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Difference between revisions of "renesas/r-car/h3 (sip)"
< renesas‎ | r-car

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|die width=8.61 mm
 
|die width=8.61 mm
 
|word size=64 bit
 
|word size=64 bit
−
|core count=10
+
|core count=9
−
|thread count=10
+
|thread count=9
 
|max cpus=1
 
|max cpus=1
 
|v core=0.8 V
 
|v core=0.8 V
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|package module 1={{packages/renesas/fcbga-1255}}
 
|package module 1={{packages/renesas/fcbga-1255}}
 
}}
 
}}
−
'''R-Car H3''' is a {{arch|64}} [[deca-core]] [[ARM]] SoC designed by [[Renesas]] for the automotive industry and introduced in 2016. The H3 incorporates four {{armh|Cortex-A57}} cores, four {{armh|Cortex-A53}} cores, and a two {{armh|Cortex-R7}} cores for real-time processing. This chip supports up to quad-channel LPDDR4-3200 memory. This chip incorporates the [[imagination technologies|Imagination]]'s {{imgtec|PowerVR GX6650}} [[GPU]].
+
'''R-Car H3''' is a {{arch|64}} [[nona-core]] [[ARM]] SoC designed by [[Renesas]] for the automotive industry and introduced in 2016. The H3 incorporates four {{armh|Cortex-A57}} cores, four {{armh|Cortex-A53}} cores, and a dual-core lock-step {{armh|Cortex-R7}} for real-time processing. This chip supports up to quad-channel LPDDR4-3200 memory. This chip incorporates the [[imagination technologies|Imagination]]'s {{imgtec|PowerVR GX6650}} [[GPU]].
  
 
This model is an [[SiP]] variant of the {{\\|H3}} which include the DDR memory on-package.
 
This model is an [[SiP]] variant of the {{\\|H3}} which include the DDR memory on-package.
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{{main|arm holdings/microarchitectures/cortex-a53#Memory_Hierarchy|arm holdings/microarchitectures/cortex-a57#Memory_Hierarchy|l1=Cortex-A53 § Cache|l2=Cortex-A57 § Cache}}
 
{{main|arm holdings/microarchitectures/cortex-a53#Memory_Hierarchy|arm holdings/microarchitectures/cortex-a57#Memory_Hierarchy|l1=Cortex-A53 § Cache|l2=Cortex-A57 § Cache}}
 
{{cache size
 
{{cache size
−
|l1 cache=704 KiB
+
|l1 cache=640 KiB
−
|l1i cache=384 KiB
+
|l1i cache=352 KiB
−
|l1i break=4x48+6x32 KiB
+
|l1i break=4x48+5x32 KiB
−
|l1d cache=320 KiB
+
|l1d cache=288 KiB
−
|l1d break=10x32 KiB
+
|l1d break=9x32 KiB
 
|l2 cache=2.5 MiB
 
|l2 cache=2.5 MiB
 
}}
 
}}
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== Block Diagram ==
 
== Block Diagram ==
 
:: [[File:r-car h3 block.png|750px]]
 
:: [[File:r-car h3 block.png|750px]]
 +
 +
== Die Shot ==
 +
* [[16 nm process]], CMOS FinFET
 +
* 12.94 mm × 8.61 mm
 +
* 111.36 mm² die size
 +
 +
 +
:: [[File:r-car h3 die shot.png|650px]]
 +
 +
== References ==
 +
* Takahashi, Chikafumi, et al. "4.5 A 16nm FinFET heterogeneous nona-core SoC complying with ISO26262 ASIL-B: Achieving 10− 7 random hardware failures per hour reliability." Solid-State Circuits Conference (ISSCC), 2016 IEEE International. IEEE, 2016.

Revision as of 06:09, 23 July 2017

Template:mpu R-Car H3 is a 64-bit nona-core ARM SoC designed by Renesas for the automotive industry and introduced in 2016. The H3 incorporates four Cortex-A57 cores, four Cortex-A53 cores, and a dual-core lock-step Cortex-R7 for real-time processing. This chip supports up to quad-channel LPDDR4-3200 memory. This chip incorporates the Imagination's PowerVR GX6650 GPU.

This model is an SiP variant of the H3 which include the DDR memory on-package.

Samples for the H3 were available starting December 2015 with Renesas expecting mass production to begin in March 2018 and reach a volume of 100,000 units per month in March 2019.

