From WikiChip
Difference between revisions of "Template:packaging"

 
Line 8: Line 8:
 
* [[thruchip interface|TCI]]
 
* [[thruchip interface|TCI]]
 
* [[through-silicon via|TSV]]
 
* [[through-silicon via|TSV]]
 +
* [[through-glass via|TGV]]
 
* [[face-to-face|F2F]]
 
* [[face-to-face|F2F]]
 
* [[flip chip|FC]]
 
* [[flip chip|FC]]
Line 45: Line 46:
 
* [[2.5D IC]]
 
* [[2.5D IC]]
 
* [[Interposer]]
 
* [[Interposer]]
 +
* [[Embedded Interposer]]
 +
* [[Embedded Bridge]]
 
* {{tsmc|CoWoS}}
 
* {{tsmc|CoWoS}}
 
* {{intel|EMIB}}
 
* {{intel|EMIB}}

Latest revision as of 01:30, 25 December 2018

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Packaging
wc 3d stack.svg
Technologies
Concepts
Single-Row
Dual-Row
Quad-Row
Grid Array
2.5D IC
3D IC
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