Difference between revisions of "mediatek/helio/mt6797d"

Revision as of 16:08, 12 July 2017

Template:mpu Helio X23 (MT6797D) is a 64-bit deca-core ARM LTE system on a chip designed by MediaTek and introduced in late 2016. This SoC incorporates 3 independent clusters of cores (called "Tri-Cluster" by MediaTek) operating at varying degrees of performance designed for certain workloads (operating at 1.4 GHz, 1.85 GHz, and 2.3 GHz) and supports up to 4 GiB of dual-channel LPDDR3-1600 memory. This SoC also incorporates a Mali-T800 MP4 IGP operating at 780 MHz. The chip has a modem supporting LTE User Equipment (UE) category 6.

The Helio X23 is identical to Helio X20 with the additional support for dual-camera setup and MiraVision's EnergySmart Screen technology.

Architecture

The Helio X23 is designed is composed of 3 individual clusters of CPU cores depending on the level of performance required by the active applications.

Extreme Performance - 2x Cortex-A72 @ 2.3 GHz
Performance/Power Balance - 4x Cortex-A53 @ 1.85 GHz
Power Efficiency - 4x Cortex-A53 @ 1.4 GHz

The three clusters are designed as a modified big.LITTLE configuration.

Cache

Main articles: Cortex-A53 § Cache and Cortex-A72 § Cache

This section is empty; you can help add the missing info by editing this page.

Memory controller

[Edit/Modify Memory Info]

Integrated Memory Controller

Max Type	LPDDR3-1600
Supports ECC	No
Max Mem	4 GiB
Controllers	1
Channels	2
Max Bandwidth	11.92 GiB/s 12,206.08 MiB/s 12.799 GB/s 12,799.003 MB/s 0.0116 TiB/s 0.0128 TB/s
Bandwidth	Single 5.96 GiB/s Double 11.92 GiB/s

Expansions

[Edit/Modify Expansions Info]

Expansion Options

USB

Revision	2.0, 3.0
Ports	8

UART

GP I/O	Yes

Graphics

[Edit/Modify IGP Info]

Integrated Graphics Information

GPU

Mali-T880

Designer

ARM Holdings

Execution Units

4

Frequency

780 MHz

0.78 GHz
780,000 KHz

Output

DSI

Max Resolution

DSI	2560x1600

Standards

Direct3D	11.2
OpenGL	3.2
OpenCL	1.2
OpenGL ES	3.2
OpenVG	1.1
Vulkan	1.0

Wireless

Wireless Communications

Wi-Fi

WiFi

802.11ac	Yes

Cellular

2G

CSD		Yes
GSM		Yes
GPRS		Yes
EDGE		Yes

3G

UMTS

TD-SCDMA	Yes
DC-HSDPA	Yes
HSUPA	Yes

CDMA2000

1X	Yes
1xEV-DO	Yes

4G

LTE Advanced

E-UTRAN	Yes
UE Cat	6

Image

Integrated image signal processor supports 32 MP
Supports image stabilization
Supports video stabilization
Supports noise reduction
Supports lens shading correction
Supports AE/AWB/AF
Supports edge enhancement
Supports face detection and visual tracking
Hardware JPEG encoder

Video

Video encoding 4K2K @ 30fps with H.265 and HDR
Video decoding 4K2K @ 30fps, h.264, h.265 / HEVC, MPEG-1/2/4, VC-1, VP-8, VP-9

Audio

Audio content sampling rates 8kHz to 192kHz
Audio content sampling format 8-bit/16-bit/24-bit Mono/Stereo
I2S, PCM
Encode: AMR-NB, AMR-WB, AAC, OGG, ADPCM
Decode: WAV, MP3, MP2, AAC, AMR-NB, AMR-WB, MIDI, Vorbis, APE, AAC-plus v1, AAC-plus v2, FLAC, WMA, ADPCM
7.1 channel MHL output

Utilizing devices

Doogee F7
Doogee F7 Pro
Elephone R9
Elephone S7
HomTom HT10
LeEco Le 2 Pro X620
LeEco Le 2 X620
Meizu MX6
Vernee Apollo Lite
Xiaomi Redmi Note 4

