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'''Kaby Lake G''' ('''KBL-G''') is the name of the core for [[Intel]]'s high-performance line of mobile processors based on the {{intel|Kaby Lake|l=arch}} microarchitecture and incorporate a discrete [[AMD]] {{amd|Vega|l=arch}} graphics processor. These chips are targeted towards ultimate mobile gaming experience. Kaby Lake G processors are fabricated on Intel's enhanced [[14 nm lithography process|14nm+ process]] and for graphics, GlobalFoundries [[14 nm process]].
 
'''Kaby Lake G''' ('''KBL-G''') is the name of the core for [[Intel]]'s high-performance line of mobile processors based on the {{intel|Kaby Lake|l=arch}} microarchitecture and incorporate a discrete [[AMD]] {{amd|Vega|l=arch}} graphics processor. These chips are targeted towards ultimate mobile gaming experience. Kaby Lake G processors are fabricated on Intel's enhanced [[14 nm lithography process|14nm+ process]] and for graphics, GlobalFoundries [[14 nm process]].
−
 
−
 
−
{{future information}}
 
−
 
  
 
== Overview ==
 
== Overview ==
−
Kaby Lake G based processors are a 2-chip solution - the [[microprocessor]] and the [[chipset]]. Those parts are [[BGA]] and are soldered onto the motherboard. The microprocessor is connected to the chipset via 4 of the chip's 20 PCIe lanes using Intel's proprietary {{intel|Direct Media Interface}} 3.0 (DMI 3.0), allowing for 8 GT/s transfer rate per lane.
+
[[File:8th gen core i7 with radeon logo (2018).png|250px|right]]
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[[File:8th gen core i5 with radeon logo (2018).png|250px|right]]
 +
{{see also|intel/microarchitectures/kaby_lake#Kaby_Lake_G|l1=Kaby Lake § Kaby Lake G}}
 +
Kaby Lake G based processors are a 2-chip solution - the [[microprocessor]] and the [[chipset]]. Those parts are [[BGA]] and are soldered onto the motherboard. The microprocessor is connected to the chipset via 4 of the chip's 20 PCIe lanes using Intel's proprietary {{intel|Direct Media Interface}} 3.0 (DMI 3.0), allowing for 8 GT/s transfer rate per lane. The microprocessor itself is identical to one used for the {{intel|Kaby Lake H|l=core}} but is now packaged along with the Radeon GPU and [[HBM 2]].
  
 
=== Graphics ===
 
=== Graphics ===
−
Those processors are unique in the fact that this is the first time Intel has integrated a discrete graphics processor into the same package as the microprocessor. This is also the first time they are using a competitor graphics processor. Those parts incorporate an [[AMD]] [[GPU]] based on the {{amd|Vega|l=arch}} microarchitecture and incorporate their own 4 GiB of [[high-bandwidth memory]] 2 (HBM2). The HBM solution is connected to the graphics processor using Intel's [[EMIB]], a high-speed in-package interconnect solution.
+
Those processors are unique in the fact that this is the first time Intel has integrated a discrete graphics processor into the same package as the microprocessor. This is also the first time they are using a competitor's graphics processor. Those parts incorporate an [[AMD]] [[GPU]] based on the {{amd|Vega|l=arch}} microarchitecture and incorporate their own 4 GiB of [[high-bandwidth memory]] 2 (HBM2). The HBM solution is connected to the graphics processor using Intel's [[EMIB]], a high-speed in-package interconnect solution.
  
 
The CPU itself is connected to the GPU using 8 of the other PCIe lanes, leaving the 8 remaining lanes for other peripherals to communicate with the CPU directly.
 
The CPU itself is connected to the GPU using 8 of the other PCIe lanes, leaving the 8 remaining lanes for other peripherals to communicate with the CPU directly.
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[[File:kaby lake g with amd radeon package.png|600px]]
 
[[File:kaby lake g with amd radeon package.png|600px]]
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=== Common Features ===
 
=== Common Features ===
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* [[quad-core]] with {{intel|Hyper-Threading}} (8 threads)
 
* [[quad-core]] with {{intel|Hyper-Threading}} (8 threads)
 
* Everything up to AVX2 (SMM, FPU, NX, MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, AES, AVX, and AVX2)
 
* Everything up to AVX2 (SMM, FPU, NX, MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, AES, AVX, and AVX2)
 +
* BGA package
 +
 +
==== Graphics ====
 +
[[File:kbl-g graphics subsystem.png|thumb|right|400px|Graphics Subsystem]]
 +
Those processors have superior graphics capabilities as well as 4 GiB of [[HBM 2]] cache.
 +
 +
* [[HBM 2]] (Intel calls "High Bandwidth Cache" or "HBC")
 +
** 4 GiB
 +
** 1,024 bit
 +
*** @ 800 MHz (204.8 GB/s peak bandwidth)
 +
*** @ 700 MHz (179.2 GB/s peak bandwidth)
 
