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Difference between revisions of "thruchip interface"

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{{title|ThruChip Interface (TCI)}}{{3d integration}}
 
{{title|ThruChip Interface (TCI)}}{{3d integration}}
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'''ThruChip Interface''' ('''TCI''') is a high-performance [[wireless communication|wireless]] [[vertical signaling|vertical]] [[interconnect]] technology used to transmit signals across multiple [[stacked dies]]. TCI is an alternative technology to [[through-silicon via]].
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'''ThruChip Interface''' ('''TCI''') is a high-performance [[wireless communication|wireless]] [[vertical signaling|vertical]] [[interconnect]] technology used to transmit signals between multiple [[stacked dies]]. TCI is an alternative technology to [[through-silicon via]].

Revision as of 15:24, 21 April 2018

Template:3d integration ThruChip Interface (TCI) is a high-performance wireless vertical interconnect technology used to transmit signals between multiple stacked dies. TCI is an alternative technology to through-silicon via.

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