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Difference between revisions of "intel/xeon e3/e3-1245 v6"
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{{intel title|Xeon E3-1245 v6}}
 
{{intel title|Xeon E3-1245 v6}}
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{{mpu
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{{chip
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| name               = Xeon E3-1245 v6
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|name=Xeon E3-1245 v6
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| no image           = Yes
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|no image=Yes
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| image              =
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|designer=Intel
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| image size          =
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|manufacturer=Intel
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| caption            =
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|model number=E3-1245 v6
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| designer           = Intel
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|part number=BX80677E31245V6
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| manufacturer       = Intel
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|part number 2=CM8067702870932
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| model number       = E3-1245 v6
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|s-spec=SR32B
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| part number         = BX80677E31245V6
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|market=Workstation
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| part number 2       = CM8067702870932
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|market 2=Server
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| s-spec             = SR32B
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|first announced=March 28, 2017
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| market             = Workstation
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|first launched=March 28, 2017
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| market 2           = Server
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|release price=$284
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| first announced     = March 28, 2017
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|family=Xeon E3
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| first launched     = March 28, 2017
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|series=E3-1200 v6
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| last order          =
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|locked=Yes
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| last shipment      =
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|frequency=3,700 MHz
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| release price       = $284
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|turbo frequency1=4,100 MHz
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|bus type=DMI 3.0
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| family             = Xeon E3
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|bus rate=8 GT/s
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| series             = E3-1200 v6
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|clock multiplier=37
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| locked             = Yes
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|isa=x86-64
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| frequency           = 3,700 MHz
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|isa family=x86
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| turbo frequency    = Yes
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|microarch=Kaby Lake
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| turbo frequency1   = 4,100 MHz
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|platform=Greenlow
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| turbo frequency2    =
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|chipset=Sunrise Point
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| turbo frequency3    =
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|chipset 2=Union Point
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| turbo frequency4    =
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|core name=Kaby Lake DT
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| bus type           = DMI 3.0
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|core family=6
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| bus speed          =
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|core model=158
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| bus rate           = 8 GT/s
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|core stepping=B0
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| bus links          =
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|process=14 nm
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| clock multiplier   = 37
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|technology=CMOS
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| cpuid              =
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|word size=64 bit
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|core count=4
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| isa family          = x86
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|thread count=8
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| isa                 = x86-64
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|max cpus=1
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| microarch           = Kaby Lake
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|max memory=64 GiB
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| platform           = Greenlow
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|v core min=0.55 V
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| chipset             = Sunrise Point
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|v core max=1.52 V
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| chipset 2           = Union Point
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|tdp=73 W
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| core name           = Kaby Lake DT
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|tstorage min=-25 °C
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| core family         =  
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|tstorage max=125 °C
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| core model         =  
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|package module 1={{packages/intel/lga-1151}}
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| core stepping       = B0
 
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| core stepping 2    =
 
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| process             = 14 nm
 
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| transistors        =
 
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| technology         = CMOS
 
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| die area            =
 
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| die width          =
 
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| die length          =
 
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| word size           = 64 bit
 
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| core count         = 4
 
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| thread count       = 8
 
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| max cpus           = 1
 
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| max memory         = 64 GiB
 
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| v core min         = 0.55 V
 
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| v core max         = 1.52 V
 
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| sdp                =
 
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| tdp                 = 73 W
 
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| tdp typical        =
 
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| ctdp down          =
 
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| ctdp down frequency =
 
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| ctdp up            =
 
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| ctdp up frequency  =
 
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| tjunc min          =
 
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| tjunc max          =
 
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| tcase min          =
 
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| tcase max          =
 
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| tstorage min       = -25 °C
 
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| tstorage max       = 125 °C
 
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| tambient min        =
 
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| tambient max        =
 
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| package module 1   = {{packages/intel/lga-1151}}
 
 
}}
 
}}
 
'''Xeon E3-1245 v6''' is a {{arch|64}} [[quad-core]] [[x86]] workstation/entry server microprocessor introduced by [[Intel]] in early [[2017]]. This chip, which is based on the {{intel|Kaby Lake|l=arch}} microarchitecture, is fabricated on Intel's [[14 nm process|14nm+ process]]. The E3-1245 v6 operates at 3.7 GHz with a TDP of 73 W supporting a {{intel|Turbo Boost}} frequency of 4.1 GHz. The processor supports up to 64 GiB of dual-channel DDR4-2400 ECC memory and incorporates Intel's {{intel|HD Graphics P630}} [[IGP]] operating at 350 MHz with a burst frequency of 1.15 GHz.
 
