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Difference between revisions of "arm holdings/microarchitectures/arm8"
< arm holdings

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|name=ARM8
 
|name=ARM8
 
|designer=ARM Holdings
 
|designer=ARM Holdings
|manufacturer=VLSI Technology
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|manufacturer=TSMC
|manufacturer 2=TSMC
 
 
|introduction=July 8, 1996
 
|introduction=July 8, 1996
 
|predecessor=ARM7
 
|predecessor=ARM7
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|successor link=arm_holdings/microarchitectures/arm9
 
|successor link=arm_holdings/microarchitectures/arm9
 
}}
 
}}
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[[File:arm8 roadmap.gif|thumb|right|400px|Historical roadmap leading to the ARM8.]]
 
'''ARM8''' is the successor to the {{armh|ARM7|l=arch}}, a low-power performance [[ARM]] [[microarchitecture]] designed by [[ARM Holdings]] for the mobile market. This microarchitecture is designed as an [[IP core]] and is sold to other semiconductor companies to be implemented in their own chips.
 
'''ARM8''' is the successor to the {{armh|ARM7|l=arch}}, a low-power performance [[ARM]] [[microarchitecture]] designed by [[ARM Holdings]] for the mobile market. This microarchitecture is designed as an [[IP core]] and is sold to other semiconductor companies to be implemented in their own chips.
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== Architecture ==
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=== Key changes from {{\\|ARM7}} ===
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* 2x performance (ARM810 vs ARM710 on the same [[process node]])
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** 26% lower [[cycles per instruction|CPI]] (1.4, down from 1.9)
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* [[0.6 µm process]] (down from [[0.8 µm]])
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* 1.66x longer pipeline (5 stages, up from 3)
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== Die ==
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=== ARM810 ===
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* [[0.6 µm process]]
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* 3.3 V
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** 0.5 W
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* 3-Layer Metal CMOS
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* 53.5 mm² (not including pad ring)
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* 144 TQFP
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== Bibliography ==
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* {{hcbib|8}}

Revision as of 22:30, 29 December 2018

Edit Values
ARM8 µarch
General Info
Arch TypeCPU
DesignerARM Holdings
ManufacturerTSMC
IntroductionJuly 8, 1996
Succession
Historical roadmap leading to the ARM8.

ARM8 is the successor to the ARM7, a low-power performance ARM microarchitecture designed by ARM Holdings for the mobile market. This microarchitecture is designed as an IP core and is sold to other semiconductor companies to be implemented in their own chips.

Architecture

Key changes from ARM7

Die

ARM810

  • 0.6 µm process
  • 3.3 V
    • 0.5 W
  • 3-Layer Metal CMOS
  • 53.5 mm² (not including pad ring)
  • 144 TQFP

Bibliography

codenameARM8 +
designerARM Holdings +
first launchedJuly 8, 1996 +
full page namearm holdings/microarchitectures/arm8 +
instance ofmicroarchitecture +
manufacturerTSMC +
microarchitecture typeCPU +
nameARM8 +