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Latest revision as of 15:17, 13 December 2017

Edit Values
Core i3-6100TE
skylake (fclga1151).png
General Info
DesignerIntel
ManufacturerIntel
Model Numberi3-6100TE
Part NumberCM8066201938603
S-SpecSR2LS
MarketEmbedded
IntroductionOctober 12, 2015 (announced)
October 12, 2015 (launched)
Release Price$117.00
ShopAmazon
General Specs
FamilyCore i3
Seriesi3-6000
LockedYes
Frequency2,700 MHz
Bus typeDMI 3.0
Bus rate4 × 8 GT/s
Clock multiplier27
Microarchitecture
ISAx86-64 (x86)
MicroarchitectureSkylake
ChipsetSunrise Point
Core NameSkylake S
Core Family6
Core Model94
Core SteppingR0
Process14 nm
TechnologyCMOS
Die98.57 mm²
10.3 mm × 9.57 mm
Word Size64 bit
Cores2
Threads4
Max Memory64 GiB
Multiprocessing
Max SMP1-Way (Uniprocessor)
Electrical
Vcore0.55 V-1.52 V
TDP35 W
OP Temperature0 °C – 100 °C
Tjunction0 °C – 100 °C
Tstorage-25 °C – 125 °C
Packaging
PackageFCLGA-1151 (LGA)
FC-LGA14C		FCLGA-1151.svg
Dimension37.5 mm x 37.5 mm x 4.4 mm
Pitch0.914 mm
Contacts1151
SocketLGA-1151

Core i3-6100TE is a dual-core 64-bit x86 entry-level performance embedded desktop microprocessor introduced by Intel in late 2015. This processor, which is based on the Skylake microarchitecture and is fabricated on a 14 nm process, has a base frequency of 2.7 GHz with a TDP of 35 W. The i3-6100TE incorporates the HD Graphics 530 IGP operating at 350 MHz and a turbo frequency of 1 GHz. This chip supports up to 64 GiB of dual-channel DDR4-2133 ECC memory.

Cache[edit]

Main article: Skylake § Cache

[Edit/Modify Cache Info]

hierarchy icon.svg
Cache Organization
Cache is a hardware component containing a relatively small and extremely fast memory designed to speed up the performance of a CPU by preparing ahead of time the data it needs to read from a relatively slower medium such as main memory.

The organization and amount of cache can have a large impact on the performance, power consumption, die size, and consequently cost of the IC.

Cache is specified by its size, number of sets, associativity, block size, sub-block size, and fetch and write-back policies.

Note: All units are in kibibytes and mebibytes.
L1$128 KiB
131,072 B
0.125 MiB
L1I$64 KiB
65,536 B
0.0625 MiB
2x32 KiB8-way set associative 
L1D$64 KiB
65,536 B
0.0625 MiB
2x32 KiB8-way set associativewrite-back
L2$512 KiB
0.5 MiB
524,288 B
4.882812e-4 GiB
  2x256 KiB4-way set associativewrite-back
L3$4 MiB
4,096 KiB
4,194,304 B
0.00391 GiB
  2x2 MiB write-back

Memory controller[edit]

[Edit/Modify Memory Info]

ram icons.svg
Integrated Memory Controller
Max TypeDDR3L-1600, DDR4-2133
Supports ECCYes
Max Mem64 GiB
Controllers1
Channels2
Max Bandwidth31.79 GiB/s
32,552.96 MiB/s
34.134 GB/s
34,134.253 MB/s
0.031 TiB/s
0.0341 TB/s
Bandwidth
Single 15.89 GiB/s
Double 31.79 GiB/s

Expansions[edit]

[Edit/Modify Expansions Info]

ide icon.svg
Expansion Options
PCIe
Revision3.0
Max Lanes16
Configs1x16, 2x8, 1x8+2x4


Graphics[edit]

[Edit/Modify IGP Info]

screen icon.svg
Integrated Graphics Information
GPUHD Graphics 530
DesignerIntelDevice ID0x1912
Execution Units24Max Displays3
Max Memory64 GiB
65,536 MiB
67,108,864 KiB
68,719,476,736 B
Frequency350 MHz
0.35 GHz
350,000 KHz
Burst Frequency1,000 MHz
1 GHz
1,000,000 KHz
OutputDP, eDP, HDMI, DVI
Max Resolution
HDMI4096x2304 @24 Hz
DP4096x2304 @60 Hz
eDP4096x2304 @60 Hz
Standards
DirectX12
OpenGL4.4
OpenCL2.0
DP1.2
eDP1.3
HDMI1.4a
Additional Features
Intel Quick Sync Video
Intel InTru 3D
Intel Clear Video
Intel Clear Video HD

Features[edit]

[Edit/Modify Supported Features]

