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Difference between revisions of "amd/packages/sp1"
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{{amd title|Package SP1}} | {{amd title|Package SP1}} | ||
{{package | {{package | ||
| − | |name=SP1 | + | |name=Package SP1 |
|designer=AMD | |designer=AMD | ||
|market=Server | |market=Server | ||
| Line 14: | Line 14: | ||
|package dimension=27 mm | |package dimension=27 mm | ||
|package dimension 2=27 mm | |package dimension 2=27 mm | ||
| − | |package pitch=0.65 | + | |package pitch=0.65 mm |
}} | }} | ||
| − | '''SP1''' was a '''BGA-1021''' package for [[AMD]] server microprocessors codenamed {{ | + | '''Package SP1''' was a '''BGA-1021''' package for [[AMD]] server microprocessors codenamed {{amd|Seattle|l=core}} |
| + | :with 8x ARM {{armh|Cortex-A57|l=arch}} CPU cores. | ||
| + | * [[amd/List of AMD CPU sockets|List of AMD CPU sockets]] | ||
=== Features === | === Features === | ||
| Line 25: | Line 27: | ||
likely a multi-pitch minimum. --> | likely a multi-pitch minimum. --> | ||
* 1021-pin lidless micro ball grid array package, 0.65 mm pitch minimum, 27 × 27 mm, organic substrate | * 1021-pin lidless micro ball grid array package, 0.65 mm pitch minimum, 27 × 27 mm, organic substrate | ||
| − | + | * 2× 64/72 bit DDR3 SDRAM interface up to 800 MHz, PC3-12800 (DDR3-1600), 25.6 GB/s or | |
| − | * | + | * 2× 64/72 bit DDR4 SDRAM interface up to 933 MHz, PC4-14900 (DDR4-1866), 29.9 GB/s |
| − | * | ||
** Up to 4 UDIMMs, RDIMMs, or SODIMMs (2 per channel), ECC supported | ** Up to 4 UDIMMs, RDIMMs, or SODIMMs (2 per channel), ECC supported | ||
** Up to 128 GB total with RDIMMs | ** Up to 128 GB total with RDIMMs | ||
| Line 35: | Line 36: | ||
* Integrated Controller Hub | * Integrated Controller Hub | ||
| − | ** | + | ** 14× SATA 1.0, 2.0, 3.0 (6 Gb/s) |
| − | ** | + | ** 2× 10 Gigabit Ethernet |
** 1 GbE system management port | ** 1 GbE system management port | ||
** SPI, UART, I2C, GPIO | ** SPI, UART, I2C, GPIO | ||
== Processors using SP1 == | == Processors using SP1 == | ||
| − | * AMD Opteron A1100 Series | + | * [[AMD]] [[Opteron]] A1100 Series |
<!-- NOTE: | <!-- NOTE: | ||
Latest revision as of 07:48, 15 May 2025
| Edit Values | |
| Package SP1 | |
| General Info | |
| Designer | AMD |
| Introduction | January 2014 (announced) January 2016 (launched) |
| Market | Server, Embedded |
| Microarchitecture | Cortex-A57 |
| TDP | 32 W 32,000 mW 0.0429 hp 0.032 kW |
| Package | |
| Name | BGA-1021 |
| Type | Organic Micro Ball Grid Array |
| Contacts | 1021 |
| Dimension | 27 mm 2.7 cm × 27 mm1.063 in 2.7 cm 1.063 in |
| Pitch | 0.65 mm 0.0256 in |
Package SP1 was a BGA-1021 package for AMD server microprocessors codenamed Seattle
- with 8x ARM Cortex-A57 CPU cores.
Features[edit]
- 1021-pin lidless micro ball grid array package, 0.65 mm pitch minimum, 27 × 27 mm, organic substrate
- 2× 64/72 bit DDR3 SDRAM interface up to 800 MHz, PC3-12800 (DDR3-1600), 25.6 GB/s or
- 2× 64/72 bit DDR4 SDRAM interface up to 933 MHz, PC4-14900 (DDR4-1866), 29.9 GB/s
- Up to 4 UDIMMs, RDIMMs, or SODIMMs (2 per channel), ECC supported
- Up to 128 GB total with RDIMMs
- PCIe Gen 1.0, 2.0, 3.0 (8 GT/s)
- 8 lanes configurable 1x8, 2x4, 1x4 + 2x2
- Integrated Controller Hub
- 14× SATA 1.0, 2.0, 3.0 (6 Gb/s)
- 2× 10 Gigabit Ethernet
- 1 GbE system management port
- SPI, UART, I2C, GPIO
Processors using SP1[edit]
| List of all SP1-based Processors | |||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Model | Price | Process | Launched | µarch | Family | Core | C | T | Freq | Turbo | TDP | ||||||||
| Count: 0 | |||||||||||||||||||
Package Diagram[edit]
Approximate dimensions of the Seattle package, Part No. 31667. All dimensions in millimeters.
Pin Map[edit]
No data available.
References[edit]
- "Product Brief: AMD Opteron™ A1100 SOC Series", PID 158465-B, 2016
- "Hot Chips 26: The AMD Opteron™ A1100 Processor Codenamed "Seattle"", August 11, 2014
- "Introducing the AMD Opteron™ A1100 for the Datacenter", January 2016
Facts about "Package SP1 - AMD"
| designer | AMD + |
| first announced | January 2014 + |
| first launched | January 2016 + |
| instance of | package + |
| market segment | Embedded + and Server + |
| microarchitecture | Cortex-A57 + |
| name | Package SP1 + |
| package | BGA-1021 + |
| package contacts | 1,021 + |
| package length | 27 mm (2.7 cm, 1.063 in) + |
| package pitch | 0.65 mm (0.0256 in) + |
| package type | Organic Micro Ball Grid Array + |
| package width | 27 mm (2.7 cm, 1.063 in) + |
| tdp | 32 W (32,000 mW, 0.0429 hp, 0.032 kW) + |