* Graphics
 
* Graphics
 +
** 9 Display outputs available
 
** Integrated {{intel|HD Graphics 630}} ({{intel|Gen9.5|l=arch}} GT2)
 
** Integrated {{intel|HD Graphics 630}} ({{intel|Gen9.5|l=arch}} GT2)
 +
*** 3 Displays
 
*** Base frequency of 350 MHz
 
*** Base frequency of 350 MHz
 
*** Burst frequency of 1.1 GHz
 
*** Burst frequency of 1.1 GHz
 
** Discrete {{amd|Vega|l=arch}}-based GPUs
 
** Discrete {{amd|Vega|l=arch}}-based GPUs
 
*** Custom Radeon RX Vega M Graphics
 
*** Custom Radeon RX Vega M Graphics
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**** [[Radeon RX Vega M GH]] (24 CUs)
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**** 6 Displays
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**** [[Radeon RX Vega M GL]] (24 CUs)
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**** [[Radeon RX Vega M GH]]
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* BGA package
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***** 24 Compute Units
 +
***** 1,536 Stream processors, 64 pix/clk (ROPs), 96 texture units
 +
***** 3.7 TFLOPS peak performance
 +
**** [[Radeon RX Vega M GL]]
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***** 20 Compute Units
 +
***** 1,280 Stream processors, 32 pix/clk (ROPs), 80 texture units
 +
***** 2.6 TFLOPS peak performance
  
 
{{clear}}
 
{{clear}}
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-->
 
{{comp table start}}
 
{{comp table start}}
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<table class="comptable sortable tc4">
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<table class="comptable sortable tc4 tc5 tc13 tc14">
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{{comp table header|main|12:List of Kaby Lake G-based Processors}}
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{{comp table header|main|13:List of Kaby Lake G-based Processors}}
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{{comp table header|main|9:Main processor|3:Graphics Processors}}
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{{comp table header|main|8:Main processor|3:Graphics Processors|2:Features}}
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{{comp table header|cols|Price|Launched|Family|C|T|L3$|TDP|%Frequency|%Turbo|GPU|Base|iGPU Burst}}
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{{comp table header|cols|Launched|Family|C|T|L3$|TDP|%Frequency|%Turbo|GPU|Base|Burst|vPro|Locked}}
 
{{#ask: [[Category:microprocessor models by intel]] [[instance of::microprocessor]] [[core name::Kaby Lake G]]
 
{{#ask: [[Category:microprocessor models by intel]] [[instance of::microprocessor]] [[core name::Kaby Lake G]]
 
  |?full page name
 
  |?full page name
 
  |?model number
 
  |?model number
 
  |?first launched
 
  |?first launched
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|?release price
 
 
  |?microprocessor family
 
  |?microprocessor family
 
  |?core count
 
  |?core count
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  |?integrated gpu base frequency
 
  |?integrated gpu base frequency
 
  |?integrated gpu max frequency
 
  |?integrated gpu max frequency
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|?has intel vpro technology
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|?has locked clock multiplier
 
  |format=template
 
  |format=template
 
  |template=proc table 3
 
  |template=proc table 3
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  |userparam=14
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  |userparam=15:14
 
  |mainlabel=-
 
  |mainlabel=-
 
  |valuesep=,
 
  |valuesep=,

Latest revision as of 17:07, 12 July 2018

Edit Values
Kaby Lake G
kaby lake g (front).png
Package front
General Info
DesignerIntel, AMD
ManufacturerIntel, GlobalFoundries
IntroductionNovember 6, 2017 (announced)
January 7, 2018 (launched)
Microarchitecture
ISAx86-64 (x86)
MicroarchitectureKaby Lake
Word Size
8 octets
16 nibbles
64 bit
Process14 nm
0.014 μm
1.4e-5 mm
TechnologyCMOS

Kaby Lake G (KBL-G) is the name of the core for Intel's high-performance line of mobile processors based on the Kaby Lake microarchitecture and incorporate a discrete AMD Vega graphics processor. These chips are targeted towards ultimate mobile gaming experience. Kaby Lake G processors are fabricated on Intel's enhanced 14nm+ process and for graphics, GlobalFoundries 14 nm process.

Overview[edit]

8th gen core i7 with radeon logo (2018).png
8th gen core i5 with radeon logo (2018).png
See also: Kaby Lake § Kaby Lake G

Kaby Lake G based processors are a 2-chip solution - the microprocessor and the chipset. Those parts are BGA and are soldered onto the motherboard. The microprocessor is connected to the chipset via 4 of the chip's 20 PCIe lanes using Intel's proprietary Direct Media Interface 3.0 (DMI 3.0), allowing for 8 GT/s transfer rate per lane. The microprocessor itself is identical to one used for the Kaby Lake H but is now packaged along with the Radeon GPU and HBM 2.

Graphics[edit]

Those processors are unique in the fact that this is the first time Intel has integrated a discrete graphics processor into the same package as the microprocessor. This is also the first time they are using a competitor's graphics processor. Those parts incorporate an AMD GPU based on the Vega microarchitecture and incorporate their own 4 GiB of high-bandwidth memory 2 (HBM2). The HBM solution is connected to the graphics processor using Intel's EMIB, a high-speed in-package interconnect solution.