'''Xeon E3-1245 v6''' is a {{arch|64}} [[quad-core]] [[x86]] workstation/entry server microprocessor introduced by [[Intel]] in early [[2017]]. This chip, which is based on the {{intel|Kaby Lake|l=arch}} microarchitecture, is fabricated on Intel's [[14 nm process|14nm+ process]]. The E3-1245 v6 operates at 3.7 GHz with a TDP of 73 W supporting a {{intel|Turbo Boost}} frequency of 4.1 GHz. The processor supports up to 64 GiB of dual-channel DDR4-2400 ECC memory and incorporates Intel's {{intel|HD Graphics P630}} [[IGP]] operating at 350 MHz with a burst frequency of 1.15 GHz.
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|avx2=Yes
 
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|avx512=No
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|abm=Yes
 
|abm=Yes
 
|tbm=No
 
|tbm=No

Latest revision as of 15:26, 13 December 2017

Edit Values
Xeon E3-1245 v6
General Info
DesignerIntel
ManufacturerIntel
Model NumberE3-1245 v6
Part NumberBX80677E31245V6,
CM8067702870932
S-SpecSR32B
MarketWorkstation, Server
IntroductionMarch 28, 2017 (announced)
March 28, 2017 (launched)
Release Price$284
ShopAmazon
General Specs
FamilyXeon E3
SeriesE3-1200 v6
LockedYes
Frequency3,700 MHz
Turbo Frequency4,100 MHz (1 core)
Bus typeDMI 3.0
Bus rate8 GT/s
Clock multiplier37
Microarchitecture
ISAx86-64 (x86)
MicroarchitectureKaby Lake
PlatformGreenlow
ChipsetSunrise Point, Union Point
Core NameKaby Lake DT
Core Family6
Core Model158
Core SteppingB0
Process14 nm
TechnologyCMOS
Word Size64 bit
Cores4
Threads8
Max Memory64 GiB
Multiprocessing
Max SMP1-Way (Uniprocessor)
Electrical
Vcore0.55 V-1.52 V
TDP73 W
Tstorage-25 °C – 125 °C
Packaging
PackageFCLGA-1151 (LGA)
FC-LGA14C		FCLGA-1151.svg
Dimension37.5 mm x 37.5 mm x 4.4 mm
Pitch0.914 mm
Contacts1151
SocketLGA-1151

Xeon E3-1245 v6 is a 64-bit quad-core x86 workstation/entry server microprocessor introduced by Intel in early 2017. This chip, which is based on the Kaby Lake microarchitecture, is fabricated on Intel's 14nm+ process. The E3-1245 v6 operates at 3.7 GHz with a TDP of 73 W supporting a Turbo Boost frequency of 4.1 GHz. The processor supports up to 64 GiB of dual-channel DDR4-2400 ECC memory and incorporates Intel's HD Graphics P630 IGP operating at 350 MHz with a burst frequency of 1.15 GHz.

Cache[edit]

Main article: Kaby Lake § Cache

[Edit/Modify Cache Info]

hierarchy icon.svg
Cache Organization
Cache is a hardware component containing a relatively small and extremely fast memory designed to speed up the performance of a CPU by preparing ahead of time the data it needs to read from a relatively slower medium such as main memory.

The organization and amount of cache can have a large impact on the performance, power consumption, die size, and consequently cost of the IC.

Cache is specified by its size, number of sets, associativity, block size, sub-block size, and fetch and write-back policies.

