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Difference between revisions of "Template:wafer tech"
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* Silicon | * Silicon | ||
** [[metallurgical-grade silicon|Metallurgical-grade silicon]] (MGS) | ** [[metallurgical-grade silicon|Metallurgical-grade silicon]] (MGS) | ||
+ | ** [[upgraded metallurgical-grade silicon|Upgraded MGS]] (UMGS) | ||
** [[electronic-grade silicon|Electronic-grade silicon]] (EGS) | ** [[electronic-grade silicon|Electronic-grade silicon]] (EGS) | ||
* Crystal Growth | * Crystal Growth | ||
** [[czochralski growth|Czochralski growth]] (CZ) | ** [[czochralski growth|Czochralski growth]] (CZ) | ||
** [[float-zone growth|Float-zone growth]] (FZ) | ** [[float-zone growth|Float-zone growth]] (FZ) | ||
− | </div> | + | * Preparation |
− | {{Navbar|Template:wafer tech|text=|mini=1|style=float:right;}} | + | ** [[ingot cropping|Ingot cropping]] |
+ | ** [[ingot squaring|Ingot squaring]] | ||
+ | ** [[rod grinding|Rod grinding]] | ||
+ | <div class="header">Wafer Processing</div> | ||
+ | * Slicing | ||
+ | ** [[wire sawing|Wire sawing]] | ||
+ | ** [[internal diameter sawing|Internal diameter sawing]] (IDs) | ||
+ | * Profile control | ||
+ | ** [[wafer edge profiling|Wafer edge profiling]] | ||
+ | ** [[wafer lapping|Wafer lapping]] | ||
+ | ** [[wafer etching|Wafer etching]] | ||
+ | ** [[wafer polishing|Wafer polishing]] | ||
+ | * Additional layers | ||
+ | ** [[epitaxial deposition|Epitaxial deposition]] | ||
+ | *** [[epitaxial wafer|Epitaxial wafer]] | ||
+ | ** [[layer transfer|Layer transfer]] (LT) | ||
+ | *** [[soi wafer|SOI wafer]] | ||
+ | * Preparation | ||
+ | ** [[wafer inspection|Wafer inspection]] | ||
+ | ** [[wafer packaging|Wafer packaging]] | ||
+ | ** [[wafer shipping|Wafer shipping]] | ||
+ | </div>{{Navbar|Template:wafer tech|text=|mini=1|style=float:right;}} | ||
</div> | </div> | ||
<noinclude> | <noinclude> |
Latest revision as of 11:09, 5 March 2018
Ingot Production
- Silicon
- Metallurgical-grade silicon (MGS)
- Upgraded MGS (UMGS)
- Electronic-grade silicon (EGS)
- Crystal Growth
- Czochralski growth (CZ)
- Float-zone growth (FZ)
- Preparation
Wafer Processing
- Slicing
- Profile control
- Additional layers
- Preparation