Cache

Main articles: Cortex-A53 § Cache and Cortex-A57 § Cache

[Edit/Modify Cache Info]

hierarchy icon.svg
Cache Organization
Cache is a hardware component containing a relatively small and extremely fast memory designed to speed up the performance of a CPU by preparing ahead of time the data it needs to read from a relatively slower medium such as main memory.

The organization and amount of cache can have a large impact on the performance, power consumption, die size, and consequently cost of the IC.

Cache is specified by its size, number of sets, associativity, block size, sub-block size, and fetch and write-back policies.

Note: All units are in kibibytes and mebibytes.
L1$640 KiB
655,360 B
0.625 MiB
L1I$352 KiB
360,448 B
0.344 MiB
4x48+5x32 KiB  
L1D$288 KiB
294,912 B
0.281 MiB
9x32 KiB  
L2$2.5 MiB
2,560 KiB
2,621,440 B
0.00244 GiB
     

Memory controller

[Edit/Modify Memory Info]

ram icons.svg
Integrated Memory Controller
Max TypeLPDDR4-3200
Supports ECCNo
Controllers1
Channels4
Width32 bit
Max Bandwidth47.68 GiB/s
48,824.32 MiB/s
51.196 GB/s
51,196.01 MB/s
0.0466 TiB/s
0.0512 TB/s
Bandwidth
Single 11.92 GiB/s
Double 23.84 GiB/s
Quad 47.68 GiB/s

Expansions

  • PCI Express2.0 (1 lane) x 2 ch
  • USB 3.0 Host interface (DRD) × 1 ports (wPHY)
  • USB 2.0 Host/Function/OTG interface × 2 ports (wPHY)
  • SD Host interface × 4 ch (SDR104)
  • Multimedia card interface × 2 ch
  • Serial ATA interface × 1 ch
  • Media local bus (MLB) Interface × 1 ch (3 pin interface)
  • Controller Area Network (CAN-FD support) Interface × 2ch
  • Ethernet AVB 1.0-compatible MAC built in Interface: RGMII / Ethernet AVB (802.1BA)
  • SYS-DMAC x 48 ch, Realtime-DMAC x 16 ch,
  • Audio-DMAC x 32 ch, Audio(peripheral)-DMAC x 29 ch
  • 32bit timer x 26 ch
  • PWM timer × 7 ch
  • I2C bus interface × 7 ch
  • Serial communication interface (SCIF) × 11 ch
  • Quad serial peripheral interface (QSPI) x 2 ch (for boot, HyperFlash support)
  • Clock-synchronized serial interface (MSIOF) × 4 ch (SPI/IIS)
  • Ethernet controller (IEEE802.3u, RMII, without PHY)
  • Digital radio interface (DRIF) × 4 ch

Graphics

[Edit/Modify IGP Info]

screen icon.svg
Integrated Graphics Information
GPUPowerVR GX6650
DesignerImagination Technologies

Features

[Edit/Modify Supported Features]

Cog-icon-grey.svg
Supported ARM Extensions & Processor Features
VFPv4Vector Floating Point (VFP) v4 Extension
NEONAdvanced SIMD extension
TrustZoneTrustZone Security Extensions

Block Diagram

r-car h3 block.png

Die Shot

  • 16 nm process, CMOS FinFET
  • 12.94 mm × 8.61 mm
  • 111.36 mm² die size


r-car h3 die shot.png

References

  • Takahashi, Chikafumi, et al. "4.5 A 16nm FinFET heterogeneous nona-core SoC complying with ISO26262 ASIL-B: Achieving 10− 7 random hardware failures per hour reliability." Solid-State Circuits Conference (ISSCC), 2016 IEEE International. IEEE, 2016.
Retrieved from "https://en.wikichip.org/w/index.php?title=renesas/r-car/h3_(sip)&oldid=56151"
Facts about "R-Car H3 (SiP) - Renesas"
RDF feed
has ecc memory supportfalse +
integrated gpuPowerVR GX6650 +
integrated gpu designerImagination Technologies +
l1$ size640 KiB (655,360 B, 0.625 MiB) +
l1d$ size288 KiB (294,912 B, 0.281 MiB) +
l1i$ size352 KiB (360,448 B, 0.344 MiB) +
l2$ size2.5 MiB (2,560 KiB, 2,621,440 B, 0.00244 GiB) +
max memory bandwidth47.68 GiB/s (48,824.32 MiB/s, 51.196 GB/s, 51,196.01 MB/s, 0.0466 TiB/s, 0.0512 TB/s) +
max memory channels4 +
supported memory typeLPDDR4-3200 +