Note: All units are in kibibytes and mebibytes.
L1$256 KiB
262,144 B
0.25 MiB
L1I$128 KiB
131,072 B
0.125 MiB
4x32 KiB8-way set associative 
L1D$128 KiB
131,072 B
0.125 MiB
4x32 KiB8-way set associativewrite-back
L2$1 MiB
1,024 KiB
1,048,576 B
9.765625e-4 GiB
  4x256 KiB4-way set associativewrite-back
L3$8 MiB
8,192 KiB
8,388,608 B
0.00781 GiB
  4x2 MiB16-way set associativewrite-back

Memory controller[edit]

[Edit/Modify Memory Info]

ram icons.svg
Integrated Memory Controller
Max TypeDDR3L-1866, DDR4-2400
Supports ECCYes
Max Mem64 GiB
Controllers1
Channels2
Max Bandwidth35.76 GiB/s
36,618.24 MiB/s
38.397 GB/s
38,397.008 MB/s
0.0349 TiB/s
0.0384 TB/s
Bandwidth
Single 17.88 GiB/s
Double 35.76 GiB/s

Expansions[edit]

[Edit/Modify Expansions Info]

ide icon.svg
Expansion Options
PCIe
Revision3.0
Max Lanes16
Configs1x16, 2x8, 1x8+2x4


Graphics[edit]

[Edit/Modify IGP Info]

screen icon.svg
Integrated Graphics Information
GPUHD Graphics P630
DesignerIntelDevice ID0x591D
Execution Units24Max Displays3
Max Memory1.7 GiB
1,740.8 MiB
1,782,579.2 KiB
1,825,361,100.8 B
Frequency350 MHz
0.35 GHz
350,000 KHz
Burst Frequency1,150 MHz
1.15 GHz
1,150,000 KHz
OutputDP, eDP, HDMI, DVI
Max Resolution
HDMI4096x2304 @30 Hz
DP4096x2304 @60 Hz
eDP4096x2304 @60 Hz
Standards
DirectX12
OpenGL4.4
OpenCL2.0
DP1.2
eDP1.4
HDMI1.4a
Additional Features
Intel Quick Sync Video
Intel InTru 3D
Intel Clear Video
Intel Clear Video HD

Features[edit]

[Edit/Modify Supported Features]

