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Difference between revisions of "compaq/microarchitectures/alpha 21364"
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− | {{compaq title|Alpha | + | {{compaq title|Alpha 21364|arch}} |
{{microarchitecture | {{microarchitecture | ||
|atype=CPU | |atype=CPU | ||
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|designer=DEC | |designer=DEC | ||
|designer 2=Compaq | |designer 2=Compaq | ||
− | |manufacturer= | + | |manufacturer=IBM |
|introduction=January 20, 2002 | |introduction=January 20, 2002 | ||
|process=0.18 µm | |process=0.18 µm | ||
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}} | }} | ||
'''Alpha 21364''' was an [[Alpha]] microarchitecture designed by [[Compaq]] after acquiring it from [[DEC]] and introduced in 1998 as a successor to the {{\\|Alpha 21264}} architecture. | '''Alpha 21364''' was an [[Alpha]] microarchitecture designed by [[Compaq]] after acquiring it from [[DEC]] and introduced in 1998 as a successor to the {{\\|Alpha 21264}} architecture. | ||
+ | |||
+ | == History == | ||
+ | {{empty section}} | ||
+ | |||
+ | == Process Technology == | ||
+ | {{see also|0.18 µm process}} | ||
+ | {{empty section}} | ||
+ | |||
+ | == Architecture == | ||
+ | {{empty section}} | ||
+ | |||
+ | == Die == | ||
+ | * 1,250 MHz | ||
+ | * 135 Watts (155 W peak) @ 1.65 volts | ||
+ | * [[0.18 µm process]] | ||
+ | * 7 metal layers (copper interconnect) | ||
+ | * 152,000,000 transistors | ||
+ | ** 15,000,000 logic | ||
+ | ** 137,000,000 cache | ||
+ | * 21.1 mm x 18.8 mm | ||
+ | * 396.68 mm² die size | ||
+ | * PGA-1443 package | ||
+ | ** 946 signal pins | ||
+ | |||
+ | |||
+ | : [[File:alpha 21364 die shot.png|650px]] | ||
+ | |||
+ | |||
+ | : [[File:alpha 21364 die shot (annotated).png|650px]] | ||
+ | |||
+ | == References == | ||
+ | * "Alpha 21364 (EV7)", Compaq presentation | ||
+ | * Tsuk, M., et al. "Modeling and measurement of the Alpha 21364 package." Electrical Performance of Electronic Packaging, 2001. IEEE, 2001. |
Revision as of 21:14, 11 June 2017
Edit Values | |
Alpha 21364 µarch | |
General Info | |
Arch Type | CPU |
Designer | DEC, Compaq |
Manufacturer | IBM |
Introduction | January 20, 2002 |
Process | 0.18 µm |
Core Configs | 1 |
Pipeline | |
Type | Superscalar |
OoOE | Yes |
Speculative | Yes |
Reg Renaming | Yes |
Stages | 6 |
Decode | 4-way |
Instructions | |
ISA | Alpha |
Cache | |
L1I Cache | 64 KiB/core 2-way set associative |
L1D Cache | 64 KiB/core 2-way set associative |
L2 Cache | 1.75 MiB/core 7-way set associative |
Succession | |
Alpha 21364 was an Alpha microarchitecture designed by Compaq after acquiring it from DEC and introduced in 1998 as a successor to the Alpha 21264 architecture.
History
This section is empty; you can help add the missing info by editing this page. |
Process Technology
- See also: 0.18 µm process
This section is empty; you can help add the missing info by editing this page. |
Architecture
This section is empty; you can help add the missing info by editing this page. |
Die
- 1,250 MHz
- 135 Watts (155 W peak) @ 1.65 volts
- 0.18 µm process
- 7 metal layers (copper interconnect)
- 152,000,000 transistors
- 15,000,000 logic
- 137,000,000 cache
- 21.1 mm x 18.8 mm
- 396.68 mm² die size
- PGA-1443 package
- 946 signal pins
References
- "Alpha 21364 (EV7)", Compaq presentation
- Tsuk, M., et al. "Modeling and measurement of the Alpha 21364 package." Electrical Performance of Electronic Packaging, 2001. IEEE, 2001.
Facts about "Alpha 21364 - Microarchitectures - Compaq"
codename | Alpha 21364 + |
core count | 1 + |
designer | DEC + and Compaq + |
first launched | January 20, 2002 + |
full page name | compaq/microarchitectures/alpha 21364 + |
instance of | microarchitecture + |
instruction set architecture | Alpha + |
manufacturer | IBM + |
microarchitecture type | CPU + |
name | Alpha 21364 + |
pipeline stages | 6 + |
process | 180 nm (0.18 μm, 1.8e-4 mm) + |