@@ Line 1: / Line 1: @@
 {{mediatek title|Helio X23 (MT6797D)}}
 {{mpu
-| name                = MediaTek Helio X23
+|name=MediaTek Helio X23
-| no image            = yes
+|designer=MediaTek
-| image               =
+|designer 2=ARM Holdings
-| image size          =
+|manufacturer=TSMC
-| caption             =
+|model number=Helio X23
-| designer            = MediaTek
+|part number=MT6797D
-| designer 2          = ARM Holdings
+|part number 2=MTK6797D
-| manufacturer        = TSMC
+|market=Mobile
-| model number        = Helio X23
+|market 2=Embedded
-| part number         = MT6797D
+|first announced=December 2, 2016
-| part number 2       = MTK6797D
+|first launched=December 2, 2016
-| market              = Mobile
+|family=Helio
-| market 2            = Embedded
+|series=Helio X
-| first announced     = December 2, 2016
+|frequency=2,300 MHz
-| first launched      = December 2, 2016
+|frequency 2=1,850 MHz
-| last order          =
+|frequency 3=1,400 MHz
-| last shipment       =
+|bus type=AMBA 4 AXI
-| release price       =
+|isa=ARMv8
+|isa family=ARM
-| family              = Helio
+|microarch=Cortex-A53
-| series              = Helio X
+|microarch 2=Cortex-A72
-| locked              =
+|core name=Cortex-A53
-| frequency           = 2,300 MHz
+|core name 2=Cortex-A72
-| frequency 2         = 1,850 MHz
+|process=20 nm
-| frequency 3         = 1,400 MHz
+|technology=CMOS
-| bus type            = AMBA 4 AXI
+|word size=64 bit
-| bus speed           =
+|core count=10
-| bus rate            =
+|thread count=10
-| bus links           =
+|max cpus=1
-| clock multiplier    =
+|max memory=4 GiB
-| isa family          = ARM
-| isa                 = ARMv8
-| microarch           = Cortex-A53
-| microarch 2         = Cortex-A72
-| platform            =
-| chipset             =
-| core name           = Cortex-A53
-| core name 2         = Cortex-A72
-| core family         =
-| core model          =
-| core stepping       =
-| process             = 20 nm
-| transistors         =
-| technology          = CMOS
-| die area            = <!-- XX mm² -->
-| die width           =
-| die length          =
-| word size           = 64 bit
-| core count          = 10
-| thread count        = 10
-| max cpus            = 1
-| max memory          = 4 GiB
-| electrical          =
-| power               =
-| v core              =
-| v core tolerance    =
-| v io                =
-| v io 2              =
-| v io 3              =
-| sdp                 =
-| tdp                 =
-| tdp typical         =
-| ctdp down           =
-| ctdp down frequency =
-| ctdp up             =
-| ctdp up frequency   =
-| temp min            =
-| temp max            =
-| tjunc min           =
-| tjunc max           =
-| tcase min           =
-| tcase max           =
-| tstorage min        = <!-- °C -->
-| tstorage max        =
-| tambient min        =
-| tambient max        =
-| packaging           =
-| package 0           =
-| package 0 type      =
-| package 0 pins      =
-| package 0 pitch     =
-| package 0 width     =
-| package 0 length    =
-| package 0 height    =
 }}
 '''Helio X23''' ('''MT6797D''') is a {{arch|64}} [[deca-core]] [[ARM]] [[LTE]] system on a chip designed by [[MediaTek]] and introduced in late [[2016]]. This SoC incorporates 3 independent clusters of cores (called "Tri-Cluster" by MediaTek) operating at varying degrees of performance designed for certain workloads (operating at 1.4 GHz, 1.85 GHz, and 2.3 GHz) and supports up to 4 GiB of dual-channel LPDDR3-1600 memory. This SoC also incorporates a {{armh|Mali-T800 MP4}} [[IGP]] operating at 780 MHz. The chip has a modem supporting [[LTE]] User Equipment (UE) category 6.

has 2g support	true +
has 3g support	true +
has 4g support	true +
has cdma2000 1x support	true +
has cdma2000 1xev-do support	true +
has cdma2000 support	true +
has csd support	true +
has dc-hsdpa support	true +
has e-utran support	true +
has ecc memory support	false +
has edge support	true +
has feature	Dual-Camera Setup +
has gprs support	true +
has gsm support	true +
has hsupa support	true +
has lte advanced support	true +
has td-scdma support	true +
has umts support	true +
integrated gpu	Mali-T880 +
integrated gpu base frequency	780 MHz (0.78 GHz, 780,000 KHz) +
integrated gpu designer	ARM Holdings +
integrated gpu execution units	4 +
max memory bandwidth	11.92 GiB/s (12,206.08 MiB/s, 12.799 GB/s, 12,799.003 MB/s, 0.0116 TiB/s, 0.0128 TB/s) +
max memory channels	2 +
supported memory type	LPDDR3-1600 +
used by	Doogee F7 +, Doogee F7 Pro +, Elephone R9 +, Elephone S7 +, HomTom HT10 +, LeEco Le 2 Pro X620 +, LeEco Le 2 X620 +, Meizu MX6 +, Vernee Apollo Lite + and Xiaomi Redmi Note 4 +
user equipment category	6 +

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