From WikiChip
Difference between revisions of "intel/celeron/3965u"
< intel‎ | celeron

Line 43: Line 43:
 
|tstorage min=-25 °C
 
|tstorage min=-25 °C
 
|tstorage max=125 °C
 
|tstorage max=125 °C
−
|electrical=Yes
+
|package module 1={{packages/intel/fcbga-1356}}
−
|packaging=Yes
 
−
|package=FCBGA-1356
 
−
|package type=FCBGA
 
−
|package pitch=0.65 mm
 
−
|package size=42 mm x 24 mm
 
−
|socket=BGA-1356
 
−
|socket type=BGA
 
 
}}
 
}}
 
'''Celeron 3965U''' is a {{arch|64}} [[dual-core]] budget [[x86]] mobile microprocessors introduced by [[Intel]] in early 2017. The 3965U, which is based on the {{intel|Kaby Lake|l=arch}} microarchitecture, is fabricated on Intel's improved [[14 nm|14nm+ process]]. This processor operates at 2.2 GHz with a TDP of 15 W and supports up to 32 GiB of dual-channel non-ECC DDR4-2133. Additionally the 3965U incorporates Intel's {{intel|HD Graphics 610}} [[IGP]] operating at 300 MHz with a burst frequency of 900 GHz.
 
'''Celeron 3965U''' is a {{arch|64}} [[dual-core]] budget [[x86]] mobile microprocessors introduced by [[Intel]] in early 2017. The 3965U, which is based on the {{intel|Kaby Lake|l=arch}} microarchitecture, is fabricated on Intel's improved [[14 nm|14nm+ process]]. This processor operates at 2.2 GHz with a TDP of 15 W and supports up to 32 GiB of dual-channel non-ECC DDR4-2133. Additionally the 3965U incorporates Intel's {{intel|HD Graphics 610}} [[IGP]] operating at 300 MHz with a burst frequency of 900 GHz.

Revision as of 01:25, 4 July 2017

Template:mpu Celeron 3965U is a 64-bit dual-core budget x86 mobile microprocessors introduced by Intel in early 2017. The 3965U, which is based on the Kaby Lake microarchitecture, is fabricated on Intel's improved 14nm+ process. This processor operates at 2.2 GHz with a TDP of 15 W and supports up to 32 GiB of dual-channel non-ECC DDR4-2133. Additionally the 3965U incorporates Intel's HD Graphics 610 IGP operating at 300 MHz with a burst frequency of 900 GHz.

This model has a configurable TDP-down of 10 W.

Cache

Main article: Kaby Lake § Cache

[Edit/Modify Cache Info]

hierarchy icon.svg
Cache Organization
Cache is a hardware component containing a relatively small and extremely fast memory designed to speed up the performance of a CPU by preparing ahead of time the data it needs to read from a relatively slower medium such as main memory.

The organization and amount of cache can have a large impact on the performance, power consumption, die size, and consequently cost of the IC.

Cache is specified by its size, number of sets, associativity, block size, sub-block size, and fetch and write-back policies.

Note: All units are in kibibytes and mebibytes.
L1$128 KiB
131,072 B
0.125 MiB
L1I$64 KiB
65,536 B
0.0625 MiB
2x32 KiB8-way set associative 
L1D$64 KiB
65,536 B
0.0625 MiB
2x32 KiB8-way set associativewrite-back
L2$512 KiB
0.5 MiB
524,288 B
4.882812e-4 GiB
  2x256 KiB4-way set associativewrite-back
L3$2 MiB
2,048 KiB
2,097,152 B
0.00195 GiB
  2x1 MiB12-way set associativewrite-back

Memory controller

[Edit/Modify Memory Info]

ram icons.svg
Integrated Memory Controller
Max TypeLPDDR3-1866, DDR3L-1600, DDR4-2133
Supports ECCNo
Max Mem64 GiB
Controllers1
Channels2
Max Bandwidth31.79 GiB/s
32,552.96 MiB/s
34.134 GB/s
34,134.253 MB/s
0.031 TiB/s
0.0341 TB/s
Bandwidth
Single 15.89 GiB/s
Double 31.79 GiB/s

Expansions

[Edit/Modify Expansions Info]

ide icon.svg
Expansion Options
PCIe
Revision3.0
Max Lanes16
Configs1x16, 2x8, 1x8+2x4


Graphics

[Edit/Modify IGP Info]

screen icon.svg
Integrated Graphics Information
GPUHD Graphics 610
DesignerIntelDevice ID0x5906
Execution Units12Max Displays3
Max Memory32 GiB
32,768 MiB
33,554,432 KiB
34,359,738,368 B
Frequency300 MHz
0.3 GHz
300,000 KHz
Burst Frequency900 MHz
0.9 GHz
900,000 KHz
OutputDP, eDP, HDMI, DVI
Max Resolution
HDMI4096x2304 @24 Hz
DP4096x2304 @60 Hz
eDP4096x2304 @60 Hz
Standards
DirectX12
OpenGL4.4
OpenCL2.0
DP1.2
eDP1.4
HDMI1.4a
Additional Features
Intel Quick Sync Video
Intel Clear Video
Intel Clear Video HD

Features

[Edit/Modify Supported Features]

