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| − | In '''2017:'''
| + | Too much hurricanes and controversies this year! |
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| − | * January 3: Intel introduces their mainstream processors based on {{intel|Kaby Lake|l=arch}}, including {{intel|Core i3|i3}}, {{intel|Core i5|i5}}, and {{intel|Core i7|i7}} models.
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| − | * January 4-8: CES 2017
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| − | * January 4: [[NXP]] launched the {{nxp|i.MX 8M}} family of processors capable of full [[4K]] UltraHD for Audio, Voice and Video Interactions
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| − | * February 2: [[Amkor Technology]] acquires [[NANIUM]] for undisclosed sum.
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| − | * February 5-9: IEEE international Solid-State Circuits Conference (ISSCC) 2017
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| − | * February 8: Intel announced a $7B investment in Fab 42 which will be used to manufacture chips on a [[7 nm process]]
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| − | * February 22: [[AMD]] announces the {{amd|Ryzen 7}} processor family for high-end performance [[x86]] based on {{amd|Zen|l=arch}}
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| − | * February 28: [[Xiaomi]] launches the {{xiaomi|Surge}} family of in-house developed ARM processors
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| − | * March 2: [[AMD]] launches the {{amd|Ryzen 7}} family
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| − | * March 1-3: GDC 2017 Expro
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| − | * March 13: [[Intel]] acquires [[Mobileye]] for $15.3 billion.
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| − | * March 13: [[TSMC]] Technology Symposium
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| − | * March 28: Intel Technology and Manufacturing Day
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| − | * March 28: Intel introduces their [[10 nm process]] featuring the highest density transistor at the time
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| − | * March 28: Intel announces a new [[22 nm process]] "22FFL" for IOT and Mobile
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| − | * April 4: [[Fujitsu]] introduces the {{fujitsu|SPARC64 XII}} and announces commitment to future SPARC development
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| − | * April 6: Beijing Shanhai Capital completed the acquisition of [[Analogix Semiconductor]] for $500M
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| − | * April 19-21: COOLChips XX
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| − | * May 4: Intel introduces the {{intel|Xeon Bronze}} {{intel|Xeon Silver}}, {{intel|Xeon Gold}}, {{intel|Xeon Platinum}} server families
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| − | * May 15-18: Advanced Semiconductor Manufacturing Conference (ASMC) 2017
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| − | * May 16: AMD introduces the {{amd|EPYC}} server family
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| − | * May 29: ARM introduces the {{armh|Cortex-A55|l=arch}} and {{armh|Cortex-A75|l=arch}} cores, first {{arm|ARMv8.2}} implementations
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| − | * May 30-3: Computex Taipei 2017
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| − | ** May 30: Intel introduces {{intel|Skylake X|l=core}}
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| − | ** May 30: Intel introduces the {{intel|Core i9}} family of extreme-performance desktop processors
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| − | * June 5-9: VLSI Symposium
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| − | ** June 6: [[IBM]] announces a breakthrough in the mass manufacturing of [[gate-all-around|GAA FET]]-based [[5 nm process]]
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| − | * June 20: [[SPEC]] released the [[SPEC CPU2017]] benchmark suite.
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| − | * August 22-26: Gamescom 2017
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| − | * July 11: Intel introduces {{intel|Skylake SP|l=core}} along with the {{intel|Ultra Path Interconnect}} (UPI) with supersedes {{intel|QPI}}
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| − | * July 17: [[IBM]] introduces the {{ibm|z14}} microprocessor
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| − | * August 10: AMD introduces {{amd|Threadripper}}, a family of enthusiasts-class [[x86]] microprocessors
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| − | * August 20: Day 1: Hot Chips 29 - Hot Chips: A Symposium on High Performance Chips
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| − | * August 21:
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| − | ** Day 2: HotChips 29
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| − | *** [[Microsoft]] introduces Xbox One X {{microsoft|Scorpio Engine}}
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| − | *** AMD introduces their {{amd|Vega|l=arch}} GPU microarchitecture
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| − | *** NVIDIA showcases {{nvidia|Volta|l=arch}} GPU microarchitecture
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| − | *** SiFive introduces the industry first RISC-V chip
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| − | *** Renesas showcases {{renesas|R-Car}} Gen3
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| − | *** Intel introduces the {{intel|Knights Mill|l=arch}} microarchitecture for {{intel|Xeon Phi}}
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| − | *** ThinCI introduces their Graph Streaming Processor (GSP)
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| − | * August 21: Intel introduces {{intel|Kaby Lake R|Kaby Lake Refresh|l=core}}, doubling the core count of many mainstream mobile processors.
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| − | * August 22:
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| − | ** Day 3: HotChips 29
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| − | *** Intel showcases the {{intel|Stratix 10}} FPGA
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| − | *** ARM showcases the {{arm|DynamIQ}} architecture
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| − | *** IBM showcases the {{ibm|z14|l=arch}} microarchitecture
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| − | *** AMD showcases {{amd|EPYC}} server processors
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| − | *** Intel showcases Xeon Scalable Family ({{intel|Skylake-SP|l=core}}) server processors
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| − | *** Qualcomm introduces the {{qualcomm|Centriq}} server processor family and the {{qualcomm|Falkor|l=arch}} microarchitecture
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| − | * August 29: Intel introduces the {{intel|Xeon W}} family, a family of business-class workstation processors
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| − | * September 18: [[Oracle]] introduces the {{oracle|SPARC M8}} microprocessor.
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| − | * September 21: [[Imagination Technologies]] introduces the {{imgtec|PowerVR}} 9XE and 9XM GPUs and 2NX NNA (a Neural Network Accelerator)
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| − | * September 22: [[Imagination Technologies|Imagination]] is acquired by China-backed Canyon Bridge for £550m in an all-cash transaction
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| − | * September 22: Imagination's US-based [[MIPS]] unit is sold to Tallwood Venture Capital for $65M
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| − | * September 24: Intel introduces {{intel|Coffee Lake|l=arch}}, including their first mainstream [[hexa-core]] processors
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| − | * September 18-20: Third International High Performance Computing Forum by National Supercomputer Center in Guangzhou (NSCC-GZ)
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| − | ** NUDT's {{nudt|Matrix-2000}} many-core processor detailed
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| − | * October 17: Intel announced {{intel|Nervana NNP}} will start shipping
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| − | * October 17: Google details their {{google|Pixel Visual Core}} coprocessor found in their Pixel 2 phones
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| − | * October 26: AMD introduces mobile Ryzen processors based on the {{amd|Zen|l=arch}} and {{amd|Vega|l=arch}}
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| − | * December 2-6: IEEE IEDM 2017
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| − | | |
| − | == Microprocessors released in 2017 ==
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| − | {{#ask:
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| − | [[Category:all microprocessor models]]
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| − | [[ldate::>January 1 2017]]
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| − | [[ldate::<<January 1 2018]]
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| − | |?ldate
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| − | |?model number
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| − | |format=calendar
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| − | }}
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