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|manufacturer=TSMC
 
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|introduction=July 8, 1996
 
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|isa=ARMv4
 
|predecessor=ARM7
 
|predecessor=ARM7
 
|predecessor link=arm_holdings/microarchitectures/arm7
 
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|successor link=arm_holdings/microarchitectures/arm9
 
|successor link=arm_holdings/microarchitectures/arm9
 
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'''ARM8''' is the successor to the {{armh|ARM7|l=arch}}, a low-power performance [[ARM]] [[microarchitecture]] designed by [[ARM Holdings]] for the mobile market. This microarchitecture is designed as a synthesizable [[IP core]] and is sold to other semiconductor companies to be implemented in their own chips.
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[[File:arm8 roadmap.gif|thumb|right|400px|Historical roadmap leading to the ARM8.]]
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'''ARM8''' is the successor to the {{armh|ARM7|l=arch}}, a low-power performance [[ARM]] [[microarchitecture]] designed by [[ARM Holdings]] for the mobile market. This microarchitecture is designed as an [[IP core]] and is sold to other semiconductor companies to be implemented in their own chips.
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== Architecture ==
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=== Key changes from {{\\|ARM7}} ===
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* [[ARMv4]] (from [[ARMv3]])
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* 2x performance (ARM810 vs ARM710 on the same [[process node]])
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** 26% lower [[cycles per instruction|CPI]] (1.4, down from 1.9)
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* [[0.6 µm process]] (down from [[0.8 µm]])
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* 1.66x longer pipeline (5 stages, up from 3)
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== Die ==
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=== ARM810 ===
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* [[0.6 µm process]]
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* 3.3 V
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** 0.5 W
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* 3-Layer Metal CMOS
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* 53.5 mm² (not including pad ring)
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* 144 TQFP
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:[[File:arm810 die shot.png|700px]]
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== Bibliography ==
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* {{bib|hc|8|Arm}}

Latest revision as of 15:49, 15 October 2019

Edit Values
ARM8 µarch
General Info
Arch TypeCPU
DesignerARM Holdings
ManufacturerTSMC
IntroductionJuly 8, 1996
Instructions
ISAARMv4
Succession
Historical roadmap leading to the ARM8.

ARM8 is the successor to the ARM7, a low-power performance ARM microarchitecture designed by ARM Holdings for the mobile market. This microarchitecture is designed as an IP core and is sold to other semiconductor companies to be implemented in their own chips.

Architecture[edit]

Key changes from ARM7[edit]

Die[edit]

ARM810[edit]

  • 0.6 µm process
  • 3.3 V
    • 0.5 W
  • 3-Layer Metal CMOS
  • 53.5 mm² (not including pad ring)
  • 144 TQFP


arm810 die shot.png

Bibliography[edit]

  • Arm, IEEE Hot Chips 8 Symposium (HCS) 1996
codenameARM8 +
designerARM Holdings +
first launchedJuly 8, 1996 +
full page namearm holdings/microarchitectures/arm8 +
instance ofmicroarchitecture +
manufacturerTSMC +
microarchitecture typeCPU +
nameARM8 +