Cog-icon-grey.svg
Supported x86 Extensions & Processor Features
MMXMMX Extension
EMMXExtended MMX Extension
SSEStreaming SIMD Extensions
SSE2Streaming SIMD Extensions 2
SSE3Streaming SIMD Extensions 3
SSSE3Supplemental SSE3
SSE4.1Streaming SIMD Extensions 4.1
SSE4.2Streaming SIMD Extensions 4.2
ABMAdvanced Bit Manipulation
BMI1Bit Manipulation Instruction Set 1
BMI2Bit Manipulation Instruction Set 2
AESAES Encryption Instructions
RdRandHardware RNG
ADXMulti-Precision Add-Carry
CLMULCarry-less Multiplication Extension
F16C16-bit Floating Point Conversion
x86-1616-bit x86
x86-3232-bit x86
x86-6464-bit x86
RealReal Mode
ProtectedProtected Mode
SMMSystem Management Mode
FPUIntegrated x87 FPU
NXNo-eXecute
EISTEnhanced SpeedStep Technology
SSTSpeed Shift Technology
vProIntel vPro
VT-xVT-x (Virtualization)
VT-dVT-d (I/O MMU virtualization)
EPTExtended Page Tables (SLAT)
MPXMemory Protection Extensions
SGXSoftware Guard Extensions
Secure KeySecure Key Technology
SMEPOS Guard Technology
Flex MemoryFlex Memory Access
ISRTSmart Response Technology
MWTMy WiFi Technology
Retrieved from "https://en.wikichip.org/w/index.php?title=intel/celeron/3965u&oldid=50368"
Facts about "Celeron 3965U - Intel"
RDF feed
Has subobject
"Has subobject" is a predefined property representing a container construct and is provided by Semantic MediaWiki.
Celeron 3965U - Intel#package + and Celeron 3965U - Intel#io +
base frequency2,200 MHz (2.2 GHz, 2,200,000 kHz) +
bus rate4,000 MT/s (4 GT/s, 4,000,000 kT/s) +
bus typeOPI +
clock multiplier22 +
core count2 +
core family6 +
core model142 +
core nameKaby Lake U +
core steppingH0 +
core voltage (max)1.52 V (15.2 dV, 152 cV, 1,520 mV) +
core voltage (min)0.25 V (2.5 dV, 25 cV, 250 mV) +
cpuid306A9 +
designerIntel +
device id0x5906 +
familyCeleron +
first announcedJanuary 3, 2017 +
first launchedJanuary 3, 2017 +
full page nameintel/celeron/3965u +
has ecc memory supportfalse +
has extended page tables supporttrue +
has featureAdvanced Encryption Standard Instruction Set Extension +, Speed Shift Technology +, Intel vPro Technology +, Intel VT-x +, Intel VT-d +, Secure Key Technology +, Flex Memory Access +, Smart Response Technology +, My WiFi Technology +, Enhanced SpeedStep Technology +, OS Guard +, Extended Page Tables +, Software Guard Extensions + and Memory Protection Extensions +
has intel enhanced speedstep technologytrue +
has intel flex memory access supporttrue +
has intel my wifi technology supporttrue +
has intel secure key technologytrue +
has intel smart response technology supporttrue +
has intel speed shift technologytrue +
has intel supervisor mode execution protectiontrue +
has intel vpro technologytrue +
has intel vt-d technologytrue +
has intel vt-x technologytrue +
has locked clock multipliertrue +
has second level address translation supporttrue +
has x86 advanced encryption standard instruction set extensiontrue +
instance ofmicroprocessor +
integrated gpuHD Graphics 610 +
integrated gpu base frequency300 MHz (0.3 GHz, 300,000 KHz) +
integrated gpu designerIntel +
integrated gpu execution units12 +
integrated gpu max frequency900 MHz (0.9 GHz, 900,000 KHz) +
integrated gpu max memory32,768 MiB (33,554,432 KiB, 34,359,738,368 B, 32 GiB) +
isax86-64 +
isa familyx86 +
l1$ size128 KiB (131,072 B, 0.125 MiB) +
l1d$ description8-way set associative +
l1d$ size64 KiB (65,536 B, 0.0625 MiB) +
l1i$ description8-way set associative +
l1i$ size64 KiB (65,536 B, 0.0625 MiB) +
l2$ description4-way set associative +
l2$ size0.5 MiB (512 KiB, 524,288 B, 4.882812e-4 GiB) +
l3$ description12-way set associative +
l3$ size2 MiB (2,048 KiB, 2,097,152 B, 0.00195 GiB) +
ldateJanuary 3, 2017 +
manufacturerIntel +
market segmentMobile +
max cpu count1 +
max junction temperature373.15 K (100 °C, 212 °F, 671.67 °R) +
max memory65,536 MiB (67,108,864 KiB, 68,719,476,736 B, 64 GiB, 0.0625 TiB) +
max memory bandwidth31.79 GiB/s (32,552.96 MiB/s, 34.134 GB/s, 34,134.253 MB/s, 0.031 TiB/s, 0.0341 TB/s) +
max memory channels2 +
max pcie lanes16 +
max storage temperature398.15 K (125 °C, 257 °F, 716.67 °R) +
microarchitectureKaby Lake +
min junction temperature273.15 K (0 °C, 32 °F, 491.67 °R) +
min storage temperature248.15 K (-25 °C, -13 °F, 446.67 °R) +
model number3965U +
nameCeleron 3965U +
packageFCBGA-1356 +
part numberFJ8067702739934 +
platformKaby Lake +
process14 nm (0.014 μm, 1.4e-5 mm) +
release price$ 107.00 (€ 96.30, £ 86.67, ¥ 11,056.31) +
s-specSR34A +
series3900 +
smp max ways1 +
supported memory typeLPDDR3-1866 +, DDR3L-1600 + and DDR4-2133 +
tdp15 W (15,000 mW, 0.0201 hp, 0.015 kW) +
tdp down10 W (10,000 mW, 0.0134 hp, 0.01 kW) +
technologyCMOS +
thread count2 +
word size64 bit (8 octets, 16 nibbles) +
x86/has memory protection extensionstrue +
x86/has software guard extensionstrue +