Cog-icon-grey.svg
Supported x86 Extensions & Processor Features
MMXMMX Extension
EMMXExtended MMX Extension
SSEStreaming SIMD Extensions
SSE2Streaming SIMD Extensions 2
SSE3Streaming SIMD Extensions 3
SSSE3Supplemental SSE3
SSE4.1Streaming SIMD Extensions 4.1
SSE4.2Streaming SIMD Extensions 4.2
AVXAdvanced Vector Extensions
AVX2Advanced Vector Extensions 2
ABMAdvanced Bit Manipulation
BMI1Bit Manipulation Instruction Set 1
BMI2Bit Manipulation Instruction Set 2
FMA33-Operand Fused-Multiply-Add
AESAES Encryption Instructions
RdRandHardware RNG
ADXMulti-Precision Add-Carry
CLMULCarry-less Multiplication Extension
F16C16-bit Floating Point Conversion
x86-1616-bit x86
x86-3232-bit x86
x86-6464-bit x86
RealReal Mode
ProtectedProtected Mode
SMMSystem Management Mode
FPUIntegrated x87 FPU
NXNo-eXecute
HTHyper-Threading
EISTEnhanced SpeedStep Technology
VT-xVT-x (Virtualization)
VT-dVT-d (I/O MMU virtualization)
EPTExtended Page Tables (SLAT)
MPXMemory Protection Extensions
SGXSoftware Guard Extensions
Secure KeySecure Key Technology
SMEPOS Guard Technology
IPTIdentity Protection Technology
Retrieved from "https://en.wikichip.org/w/index.php?title=intel/core_i3/i3-6100te&oldid=70542"
Facts about "Core i3-6100TE - Intel"
RDF feed
Has subobject
"Has subobject" is a predefined property representing a container construct and is provided by Semantic MediaWiki.
Core i3-6100TE - Intel#package + and Core i3-6100TE - Intel#io +
base frequency2,700 MHz (2.7 GHz, 2,700,000 kHz) +
bus links4 +
bus rate8,000 MT/s (8 GT/s, 8,000,000 kT/s) +
bus typeDMI 3.0 +
chipsetSunrise Point +
clock multiplier27 +
core count2 +
core family6 +
core model94 +
core nameSkylake S +
core steppingR0 +
core voltage (max)1.52 V (15.2 dV, 152 cV, 1,520 mV) +
core voltage (min)0.55 V (5.5 dV, 55 cV, 550 mV) +
designerIntel +
device id0x1912 +
die area98.57 mm² (0.153 in², 0.986 cm², 98,570,000 µm²) +
die length10.3 mm (1.03 cm, 0.406 in, 10,300 µm) +
die width9.57 mm (0.957 cm, 0.377 in, 9,570 µm) +
familyCore i3 +
first announcedOctober 12, 2015 +
first launchedOctober 12, 2015 +
full page nameintel/core i3/i3-6100te +
has advanced vector extensionstrue +
has advanced vector extensions 2true +
has ecc memory supporttrue +
has extended page tables supporttrue +
has featureAdvanced Vector Extensions +, Advanced Vector Extensions 2 +, Advanced Encryption Standard Instruction Set Extension +, Hyper-Threading Technology +, Enhanced SpeedStep Technology +, Intel VT-x +, Intel VT-d +, Extended Page Tables +, Memory Protection Extensions +, Software Guard Extensions +, Secure Key Technology +, OS Guard + and Identity Protection Technology +
has intel enhanced speedstep technologytrue +
has intel identity protection technology supporttrue +
has intel secure key technologytrue +
has intel supervisor mode execution protectiontrue +
has intel vt-d technologytrue +
has intel vt-x technologytrue +
has locked clock multipliertrue +
has second level address translation supporttrue +
has simultaneous multithreadingtrue +
has x86 advanced encryption standard instruction set extensiontrue +
instance ofmicroprocessor +
integrated gpuHD Graphics 530 +
integrated gpu base frequency350 MHz (0.35 GHz, 350,000 KHz) +
integrated gpu designerIntel +
integrated gpu execution units24 +
integrated gpu max frequency1,000 MHz (1 GHz, 1,000,000 KHz) +
integrated gpu max memory65,536 MiB (67,108,864 KiB, 68,719,476,736 B, 64 GiB) +
isax86-64 +
isa familyx86 +
l1$ size128 KiB (131,072 B, 0.125 MiB) +
l1d$ description8-way set associative +
l1d$ size64 KiB (65,536 B, 0.0625 MiB) +
l1i$ description8-way set associative +
l1i$ size64 KiB (65,536 B, 0.0625 MiB) +
l2$ description4-way set associative +
l2$ size0.5 MiB (512 KiB, 524,288 B, 4.882812e-4 GiB) +
l3$ size4 MiB (4,096 KiB, 4,194,304 B, 0.00391 GiB) +
ldateOctober 12, 2015 +
main imageFile:skylake (fclga1151).png +
manufacturerIntel +
market segmentEmbedded +
max cpu count1 +
max junction temperature373.15 K (100 °C, 212 °F, 671.67 °R) +
max memory65,536 MiB (67,108,864 KiB, 68,719,476,736 B, 64 GiB, 0.0625 TiB) +
max memory bandwidth31.79 GiB/s (32,552.96 MiB/s, 34.134 GB/s, 34,134.253 MB/s, 0.031 TiB/s, 0.0341 TB/s) +
max memory channels2 +
max operating temperature100 °C +
max pcie lanes16 +
max storage temperature398.15 K (125 °C, 257 °F, 716.67 °R) +
microarchitectureSkylake +
min junction temperature273.15 K (0 °C, 32 °F, 491.67 °R) +
min operating temperature0 °C +
min storage temperature248.15 K (-25 °C, -13 °F, 446.67 °R) +
model numberi3-6100TE +
nameCore i3-6100TE +
packageFCLGA-1151 +
part numberCM8066201938603 +
process14 nm (0.014 μm, 1.4e-5 mm) +
release price$ 117.00 (€ 105.30, £ 94.77, ¥ 12,089.61) +
s-specSR2LS +
seriesi3-6000 +
smp max ways1 +
socketLGA-1151 +
supported memory typeDDR3L-1600 + and DDR4-2133 +
tdp35 W (35,000 mW, 0.0469 hp, 0.035 kW) +
technologyCMOS +
thread count4 +
word size64 bit (8 octets, 16 nibbles) +
x86/has memory protection extensionstrue +
x86/has software guard extensionstrue +