The CPU itself is connected to the GPU using 8 of the other PCIe lanes, leaving the 8 remaining lanes for other peripherals to communicate with the CPU directly.


kaby lake g with amd radeon package.png

Common Features[edit]

All Kaby Lake G processors have the following:

  • Dual-channel Memory
    • Up to DDR3L-1600, DDR4-2400
    • Up to 64 GiB
  • 8x PCIe
    • 20x in total, 4 of the 20 are used by the bus and 8 for the GPU as described above
  • quad-core with Hyper-Threading (8 threads)
  • Everything up to AVX2 (SMM, FPU, NX, MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, AES, AVX, and AVX2)
  • BGA package

Graphics[edit]

Graphics Subsystem

Those processors have superior graphics capabilities as well as 4 GiB of HBM 2 cache.

  • HBM 2 (Intel calls "High Bandwidth Cache" or "HBC")
    • 4 GiB
    • 1,024 bit
      • @ 800 MHz (204.8 GB/s peak bandwidth)
      • @ 700 MHz (179.2 GB/s peak bandwidth)
  • Graphics
    • 9 Display outputs available
    • Integrated HD Graphics 630 (Gen9.5 GT2)
      • 3 Displays
      • Base frequency of 350 MHz
      • Burst frequency of 1.1 GHz
    • Discrete Vega-based GPUs
      • Custom Radeon RX Vega M Graphics
        • 6 Displays
        • Radeon RX Vega M GH
          • 24 Compute Units
          • 1,536 Stream processors, 64 pix/clk (ROPs), 96 texture units
          • 3.7 TFLOPS peak performance
        • Radeon RX Vega M GL
          • 20 Compute Units
          • 1,280 Stream processors, 32 pix/clk (ROPs), 80 texture units
          • 2.6 TFLOPS peak performance

Kaby Lake G Processors[edit]

 List of Kaby Lake G-based Processors
 Main processorGraphics ProcessorsFeatures
ModelLaunchedFamilyCTL3$TDPFrequencyTurboGPUBaseBurstvProLocked
i5-8305G7 January 2018Core i5486 MiB
6,144 KiB
6,291,456 B
0.00586 GiB
65 W
65,000 mW
0.0872 hp
0.065 kW
2.8 GHz
2,800 MHz
2,800,000 kHz
3.8 GHz
3,800 MHz
3,800,000 kHz
HD Graphics 630, Radeon RX Vega M GL350 MHz
0.35 GHz
350,000 KHz
, 931 MHz
0.931 GHz
931,000 KHz
1,100 MHz
1.1 GHz
1,100,000 KHz
, 1,011 MHz
1.011 GHz
1,011,000 KHz
✘✔
i7-8705G7 January 2018Core i7488 MiB
8,192 KiB
8,388,608 B
0.00781 GiB
65 W
65,000 mW
0.0872 hp
0.065 kW
3.1 GHz
3,100 MHz
3,100,000 kHz
4.1 GHz
4,100 MHz
4,100,000 kHz
HD Graphics 630, Radeon RX Vega M GL350 MHz
0.35 GHz
350,000 KHz
, 931 MHz
0.931 GHz
931,000 KHz
1,100 MHz
1.1 GHz
1,100,000 KHz
, 1,011 MHz
1.011 GHz
1,011,000 KHz
✘✔
i7-8706G7 January 2018Core i7488 MiB
8,192 KiB
8,388,608 B
0.00781 GiB
65 W
65,000 mW
0.0872 hp
0.065 kW
3.1 GHz
3,100 MHz
3,100,000 kHz
4.1 GHz
4,100 MHz
4,100,000 kHz
HD Graphics 630, Radeon RX Vega M GL350 MHz
0.35 GHz
350,000 KHz
, 931 MHz
0.931 GHz
931,000 KHz
1,100 MHz
1.1 GHz
1,100,000 KHz
, 1,011 MHz
1.011 GHz
1,011,000 KHz
✔✔
i7-8809G7 January 2018Core i7488 MiB
8,192 KiB
8,388,608 B
0.00781 GiB
100 W
100,000 mW
0.134 hp
0.1 kW
3.1 GHz
3,100 MHz
3,100,000 kHz
4.2 GHz
4,200 MHz
4,200,000 kHz
HD Graphics 630, Radeon RX Vega M GH350 MHz
0.35 GHz
350,000 KHz
, 1,063 MHz
1.063 GHz
1,063,000 KHz
1,100 MHz
1.1 GHz
1,100,000 KHz
, 1,190 MHz
1.19 GHz
1,190,000 KHz
✘✘
Count: 4

See also[edit]

arrow up 1.svgPower/Performance

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Facts about "Kaby Lake G - Cores - Intel"
RDF feed
designerIntel + and AMD +
first announcedNovember 6, 2017 +
first launchedJanuary 7, 2018 +
instance ofcore +
isax86-64 +
isa familyx86 +
main imageFile:kaby lake g (front).png +
main image captionPackage front +
manufacturerIntel + and GlobalFoundries +
microarchitectureKaby Lake +
nameKaby Lake G +
process14 nm (0.014 μm, 1.4e-5 mm) +
technologyCMOS +
word size64 bit (8 octets, 16 nibbles) +