |
| transistor count | 5,500,000,000 + |
| used by | Huawei Mate 10 +, Huawei Mate 10 Pro +, Huawei Mate 10 Porsche Design +, Huawei P20 +, Huawei Mate RS Porsche Design +, Honor 10 +, Huawei Nova 3 +, Honor V10 (Honor View 10) +, Honor Note 10 +, Huawei P20 Pro +, Huawei Nova 4 +, HiKey 970 +, Honor 8 Pro +, Honor Play 2 + and Honor Play + |
| word size | 64 bit (8 octets, 16 nibbles) + |