Cog-icon-grey.svg
Supported x86 Extensions & Processor Features
MMXMMX Extension
EMMXExtended MMX Extension
SSEStreaming SIMD Extensions
SSE2Streaming SIMD Extensions 2
SSE3Streaming SIMD Extensions 3
SSSE3Supplemental SSE3
SSE4.1Streaming SIMD Extensions 4.1
SSE4.2Streaming SIMD Extensions 4.2
AVXAdvanced Vector Extensions
AVX2Advanced Vector Extensions 2
ABMAdvanced Bit Manipulation
BMI1Bit Manipulation Instruction Set 1
BMI2Bit Manipulation Instruction Set 2
FMA33-Operand Fused-Multiply-Add
AESAES Encryption Instructions
RdRandHardware RNG
ADXMulti-Precision Add-Carry
CLMULCarry-less Multiplication Extension
F16C16-bit Floating Point Conversion
x86-1616-bit x86
x86-3232-bit x86
x86-6464-bit x86
RealReal Mode
ProtectedProtected Mode
SMMSystem Management Mode
FPUIntegrated x87 FPU
NXNo-eXecute
HTHyper-Threading
TBT 2.0Turbo Boost Technology 2.0
EISTEnhanced SpeedStep Technology
SSTSpeed Shift Technology
TXTTrusted Execution Technology (SMX)
vProIntel vPro
VT-xVT-x (Virtualization)
VT-dVT-d (I/O MMU virtualization)
EPTExtended Page Tables (SLAT)
TSXTransactional Synchronization Extensions
MPXMemory Protection Extensions
SGXSoftware Guard Extensions
Secure KeySecure Key Technology
SMEPOS Guard Technology
Retrieved from "https://en.wikichip.org/w/index.php?title=intel/xeon_e3/e3-1245_v6&oldid=70944"
Facts about "Xeon E3-1245 v6 - Intel"
RDF feed
Has subobject
"Has subobject" is a predefined property representing a container construct and is provided by Semantic MediaWiki.
Xeon E3-1245 v6 - Intel#package + and Xeon E3-1245 v6 - Intel#io +
base frequency3,700 MHz (3.7 GHz, 3,700,000 kHz) +
bus rate8,000 MT/s (8 GT/s, 8,000,000 kT/s) +
bus typeDMI 3.0 +
chipsetSunrise Point + and Union Point +
clock multiplier37 +
core count4 +
core family6 +
core model158 +
core nameKaby Lake DT +
core steppingB0 +
core voltage (max)1.52 V (15.2 dV, 152 cV, 1,520 mV) +
core voltage (min)0.55 V (5.5 dV, 55 cV, 550 mV) +
designerIntel +
device id0x591D +
familyXeon E3 +
first announcedMarch 28, 2017 +
first launchedMarch 28, 2017 +
full page nameintel/xeon e3/e3-1245 v6 +
has advanced vector extensionstrue +
has advanced vector extensions 2true +
has ecc memory supporttrue +
has extended page tables supporttrue +
has featureAdvanced Vector Extensions +, Advanced Vector Extensions 2 +, Advanced Encryption Standard Instruction Set Extension +, Hyper-Threading Technology +, Turbo Boost Technology 2.0 +, Enhanced SpeedStep Technology +, Speed Shift Technology +, Trusted Execution Technology +, Intel vPro Technology +, Intel VT-x +, Intel VT-d +, Extended Page Tables +, Transactional Synchronization Extensions +, Memory Protection Extensions +, Software Guard Extensions +, Secure Key Technology + and OS Guard +
has intel enhanced speedstep technologytrue +
has intel secure key technologytrue +
has intel speed shift technologytrue +
has intel supervisor mode execution protectiontrue +
has intel trusted execution technologytrue +
has intel turbo boost technology 2 0true +
has intel vpro technologytrue +
has intel vt-d technologytrue +
has intel vt-x technologytrue +
has locked clock multipliertrue +
has second level address translation supporttrue +
has simultaneous multithreadingtrue +
has transactional synchronization extensionstrue +
has x86 advanced encryption standard instruction set extensiontrue +
instance ofmicroprocessor +
integrated gpuHD Graphics P630 +
integrated gpu base frequency350 MHz (0.35 GHz, 350,000 KHz) +
integrated gpu designerIntel +
integrated gpu execution units24 +
integrated gpu max frequency1,150 MHz (1.15 GHz, 1,150,000 KHz) +
integrated gpu max memory1,740.8 MiB (1,782,579.2 KiB, 1,825,361,100.8 B, 1.7 GiB) +
isax86-64 +
isa familyx86 +
l1$ size256 KiB (262,144 B, 0.25 MiB) +
l1d$ description8-way set associative +
l1d$ size128 KiB (131,072 B, 0.125 MiB) +
l1i$ description8-way set associative +
l1i$ size128 KiB (131,072 B, 0.125 MiB) +
l2$ description4-way set associative +
l2$ size1 MiB (1,024 KiB, 1,048,576 B, 9.765625e-4 GiB) +
l3$ description16-way set associative +
l3$ size8 MiB (8,192 KiB, 8,388,608 B, 0.00781 GiB) +
ldateMarch 28, 2017 +
manufacturerIntel +
market segmentWorkstation + and Server +
max cpu count1 +
max memory65,536 MiB (67,108,864 KiB, 68,719,476,736 B, 64 GiB, 0.0625 TiB) +
max memory bandwidth35.76 GiB/s (36,618.24 MiB/s, 38.397 GB/s, 38,397.008 MB/s, 0.0349 TiB/s, 0.0384 TB/s) +
max memory channels2 +
max pcie lanes16 +
max storage temperature398.15 K (125 °C, 257 °F, 716.67 °R) +
microarchitectureKaby Lake +
min storage temperature248.15 K (-25 °C, -13 °F, 446.67 °R) +
model numberE3-1245 v6 +
nameXeon E3-1245 v6 +
packageFCLGA-1151 +
part numberBX80677E31245V6 + and CM8067702870932 +
platformGreenlow +
process14 nm (0.014 μm, 1.4e-5 mm) +
release price$ 284.00 (€ 255.60, £ 230.04, ¥ 29,345.72) +
s-specSR32B +
seriesE3-1200 v6 +
smp max ways1 +
socketLGA-1151 +
supported memory typeDDR3L-1866 + and DDR4-2400 +
tdp73 W (73,000 mW, 0.0979 hp, 0.073 kW) +
technologyCMOS +
thread count8 +
turbo frequency (1 core)4,100 MHz (4.1 GHz, 4,100,000 kHz) +
word size64 bit (8 octets, 16 nibbles) +
x86/has memory protection extensionstrue +
x86/has software guard extensionstrue +